Charles Y Chen

US Patent:

6500567, Dec 31, 2002

Filed:

Oct 3, 2000

Appl. No.:

09/677644

Inventors:

Gerardo Bertero - Redwood City CA
Charles Changqing Chen - Milpitas CA
Tu Chen - Monte Sereno CA
Tsutomu Yamashita - San Jose CA
Makoto Imakawa - Sendai, JP
Michinobu Suekane - Hino, JP

Assignee:

Komag, Inc. - San Jose CA

International Classification:

G11B 566

US Classification:

428667, 428332, 428336, 428694 TS, 428694 TM, 427128, 427129, 427130, 427131, 2041922

Abstract:

In this invention, an ultra thin layer of CoCr alloy nucleation layer is sputtered at an extremely low deposition rate above a predominantly (200) oriented Cr film followed by a CoCrPt based alloy sputtered film at higher rates and moderate temperatures. This structure creates a media which has very high Hc, and excellent PW50, low noise and excellent low TNLD values. By using this technique, the CoCrPt magnetic film achieves excellent in-plane crystallographic orientation, and high Hc is achieved with minimal amount of Pt addition to the magnetic film. The method allows very fine grain structure of cobalt to be formed which contributes to good signal to noise ratio. A fine grain structure combined with chromium segregation between the grains improve the signal to noise ratio even more. A high degree of in-plane c-axis orientation is achieved in the cobalt layer which provides very high hysteresis loop squareness which helps to improve the OW and TNLD. The perfection of the grains is very high so that high anisotropy is obtained in the magnetic layer, resulting in high Hc without the necessity of addition of high level of Pt.

US Patent:

6618130, Sep 9, 2003

Filed:

Aug 28, 2001

Appl. No.:

09/941109

Inventors:

Charles Chen - Sunnyvale CA

Assignee:

SpeedFam-IPEC Corporation - Chandler AZ

International Classification:

G01N 2100

US Classification:

356 73, 356445

Abstract:

A method for detecting during a planarization process the removal of a first layer of material overlying a workpiece is provided. Relative motion is effected between the first layer and a working surface to remove the first layer. A light having a spectrum of wavelengths is transmitted to the workpiece. The intensity for each of a plurality of reflected wavelengths of a reflected light reflected from the workpiece is measured to obtain a spectrum. The spectrum is a function of the plurality of reflective wavelengths. A spectrum reference value is calculated and a plurality of spectrum difference values are calculated by subtracting the spectrum reference value from the spectrum. An absolute value for each of the plurality of spectrum difference values that is a function of one of the plurality of reflected wavelengths that falls within a selected range of wavelengths is summed together to obtain a delta value. An endpoint parameter is calculated from the delta value.

US Patent:

6730420, May 4, 2004

Filed:

Oct 31, 2000

Appl. No.:

09/703607

Inventors:

Gerardo Bertero - Redwood City CA
Tu Chen - Monte Sereno CA
Charles Chen - Milpitas CA
Wei Cao - Milpitas CA

Assignee:

Komag, Inc. - San Jose CA

International Classification:

G11B 566

US Classification:

428694TS, 428694 TM, 428900, 428216, 428336, 427131, 427132

Abstract:

A magnetic medium having at least two intermediate layers between an underlayer and a magnetic layer. The first intermediate layer is designed to provide a good lattice match to the underlayer, while the second intermediate layer is designed to provide a good lattice match to the magnetic layer. Typically, the underlayer has one structure, such as body centered cube, while the magnetic layer has a second structure such as hexagonal close pack. In preferred embodiments, the transition from the one structure to the other structure occurs in the intermediate layers. For example, the first intermediate layer may be a hexagonal close pack structure. Because of the mismatch between the underlayer and the first layer, there may be crystal defects in this first intermediate layer. However, any remaining stress and mismatch is absorbed through the second layer, so that the second layer presents a substantially defect-free surface on which the magnetic layer may grow. Because the second layer is closely matched to the magnetic layer, the magnetic layer continues to grow in a defect-free fashion.

US Patent:

6866559, Mar 15, 2005

Filed:

Feb 4, 2003

Appl. No.:

10/358107

Inventors:

Kurt Lehman - Menlo Park CA, US
Charles Chen - Sunnyvale CA, US
Ronald L. Allen - San Jose CA, US
Robert Shinagawa - Cupertino CA, US
Anantha Sethuraman - Palo Alto CA, US
Christopher F. Bevis - Los Gatos CA, US
Thanassis Trikas - Redwood City CA, US
Haiguang Chen - Millbrae CA, US
Ching Ling Meng - Fremont CA, US

Assignee:

KLA-Tencor Technologies - Milpitas CA

International Classification:

B24B049/12

US Classification:

451 8, 451 6, 451 41

Abstract:

Windows configurable to be coupled to a process tool or to be disposed within an opening in a polishing pad are provided. One window includes a first portion and a second portion. The first portion includes a first material, and the second portion includes a second material different than the first. Another window includes a substantially transparent gel. In some instances, the gel includes a triblock copolymer and a plasticizing oil. An additional window includes an upper window, a housing, and a diaphragm. The housing may allow a fluid to flow into and out of a space between the housing and the diaphragm. In another embodiment, a window includes a layer of material coupled to lateral surfaces of the window. In some cases, the window may be disposed within an opening in a polishing pad, and movement of the window within the polishing pad may compress the layer of material.

US Patent:

6878460, Apr 12, 2005

Filed:

Mar 26, 2003

Appl. No.:

10/396365

Inventors:

Abebe Hailu - San Jose CA, US
Charles Changqing Chen - Milpitas CA, US
Taesun Ernest Kim - San Jose CA, US

Assignee:

Seagate Technology LLC - Scotts Valley CA

International Classification:

G11B005/64

US Classification:

428611, 428686, 428694 TS, 428694 TM

Abstract:

A thin film magnetic according medium with enhanced coercivity is provided. The magnetic recording medium comprises a non-magnetic substrate having a surface and a layer stack atop the substrate surface. The layer stack comprises a magnetic recording layer and a dual intermediate layer structure below the magnetic recording layer comprising a base layer and a non-magnetic layer between the base layer and the magnetic recording layer. The non-magnetic layer has a thickness less than that necessary for RKKY coupling between the base layer and the magnetic recording layer, and provides the medium with increased coercivity.

US Patent:

6884146, Apr 26, 2005

Filed:

Feb 4, 2003

Appl. No.:

10/358105

Inventors:

Kurt Lehman - Menlo Park CA, US
Charles Chen - Sunnyvale CA, US
Ronald L. Allen - San Jose CA, US
Robert Shinagawa - Cupertino CA, US
Anantha Sethuraman - Palo Alto CA, US
Christopher F. Bevis - Los Gatos CA, US
Thanassis Trikas - Redwood City CA, US
Haiguang Chen - Millbrae CA, US
Ching Ling Meng - Fremont CA, US

Assignee:

KLA-Tencor Technologies Corp. - Milpitas CA

International Classification:

B24D049/00

US Classification:

451 5, 451 6, 451 8, 451 9, 451 41, 451285, 451286, 451287, 451288, 438 14, 438 15, 438 16, 438 17

Abstract:

Systems and methods for characterizing a polishing process are provided. One method includes scanning a specimen with two or more measurement devices during polishing. In one embodiment, the two or more measurement devices may include a reflectometer and a capacitance probe. In another embodiment, the two or more measurement devices may include an optical device and an eddy current device. An additional embodiment relates to a measurement device for scanning a specimen during polishing. The device includes a light source and a scanning assembly. The scanning assembly is configured to scan light from the light source across the specimen during polishing. Another measurement device includes a laser light source coupled to a first fiber optic bundle and a detector coupled to a second fiber optic bundle. An additional method includes scanning a specimen with different measurement devices during different steps of a polishing process.

US Patent:

6935922, Aug 30, 2005

Filed:

Feb 4, 2003

Appl. No.:

10/358106

Inventors:

Kurt Lehman - Menlo Park CA, US
Charles Chen - Sunnyvale CA, US
Ronald L. Allen - San Jose CA, US
Robert Shinagawa - Cupertino CA, US
Anantha Sethuraman - Palo Alto CA, US
Christopher F. Bevis - Los Gatos CA, US
Thanassis Trikas - Redwood City CA, US
Haiguang Chen - Millbrae CA, US
Ching Ling Meng - Fremont CA, US

Assignee:

KLA-Tencor Technologies Corp. - Milpitas CA

International Classification:

B24D049/00

US Classification:

451 5, 451 6, 451 8, 451 9, 451 41, 451285, 451286, 451287, 451288, 438 14, 438 15, 438 16, 438 17

Abstract:

Methods and systems for generating a two-dimensional map of a characteristic at relative or absolute locations of measurement spots on a specimen during polishing are provided. One method includes scanning a specimen with a measurement device during polishing to generate output signals at measurement spots on the specimen. The method may also include determining a characteristic of polishing at the measurement spots from the output signals. In addition, the method may include determining relative or absolute locations of the measurement spots on the specimen. The method may further include generating a two-dimensional map of the characteristic at the relative or absolute locations of the measurement spots on the specimen. In some embodiments, the relative locations of the measurement spots may be determined from a representative scan path of the measurement device and an average spacing between starting points on individual scans.

US Patent:

7030018, Apr 18, 2006

Filed:

Feb 4, 2003

Appl. No.:

10/358101

Inventors:

Kurt Lehman - Menlo Park CA, US
Charles Chen - Sunnyvale CA, US
Ronald L. Allen - San Jose CA, US
Robert Shinagawa - Cupertino CA, US
Anantha Sethuraman - Palo Alto CA, US
Christopher F. Bevis - Los Gatos CA, US
Thanassis Trikas - Redwood City CA, US
Haiguang Chen - Millbrae CA, US
Ching Ling Meng - Fremont CA, US

Assignee:

KLA-Tencor Technologies Corp. - Milpitas CA

International Classification:

H01L 21/302

US Classification:

438692, 438 8, 438689

Abstract:

Methods and systems for monitoring a parameter of a measurement device during polishing, damage to a specimen during polishing, a characteristic of a polishing pad, or a characteristic of a polishing tool are provided. One method includes scanning a specimen with a measurement device during polishing of a specimen to generate output signals at measurement spots on the specimen. The method also includes determining if the output signals are outside of a range of output signals. Output signals outside of the range may indicate that a parameter of the measurement device is out of control limits. In a different embodiment, output signals outside of the range may indicate damage to the specimen. Another method includes scanning a polishing pad with a measurement device to generate output signals at measurement spots on the polishing pad. The method also includes determining a characteristic of the polishing pad from the output signals.