Charles R Griggs

US Patent:

20220293876, Sep 15, 2022

Filed:

May 31, 2022

Appl. No.:

17/804715

Inventors:

- Cupertino CA, US
Kapil V. Sakariya - Los Altos CA, US
Charles R. Griggs - San Jose CA, US
James Michael Perkins - Mountain View CA, US

International Classification:

H01L 51/50
H01L 27/15
G09G 3/00
H01L 23/00
H01L 21/683
H01L 27/32

Abstract:

A display panel and method of manufacture are described. In an embodiment, a display substrate includes a pixel area and a non-pixel area. An array of subpixels and corresponding array of bottom electrodes are in the pixel area. An array of micro LED devices are bonded to the array of bottom electrodes. One or more top electrode layers are formed in electrical contact with the array of micro LED devices. In one embodiment a redundant pair of micro LED devices are bonded to the array of bottom electrodes. In one embodiment, the array of micro LED devices are imaged to detect irregularities.

US Patent:

20210313305, Oct 7, 2021

Filed:

Apr 8, 2021

Appl. No.:

17/225731

Inventors:

- Cupertino CA, US
Charles R. Griggs - San Jose CA, US

International Classification:

H01L 25/16
H01L 33/44
H01L 33/08
H01L 33/52
H01L 33/60
H01L 27/02
H01L 23/00
H01L 25/075
H01L 27/12
H01L 33/20
H01L 33/48
H01L 33/06
H01L 33/30
H01L 33/62
H01L 33/00
H01L 33/54
H01L 33/56

Abstract:

Light emitting devices and methods of integrating micro LED devices into light emitting device are described. In an embodiment a light emitting device includes a reflective bank structure within a bank layer, and a conductive line atop the bank layer and elevated above the reflective bank structure. A micro LED device is within the reflective bank structure and a passivation layer is over the bank layer and laterally around the micro LED device within the reflective bank structure. A portion of the micro LED device and a conductive line atop the bank layer protrude above a top surface of the passivation layer.

US Patent:

20210257572, Aug 19, 2021

Filed:

Feb 26, 2021

Appl. No.:

17/186362

Inventors:

- Cupertino CA, US
Kapil V. Sakariya - Los Altos CA, US
Charles R. Griggs - San Jose CA, US
James Michael Perkins - Mountain View CA, US

International Classification:

H01L 51/50
H01L 27/15
G09G 3/00
H01L 23/00
H01L 21/683

Abstract:

A display panel and method of manufacture are described. In an embodiment, a display substrate includes a pixel area and a non-pixel area. An array of subpixels and corresponding array of bottom electrodes are in the pixel area. An array of micro LED devices are bonded to the array of bottom electrodes. One or more top electrode layers are formed in electrical contact with the array of micro LED devices. In one embodiment a redundant pair of micro LED devices are bonded to the array of bottom electrodes. In one embodiment, the array of micro LED devices are imaged to detect irregularities.

US Patent:

20200219863, Jul 9, 2020

Filed:

Jan 21, 2020

Appl. No.:

16/748413

Inventors:

- Cupertino CA, US
Charles R. Griggs - San Jose CA, US

International Classification:

H01L 25/16
H01L 33/44
H01L 33/08
H01L 33/52
H01L 33/60
H01L 27/02
H01L 23/00
H01L 25/075
H01L 27/12
H01L 33/20
H01L 33/48
H01L 33/06
H01L 33/30
H01L 33/62
H01L 33/00
H01L 33/54
H01L 33/56

Abstract:

Light emitting devices and methods of integrating micro LED devices into light emitting device are described. In an embodiment a light emitting device includes a reflective bank structure within a bank layer, and a conductive line atop the bank layer and elevated above the reflective bank structure. A micro LED device is within the reflective bank structure and a passivation layer is over the bank layer and laterally around the micro LED device within the reflective bank structure. A portion of the micro LED device and a conductive line atop the bank layer protrude above a top surface of the passivation layer.

US Patent:

20200013975, Jan 9, 2020

Filed:

Aug 1, 2019

Appl. No.:

16/529670

Inventors:

- Cupertino CA, US
Kapil V. Sakariya - Los Altos CA, US
Charles R. Griggs - San Jose CA, US
James Michael Perkins - Mountain View CA, US

International Classification:

H01L 51/50
H01L 23/00
H01L 21/683
G09G 3/00
H01L 27/15

Abstract:

A display panel and method of manufacture are described. In an embodiment, a display substrate includes a pixel area and a non-pixel area. An array of subpixels and corresponding array of bottom electrodes are in the pixel area. An array of micro LED devices are bonded to the array of bottom electrodes. One or more top electrode layers are formed in electrical contact with the array of micro LED devices. In one embodiment a redundant pair of micro LED devices are bonded to the array of bottom electrodes. In one embodiment, the array of micro LED devices are imaged to detect irregularities.

US Patent:

20190259739, Aug 22, 2019

Filed:

Feb 25, 2019

Appl. No.:

16/284125

Inventors:

- Cupertino CA, US
Charles R. Griggs - San Jose CA, US

International Classification:

H01L 25/16
H01L 33/60
H01L 27/02
H01L 33/08
H01L 33/44
H01L 33/52
H01L 33/48
H01L 33/20
H01L 27/12
H01L 25/075
H01L 23/00
H01L 33/00
H01L 33/54
H01L 33/56
H01L 33/62
H01L 33/30
H01L 33/06

Abstract:

Light emitting devices and methods of integrating micro LED devices into light emitting device are described. In an embodiment a light emitting device includes a reflective bank structure within a bank layer, and a conductive line atop the bank layer and elevated above the reflective bank structure. A micro LED device is within the reflective bank structure and a passivation layer is over the bank layer and laterally around the micro LED device within the reflective bank structure. A portion of the micro LED device and a conductive line atop the bank layer protrude above a top surface of the passivation layer.

US Patent:

20180182746, Jun 28, 2018

Filed:

Dec 21, 2017

Appl. No.:

15/850862

Inventors:

- Cupertino CA, US
Charles R. Griggs - San Jose CA, US

International Classification:

H01L 25/16
H01L 33/48
H01L 25/075
H01L 27/12
H01L 33/00
H01L 33/62
H01L 33/60
H01L 33/56
H01L 33/54
H01L 33/52
H01L 23/00
H01L 33/44
H01L 33/30
H01L 33/20
H01L 33/08
H01L 33/06

Abstract:

Light emitting devices and methods of integrating micro LED devices into light emitting device are described. In an embodiment a light emitting device includes a reflective bank structure within a bank layer, and a conductive line atop the bank layer and elevated above the reflective bank structure. A micro LED device is within the reflective bank structure and a passivation layer is over the bank layer and laterally around the micro LED device within the reflective bank structure. A portion of the micro LED device and a conductive line atop the bank layer protrude above a top surface of the passivation layer.

US Patent:

20180102492, Apr 12, 2018

Filed:

Nov 30, 2017

Appl. No.:

15/828069

Inventors:

- Cupertino CA, US
Kapil V. Sakariya - Los Altos CA, US
Charles R. Griggs - San Jose CA, US
James Michael Perkins - Mountain View CA, US

International Classification:

H01L 51/50
H01L 27/15
H01L 23/00
G09G 3/00
H01L 21/683
H01L 27/12

Abstract:

A display panel and method of manufacture are described. In an embodiment, a display substrate includes a pixel area and a non-pixel area. An array of subpixels and corresponding array of bottom electrodes are in the pixel area. An array of micro LED devices are bonded to the array of bottom electrodes. One or more top electrode layers are formed in electrical contact with the array of micro LED devices. In one embodiment a redundant pair of micro LED devices are bonded to the array of bottom electrodes. In one embodiment, the array of micro LED devices are imaged to detect irregularities.