Charles W Hawkins

US Patent:

6546513, Apr 8, 2003

Filed:

Jun 2, 2000

Appl. No.:

09/586572

Inventors:

Richard Jacob Wilcox - Austin TX
Jason D. Mulig - Austin TX
David Eppes - Austin TX
Michael R. Bruce - Austin TX
Victoria J. Bruce - Austin TX
Rosalinda M. Ring - Austin TX
Paiboon Tangyunyong - Bernalillo NM
Charles F. Hawkins - Bernalillo NM
Arnold Y. Louie - Santa Clara CA

Assignee:

Advanced Micro Devices - Austin TX

International Classification:

G01R 3128

US Classification:

714738

Abstract:

A method and apparatus mechanism for testing data processing devices are implemented. The test mechanism isolates critical paths by correlating a scanning microscope image with a selected speed path failure. A trigger signal having a preselected value is generated at the start of each pattern vector. The sweep of the scanning microscope is controlled by a computer, which also receives and processes the image signals returned from the microscope. The value of the trigger signal is correlated with a set of pattern lines being driven on the DUT. The trigger is either asserted or negated depending the detection of a pattern line failure and the particular line that failed. In response to the detection of the particular speed path failure being characterized, and the trigger signal, the control computer overlays a mask on the image of the device under test (DUT). The overlaid image provides a visual correlation of the failure with the structural elements of the DUT at the level of resolution of the microscope itself.

US Patent:

7062399, Jun 13, 2006

Filed:

Jun 2, 2000

Appl. No.:

09/586518

Inventors:

Michael R. Bruce - Austin TX, US
Victoria J. Bruce - Austin TX, US
Rosalinda M. Ring - Austin TX, US
Edward Jr. I. Cole - Albuquerque NM, US
Charles F. Hawkins - Albuquerque NM, US

Assignee:

Advance Micro Devices, Inc. - Sunnyvale CA

International Classification:

G01R 31/14

US Classification:

702117, 324750

Abstract:

According to an example embodiment of the present invention a semiconductor die having a resistive electrical connection is analyzed. Heat is directed to the die as the die is undergoing a state-changing operation to cause a failure due to suspect circuitry. The die is monitored, and a circuit path that electrically changes in response to the heat is detected and used to detect that a particular portion therein of the circuit is resistive. In this manner, the detection and localization of a semiconductor die defect that includes a resistive portion of a circuit path is enhanced.