Charles W Macpherson from 8 Jerome Ave, Thousand Oaks, CA 91320, age 96

Resumes

Charles Macpherson

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Location:

United States

Wikipedia

Charles Macphers

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Charles Macpherson FRAM (18701927) was a Scottish organist, who served at St Paul's Cathedral. He was born in Edinburgh on 10 May 1870. His father was ...

Charles Macphers Dobell

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Lieutenant-General Sir Charles Macpherson Dobell KCB, CMG, DSO (22 June ...

Us Patents

Methods For Forming An Undercut Region And Electronic Devices Incorporating The Same
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US Patent:

7276453, Oct 2, 2007
Filed:

Aug 10, 2004
Appl. No.:

10/915578
Inventors:

Nugent Truong - Ventura CA, US
Charles Douglas MacPherson - Santa Barbara CA, US
Assignee:

E.I. du Pont de Nemours and Company - Wilmington DE
International Classification:

H01L 21/302
H01L 21/461
US Classification:

438739, 438 30, 257E21021, 257E21036
Abstract:

An electronic device having a substrate structure having an undercut region is provided and further included is a method for forming an undercut region of a substrate structure. The method includes forming a patterned protective layer over a first electrode. The method also includes forming the substrate structure over the patterned protective layer. An opening within the substrate structure overlies an exposed portion of the substrate structure. The method further includes removing the exposed portion of the patterned protective layer, thereby exposing a portion of the first electrode and forming an undercut region of the substrate structure. The method still further includes depositing a liquid over the first electrode after removing the exposed portion of the patterned protective layer, and solidifying the liquid to form a solid layer.

Methods For Forming An Undercut Region And Electronic Devices Incorporating The Same
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US Patent:

7732810, Jun 8, 2010
Filed:

Aug 17, 2007
Appl. No.:

11/840392
Inventors:

Nugent Truong - Ventura CA, US
Charles Douglas Macpherson - Santa Barbara CA, US
Assignee:

E.I. du Pont de Nemours and Company - Wilmington DE
International Classification:

H01L 51/50
US Classification:

257 40, 257E51018
Abstract:

An electronic device having a substrate structure having an undercut region is provided and further included is a method for forming an undercut region of a substrate structure. The method includes forming a patterned protective layer over a first electrode. The method also includes forming the substrate structure over the patterned protective layer. An opening within the substrate structure overlies an exposed portion of the substrate structure. The method further includes removing the exposed portion of the patterned protective layer, thereby exposing a portion of the first electrode and forming an undercut region of the substrate structure. The method still further includes depositing a liquid over the first electrode after removing the exposed portion of the patterned protective layer, and solidifying the liquid to form a solid layer.