Charles E Mcchesney

US Patent:

39490386, Apr 6, 1976

Filed:

Aug 1, 1973

Appl. No.:

5/384707

Inventors:

Charles Edmund McChesney - Monmouth Junction NJ
Robert J. McHenry - Belle Mead NJ
James Alan Wachtel - Princeton NJ

Assignee:

American Can Company - Greenwich CT

International Classification:

B29C 1707
B29C 2300
B29D 2303
C08L 902

US Classification:

264 89

Abstract:

A thermoplastic bottle having a unique combination of properties. The bottle is characterized by a very high level of molecular orientation, and possesses the properties of high impact strength, low gas permeability and excellent resistance to creep strain under tensile load. A blowing process for fabricating the bottle is also taught which features a means for substantially improving the resistance to creep strain.

US Patent:

46327983, Dec 30, 1986

Filed:

Jun 18, 1984

Appl. No.:

6/619608

Inventors:

Nancy C. Eickman - Mountainside NJ
Charles E. McChesney - Monmouth Junction NJ
Gary E. Williams - Short Hills NJ
Hyun-Nam Yoon - Summit NJ

Assignee:

Celanese Corporation - New York NY

International Classification:

B29C 4514

US Classification:

26427217

Abstract:

An improved thermoplastic molding composition is provided which is particularly suited for use in the impervious void-free encapsulation on a relatively expeditious basis of an electronic component wherein the preformed electronic component is positioned in a mold cavity prior to the introduction of the molding composition via injection molding. The molding composition comprises a melt processable thermotropic liquid crystalline polymer which is of a relatively low weight average molecular weight of approximately 4,000 to 25,000 (e. g. approximately 4,000 to 10,000) and which is substantially incapable of further chain growth upon heating. Uniformly dispersed within the liquid crystalline polymer is approximately 40 to 80 percent by weight (e. g. approximately 50 to 75 percent by weight) of a particulate inorganic material (preferably of silicon dioxide) which serves to advantageously decrease its volumetric coefficient of thermal expansion and to advantageously increase its thermal conductivity. In a preferred embodiment the electronic component which is encapsulated is a semiconductor device, such as relatively delicate quad or dual-in-line integrated circuit device which is assembled onto a flat prestamped lead frame or other conductive device having a plurality of leads which extend outside the area which is encapsulated.

US Patent:

39844986, Oct 5, 1976

Filed:

Oct 18, 1974

Appl. No.:

5/516110

Inventors:

Charles Edmund McChesney - South Brunswick NJ
Robert J. McHenry - St. Charles IL
James Alan Wachtel - South Brunswick NJ

Assignee:

American Can Company - Greenwich CT

International Classification:

C08F 1522
C08F 1906
C08F 1908

US Classification:

260879

Abstract:

A thermoplastic bottle has a unique combination of properties. The bottle is characterized by a very high level of molecular orientation, and possesses the properties of high impact strength, low gas permeability and excellent resistance to creep strain under tensile load. A blowing process for fabricating the bottle is also taught which features a means of substantially improving the resistance to creep strain.

US Patent:

40440869, Aug 23, 1977

Filed:

Jul 21, 1975

Appl. No.:

5/597678

Inventors:

Charles Edmund McChesney - Monmouth Junction NJ
Robert J. McHenry - Belle Mead NJ
James Alan Wachtel - Princeton NJ

Assignee:

American Can Company - Greenwich CT

International Classification:

B29C 1707

US Classification:

264 97

Abstract:

A molecularly oriented article having a tubular sidewall is blow-molded from a thermoplastic parison which is heat-treated prior to blowing to provide the parison sidewall with a temperature gradient wherein the temperature of the inside of the sidewall is greater than that of the outside, both of said temperatures being within the orientation temperature range of the thermoplastic. The temperature gradient results in the sidewall of the article having a different and more uniform circumferential orientation release stress distribution radially across the sidewall than would be obtained if the parison were blown isothermally.

US Patent:

45543283, Nov 19, 1985

Filed:

Jan 30, 1985

Appl. No.:

6/696570

Inventors:

Stephen M. Sinker - Lebanon NJ
Joseph J. Baron - Morris Plains NJ
Raymond W. Rupp - Corpus Christi TX
Marvin L. Doerr - Pineville NC
Charles E. McChesney - Monmouth Junction NJ

Assignee:

Celanese Corporation - New York NY

International Classification:

C08G 6376

US Classification:

525437

Abstract:

There is disclosed an improved modified polymer suitable for use in making hollow containers by conventional extrusion blow molding. It is a specific type of end-capped and branched polyethylene terephthalate polymer or copolymer. In the improvement, the end-cap comprises the reacted component of a difunctional acid or alkali metal salt of a difunctional acid having the formula: ##STR1## wherein: X has a valency of 6 and is selected from sulfur, selenium, and tellurium; M is an alkali metal or hydrogen; and Y is hydrogen or an aliphatic group containing from 1 to 18 carbon atoms. The preferred difunctional acid is m-sulfobenzoic acid. The product typically contains few large gels having diameters greater than 0. 1 mm.

US Patent:

39347435, Jan 27, 1976

Filed:

Dec 29, 1972

Appl. No.:

5/319380

Inventors:

Charles Edmund McChesney - Monmouth Junction NJ
Robert J. McHenry - Belle Mead NJ
James Alan Wachtel - Princeton NJ

Assignee:

American Can Company - Greenwich CT

International Classification:

B65D 2300
B32B 702

US Classification:

215 1C

Abstract:

A molecularly oriented article having a tubular sidewall is blow-molded from a thermoplastic parison which is heat-treated prior to blowing to provide the parison sidewall with a temperature gradient wherein the temperature of the inside of the sidewall is greater than that of the outside, both of said temperature being within the orientation temperature range of the thermoplastic. The temperature gradient results in the sidewall of the article having a different and more uniform circumferential orientation release stress distribution radially across the sidewall than would be obtained if the parison were blown isothermally.

US Patent:

47204249, Jan 19, 1988

Filed:

Jun 9, 1986

Appl. No.:

6/872007

Inventors:

Nancy C. Eickman - Mountainside NJ
Charles E. McChesney - Monmouth Junction NJ
Gary E. Williams - Short Hills NJ
Hyun-Nam Yoon - Summit NJ

Assignee:

Hoebbst Celanese Corporation - Bridgewater NJ

International Classification:

B32B 516
B32B 2706
B32B 2734
B32B 2736

US Classification:

428323

Abstract:

An improved thermoplastic molding composition is provided which is particularly suited for use in the impervious void-free encapsulation on a relatively expeditious basis of an electronic component wherein the preformed electronic component is positioned in a mold cavity prior to the introduction of the molding composition via injection molding. The molding composition comprises a melt processable thermotropic liquid crystalline polymer which is of a relatively low weight average molecular weight of approximately 4,000 to 25,000 (e. g. approximately 4,000 to 10,000) and which is substantially incapable of further chain growth upon heating. Uniformly dispersed within the liquid crystalline polymer is approximately 40 to 80 percent by weight (e. g. approximately 50 to 75 percent by weight) of a particulate inorganic material (preferably of silicon dioxide) which serves to advantageously decrease its volumetric coefficient of thermal expansion and to advantageously increase its thermal conductivity. In a preferred embodiment the electronic component which is encapsulated is a semiconductor device, such a relatively delicate quad or dual-in-line integrated circuit device which is assembled onto a flat prestamped lead frame or other conductive device having a plurality of leads which extend outside the area which is encapsulated.

US Patent:

47192500, Jan 12, 1988

Filed:

Jun 9, 1986

Appl. No.:

6/872009

Inventors:

Nancy C. Eickman - Mountainside NJ
Charles E. McChesney - Monmouth Junction NJ
Gary E. Williams - Short Hills NJ
Hyun-Nam Yoon - Summit NJ

Assignee:

Hoechst Celanese Corporation - Bridgewater NJ

International Classification:

C08K 334

US Classification:

523212

Abstract:

An improved thermoplastic molding composition is provided which is particularly suited for use in the impervious void-free encapsulation on a relatively expeditious basis of an electronic component wherein the preformed electronic component is positioned in a mold cavity prior to the introduction of the molding composition via injection molding. The molding composition comprises a melt processable thermotropic liquid crystalline polymer which is of a relatively low weight average molecular weight of approximately 4,000 to 25,000 (e. g. approximately 4,000 to 10,000) and which is substantially incapable of further chain growth upon heating. Uniformly dispersed within the liquid crystalline polymer is approximately 40 to 80 percent by weight (e. g. approximately 50 to 75 percent by weight) of a particulate inorganic material (preferably of silicon dioxide) which serves to advantageously decrease its volumetric coefficient of thermal expansion and to advantageously increase its thermal conductivity. In a preferred embodiment the electronic component which is encapsulated is a semiconductor device, such a relatively delicate quad or dual-in-line integrated circuit device which is assembled onto a flat prestamped lead frame or other conductive device having a plurality of leads which extend outside the area which is encapsulated.