Charles R Perry

US Patent:

6404211, Jun 11, 2002

Filed:

Feb 11, 1999

Appl. No.:

09/248733

Inventors:

Harvey C. Hamel - Poughkeepsie NY
Charles H. Perry - Poughkeepsie NY
Yuet-Ying Yu - Hopewell Junction NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

G01R 3102

US Classification:

324754, 324761

Abstract:

A buckling beam probe assembly and a process to make the assembly using insulated metal to hold the vertical beam probe wires. The buckling beam probe assembly electrically connects a test apparatus with contact pads on the surface of a device to be tested. The assembly is formed with a plurality of buckling beam wires each having a head, a body, and a tail. Each of the beam wires is pressed vertically onto the contact pads and buckles laterally to adapt to height differences of the contact pads caused by irregularities on the surface of the device to be tested. A top plate has a first plurality of apertures receiving the heads of the plurality of buckling beam wires. A bottom plate has a second plurality of apertures receiving the tails of the plurality of buckling beams wires. A plurality of intermediate metal sections are positioned between the top plate and the bottom plate. Each of the intermediate metal sections is formed with a plurality of thin metal layers and has a plurality of openings coated with an insulation layer.

US Patent:

6458623, Oct 1, 2002

Filed:

Jan 17, 2001

Appl. No.:

09/765030

Inventors:

Lewis S. Goldmann - Bedford NY
Mario J. Interrante - New Paltz NY
Raymond A. Jackson - Fishkill NY
Amy B. Ostrander - Wappingers Falls NY
Charles H. Perry - Poughkeepsie NY
Brenda L. Peterson - Wappingers Falls NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H01L 2144

US Classification:

438107, 438106, 438108, 438109, 257776, 257777, 257778

Abstract:

A method and apparatus is provided for forming an electronic assembly whereby an insulating polymer matrix having a plurality of conductor holes is attached to a first substrate wherein the conductor holes align with a corresponding contact array on the first substrate. Subsequently, a flexible, electrically conductive adhesive is provided within the plurality of conductor holes and a solid conductive material, preferably having a high melting temperature, is attached to at least one end thereof. The insulating polymer matrix with the electrically conductive adhesive and the solid conductive material is then cured at a temperature sufficient to completely cure the matrix to completely surround the electrically conductive adhesive, as well as permanently attaching the matrix and conductive adhesive to the first substrate and permanently attaching the solid conductive material to the conductive adhesive. A second substrate may then be attached to the conductive matrix structure secured to the first substrate by providing a low melting temperature attachment means to the solid conductive material attached to the matrix and subsequently reflowing the assembly to form an electronic assembly adapted with the capability of reworkability.

US Patent:

6528145, Mar 4, 2003

Filed:

Jun 29, 2000

Appl. No.:

09/606359

Inventors:

Daniel George Berger - Wappingers Falls NY
Shaji Farooq - Hopewell Junction NY
Lester Wynn Herron - New Paltz NY
James N. Humenik - LaGrangeville NY
John Ulrich Knickerbocker - Hopewell Junction NY
Robert William Pasco - Wappingers Falls NY
Charles H. Perry - Poughkeepsie NY
Krishna G. Sachdev - Hopewell Junction NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

G02B 600

US Classification:

428156, 428131, 4283066, 4283073, 428212, 428324, 428327, 428901, 428209, 428331, 361750, 361762, 174256, 174258, 385147, 385132

Abstract:

A composite electronic and/or optical substrate including polymeric and ceramic material wherein the composite substrate has a dielectric constant less than 4 and a coefficient of thermal expansion of 8 to 14 ppm/ÂC. at 100Â C. The composite substrate may be either ceramic-filled polymeric material or polymer-filled ceramic material.

US Patent:

6529021, Mar 4, 2003

Filed:

Apr 25, 2000

Appl. No.:

09/558428

Inventors:

Yuet-Ying Yu - Hopewell Junction NY
Daniel G Berger - Wappingers Falls NY
Camille Proietti Bowne - Poughkeepsie NY
Scott Langenthal - Pleasant Valley NY
Charles H Perry - Poughkeepsie NY
Terence Spoor - Marlboro NY
Thomas Weiss - Poughkeepsie NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

G01R 1067

US Classification:

324754, 3241581, 439482

Abstract:

A self scrubbing buckling beam contactor for contacting an array of pads positioned on a device under test is described. The contactor consists of three insulating dies: a top, an offset and a lower die separated from each other by an insulated spacer of variable thickness. Each die is provided with holes. The buckling beam has an array of flexible wires positioned substantially perpendicular to the dies, each of the flexible wires crossing a corresponding hole in each of the top, offset and lower dies to allow each wire respectively contact a pad of the device under test. By shifting the center of the hole of the lower die relative to the center of the offset die, the tip of the wire exits from the lower die at an angle with respect to the plane formed by the pads of the device under test. The exit angle of the wire tip is controlled by the relative displacement of the offset die relative to the bottom die, such that the exit angle of the tip of the wire at the bottom die changes when the probe wire is under compression. By applying a reciprocating motion to the tip of the wire contacting the surface of the device under test, a scrubbing motion is achieved that lowers the resistance between the pad of the device under test.

US Patent:

6548175, Apr 15, 2003

Filed:

Jan 11, 2001

Appl. No.:

09/759012

Inventors:

Krishna G. Sachdev - Hopewell Junction NY
Raymond A. Jackson - Fishkill NY
Amy B. Ostrander - Wappingers Falls NY
Charles H. Perry - Poughkeepsie NY
Megan J. Shannon - Wappingers Falls NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

B32B 2738

US Classification:

428414, 428413, 428447, 428448, 427386, 427387, 427 96, 156329, 156330, 523400, 524439, 528 12, 528 14, 528 15, 528 33, 528 40, 525107

Abstract:

The invention is directed to improved conductive adhesives for solder-free interconnections in microelectronic assembly processes such as for chip carrier-to-substrate attachment. These adhesives are characterized by low tensile modulus, low resistivity, high adhesion strength, and durability of these properties during reliability stress conditions of thermal shock, thermal aging, and temperature/humidity (85Â C. /85%) exposure of the assembled devices. The adhesives contain a homogeneous solution of a siloxane containing epoxide, a curing agent, a curing catalyst and an organic polymeric or oligomeric additive. A conductive filler is added to the solution forming the filler. Preferred fillers are Ag coated with Pd and Ag coated with Au.

US Patent:

6711810, Mar 30, 2004

Filed:

Sep 19, 2001

Appl. No.:

09/956369

Inventors:

Todd H. Buley - Stone Ridge NY
Roger Lam - Fishkill NY
Daniel OConnor - Millbrook NY
Charles Hampton Perry - Poughkeepsie NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H05K 336

US Classification:

29830, 292811, 29739, 29760, 29764, 29832, 29834, 257776, 269903, 361807

Abstract:

A method in which an alignment tool consisting of a nest and guide tool is used to align an LGA module in the nest and then the LGA module is removed from the nest and aligned with a circuit card by the use of the guide tool.

US Patent:

6858111, Feb 22, 2005

Filed:

Jul 23, 2001

Appl. No.:

09/911069

Inventors:

Charles H. Perry - Poughkeepsie NY, US
Mark G. Courtney - Poughkeepsie NY, US
Lewis S. Goldmann - Bedford NY, US
Gregory B. Martin - Wappingers Falls NY, US

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

C09J005/00

US Classification:

156327, 1563077, 257737, 438614

Abstract:

A method of forming an electrical connection between two devices is disclosed. In an exemplary embodiment of the invention, the method includes soldering a second solderable cap of an interconnection to a first contact pad of a first component. The interconnection further includes a conductive polymer comprising a polymer component and a conductive component A first solderable cap is disposed in contact with the conductive polymer, and the second solderable cap is disposed in contact with the conductive polymer opposite the first solderable cap. The first solderable cap is then soldered to a second contact pad of a second component.

US Patent:

6988310, Jan 24, 2006

Filed:

Jun 28, 2002

Appl. No.:

10/187081

Inventors:

Norman D. Curry - Poughkeepsie NY, US
Francis Krug - Highland NY, US
David C. Long - Wappingers Falls NY, US
Daniel O'Connor - Millbrook NY, US
Charles Hampton Perry - Poughkeepsie NY, US
Robert Weiss - LaGrangeville NY, US

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H01R 43/00

US Classification:

29825, 29874, 29884, 439 66

Abstract:

A method of assembling an interconnect device assembly which consists of cylindrical resilient wire bundles captured within a carrier. In a step of the method, the interconnect device assembly is placed in a fixture and the ends of the resilient wire bundles are deformed by shaping dies in the fixture so that the resilient wire bundles now have a dog bone shape. The dog bone shape of the resilient wire bundles prevents the resilient wire bundles from being partially or totally dislodged during handling and transit.