Charles L Singleton

US Patent:

8276262, Oct 2, 2012

Filed:

Dec 3, 2008

Appl. No.:

12/327726

Inventors:

Jeff Wienrich - Gilbert AZ, US
Charles Singleton - Mesa AZ, US

Assignee:

Intel Corporation - Santa Clara CA

International Classification:

B23P 19/00
H01R 43/042
H05K 13/04

US Classification:

29729, 294261, 29434, 29607, 118500, 15634551, 414806

Abstract:

Aspects of the present disclosure may include an apparatus for enclosing a thin wafer to prevent damage during an on-going manufacture of integrated circuit chip(s) on or in the thin wafer, and methods of utilizing the apparatus. The apparatus may include a lower support assembly and an upper retainer assembly which retains a thin wafer therebetween, wherein the lower support assembly and the upper retainer assembly may be coupled together by a magnetic attractive force.

US Patent:

20120321430, Dec 20, 2012

Filed:

Aug 30, 2012

Appl. No.:

13/598935

Inventors:

Jeff Wienrich - Gilbert AZ, US
Charles Singleton - Mesa AZ, US

International Classification:

H01L 21/68

US Classification:

414800

Abstract:

The present invention describes a method of and an apparatus for including: separating magnets and corresponding target plates; separating a lower support assembly from an upper retainer assembly of a thin-wafer handling system; and inserting or removing a thin wafer from the thin-wafer handling system.