Aspects of the present disclosure may include an apparatus for enclosing a thin wafer to prevent damage during an on-going manufacture of integrated circuit chip(s) on or in the thin wafer, and methods of utilizing the apparatus. The apparatus may include a lower support assembly and an upper retainer assembly which retains a thin wafer therebetween, wherein the lower support assembly and the upper retainer assembly may be coupled together by a magnetic attractive force.
Jeff Wienrich - Gilbert AZ, US Charles Singleton - Mesa AZ, US
International Classification:
H01L 21/68
US Classification:
414800
Abstract:
The present invention describes a method of and an apparatus for including: separating magnets and corresponding target plates; separating a lower support assembly from an upper retainer assembly of a thin-wafer handling system; and inserting or removing a thin wafer from the thin-wafer handling system.