Charles R Singleton

US Patent:

8222118, Jul 17, 2012

Filed:

Dec 15, 2008

Appl. No.:

12/335378

Inventors:

Mark Dydyk - Cave Creek AZ, US
Arturo Urquiza - Chandler AZ, US
Charles Singleton - Mesa AZ, US
Tim McIntosh - Phoenix AZ, US

Assignee:

Intel Corporation - Santa Clara CA

International Classification:

H01L 21/46
H01L 21/30

US Classification:

438459, 438690, 438693, 438750

Abstract:

A method of relieving stress in a semiconductor wafer and providing a wafer backside surface finish capable of hiding cosmetic imperfections. Embodiments of the invention include creating a wafer backside surface which can be used for all dies on the semiconductor wafer intended for different product applications and be deposited with backside metallization (BSM) material. The method provides a rough texture on the wafer backside followed by isotropic etching of the wafer backside to recover the wafer strength as well as to preserve the rough texture of the wafer backside. After wafer backside metallization, the rough texture of the wafer backside hides cosmetic imperfections introduced by subsequent processes.

US Patent:

8276262, Oct 2, 2012

Filed:

Dec 3, 2008

Appl. No.:

12/327726

Inventors:

Jeff Wienrich - Gilbert AZ, US
Charles Singleton - Mesa AZ, US

Assignee:

Intel Corporation - Santa Clara CA

International Classification:

B23P 19/00
H01R 43/042
H05K 13/04

US Classification:

29729, 294261, 29434, 29607, 118500, 15634551, 414806

Abstract:

Aspects of the present disclosure may include an apparatus for enclosing a thin wafer to prevent damage during an on-going manufacture of integrated circuit chip(s) on or in the thin wafer, and methods of utilizing the apparatus. The apparatus may include a lower support assembly and an upper retainer assembly which retains a thin wafer therebetween, wherein the lower support assembly and the upper retainer assembly may be coupled together by a magnetic attractive force.

US Patent:

20120321430, Dec 20, 2012

Filed:

Aug 30, 2012

Appl. No.:

13/598935

Inventors:

Jeff Wienrich - Gilbert AZ, US
Charles Singleton - Mesa AZ, US

International Classification:

H01L 21/68

US Classification:

414800

Abstract:

The present invention describes a method of and an apparatus for including: separating magnets and corresponding target plates; separating a lower support assembly from an upper retainer assembly of a thin-wafer handling system; and inserting or removing a thin wafer from the thin-wafer handling system.