Charles H Woods

US Patent:

7180367, Feb 20, 2007

Filed:

Jan 7, 2005

Appl. No.:

10/905522

Inventors:

Charles Woods - Gilbert AZ, US
Gauray Menon - Gilbert AZ, US

Assignee:

U.S. Monolithics, L.L.C. - Chandler AZ

International Classification:

H03G 3/30

US Classification:

330133, 330285

Abstract:

Systems, devices, and methods are provided for actively biasing a multi-stage amplifier. A method for differentially actively biasing a multi-stage amplifier comprises the steps of: actively biasing, with a single active bias circuit, an amplifier comprising a plurality of amplification stages; and differentially applying the bias provided by the single active bias circuit by biasing at least one amplification stage at a different bias level than another of the plurality of amplification stages. An active bias circuit for a multi-stage amplifier comprises: a single active bias circuit that is configured to actively bias a plurality of amplification stages via at least two gates; and a differential device configured to cause the active biasing provided to one gate to be different from the bias provided to another gate.

US Patent:

7342468, Mar 11, 2008

Filed:

Mar 11, 2005

Appl. No.:

10/906900

Inventors:

Noel A Lopez - Phoenix AZ, US
Charles E. Woods - Gilbert AZ, US

Assignee:

U.S. Monolithics, L.L.C. - Chandler AZ

International Classification:

H01P 1/20
H01P 3/08

US Classification:

333202, 333204, 333205

Abstract:

An apparatus comprises a radio frequency filter and a dielectric material configured to alter the frequency response of the RF filter, wherein said dielectric material is located in proximity to said RF filter. The apparatus may be useful in a satellite antenna system wherein the RF filter is configured to have an initial frequency response. The dielectric material may be configured to shift the frequency response of the RF filter from the initial frequency response to a shifted frequency response. The dielectric material may be a polyimide tape. A method is also provided for reworking a non-compliant PWB, wherein the PWB is non-compliant with a standard frequency response to a given RF input signal, and wherein the PWB comprises an RF filter. The method comprises the step of adjusting the frequency response of the RF filter by adding a piece of polyimide tape in proximity to the RF filter.

US Patent:

7782156, Aug 24, 2010

Filed:

Sep 11, 2007

Appl. No.:

11/853287

Inventors:

Charles Woods - Gilbert AZ, US
Noel Lopez - Phoenix AZ, US
Dean Cook - Mesa AZ, US
Jon Filreis - Mesa AZ, US

Assignee:

ViaSat, Inc. - Carlsbad CA

International Classification:

H03H 7/38
H01P 5/08

US Classification:

333 34, 333254

Abstract:

In general, in accordance with an exemplary aspect of the present invention, a low-loss interface for connecting an integrated circuit such as a monolithic microwave integrated circuit to an energy transmission device such as a waveguide is disclosed. In one exemplary embodiment, the interface comprises a pin attached to a matching network that matches the impedance of the energy produced at the circuit to the impedance required by the waveguide without the use of a dielectric material.

US Patent:

7812686, Oct 12, 2010

Filed:

Feb 28, 2008

Appl. No.:

12/039529

Inventors:

Charles Woods - Gilbert AZ, US
Noel Lopez - Phoenix AZ, US

Assignee:

Viasat, Inc. - Carlsbad CA

International Classification:

H01P 5/107

US Classification:

333 26, 333 34

Abstract:

In general, in accordance with an exemplary aspect of the present invention, a low-loss interface for connecting an integrated circuit such as a monolithic microwave integrated circuit to an energy transmission device such as a waveguide is disclosed. The interface comprises an isolation wall placed between an input and output region of an integrated circuit to reduce ripple and isolate the waveguide cavity from the monolithic microwave integrated circuit circuitry. The interface further comprises a turning screw or other similar member that is configured to closely match the impedance of integrated circuit with the impedance at interface to further reduce loss.

US Patent:

7855612, Dec 21, 2010

Filed:

Oct 18, 2007

Appl. No.:

11/874369

Inventors:

Rob Zienkewicz - Chandler AZ, US
Dean Cook - Mesa AZ, US
Charles Woods - Gilbert AZ, US

Assignee:

Viasat, Inc. - Carlsband CA

International Classification:

H01P 5/103

US Classification:

333 26, 333 33

Abstract:

In general, in accordance with an exemplary aspect of the present invention, a low-loss interface for connecting an integrated circuit such as a monolithic microwave integrated circuit to an energy transmission device such as a waveguide is disclosed. In one exemplary embodiment, the interface comprises a coaxial structure such as a coaxial cable that directly connects the monolithic microwave integrated circuit to the waveguide to transmit energy such as microwave energy with minimal loss.

US Patent:

8013775, Sep 6, 2011

Filed:

Apr 30, 2007

Appl. No.:

11/742268

Inventors:

Charles E. Woods - Gilbert AZ, US

Assignee:

ViaSat, Inc. - Carlsbad CA

International Classification:

H01Q 17/00

US Classification:

342 1, 342 4

Abstract:

An exemplary embodiment of the present invention comprises a radio frequency absorber that is operative for absorbing electromagnetic energy, scattering electromagnetic signals, and/or attenuating electromagnetic signals. In accordance with certain aspects of the invention, the radio frequency absorber is substantially flat and comprises an absorbing surface. The absorbing surface is operative to absorb electromagnetic energy, scatter electromagnetic signals, and/or attenuate electromagnetic signals. In exemplary embodiments of the invention, the radio frequency absorber comprises a plurality of holes disposed within the radio frequency absorber. The radio frequency absorber, according to various embodiments of the present invention, is configured to reduce cavity oscillations and/or cavity modes and resonances within an integrated circuit device, such as a device that houses a monolithic microwave integrated circuit.

US Patent:

8212631, Jul 3, 2012

Filed:

Mar 12, 2009

Appl. No.:

12/403292

Inventors:

Noel Lopez - Phoenix AZ, US
Charles Woods - Gilbert AZ, US
Rob Zienkewicz - Chandler AZ, US
Jon Filreis - Mesa AZ, US

Assignee:

ViaSat, Inc. - Carlsbad CA

International Classification:

H01P 5/12

US Classification:

333125, 333136

Abstract:

In general, in accordance with an exemplary aspect of the present invention, an electrical system configured to use power combining of microwave signals, such as those from monolithic microwave integrated circuits or MMICs is provided. In one exemplary embodiment, the system of the present invention further comprises a low loss interface that the circuits are directly connected to. In another exemplary embodiment, the circuits are connected to a pin which is connected to the low loss interface. In yet another exemplary embodiment of the present invention, a multi-layer power amplifier is provided that comprises two or more chassis and circuits attached to impedance matching interfaces according to the present invention. This multi-layered power amplifier is configured to amplify an energy signal and have a significantly reduced volume compared to existing power combiners.

US Patent:

8598966, Dec 3, 2013

Filed:

May 15, 2012

Appl. No.:

13/472231

Inventors:

Noel Lopez - Chandler AZ, US
Charles Woods - Gilbert AZ, US
Rob Zienkewicz - Chandler AZ, US
Jon Filreis - Mesa AZ, US

Assignee:

ViaSat, Inc. - Carlsbad CA

International Classification:

H01P 5/12

US Classification:

333125, 333127, 333128, 333136, 333138

Abstract:

In general, in accordance with an exemplary aspect of the present invention, an electrical system configured to use power combining of microwave signals, such as those from monolithic microwave integrated circuits or MMICs is provided. In one exemplary embodiment, the system of the present invention further comprises a low loss interface that the circuits are directly connected to. In another exemplary embodiment, the circuits are connected to a pin which is connected to the low loss interface. In yet another exemplary embodiment of the present invention, a multi-layer power amplifier is provided that comprises two or more chassis and circuits attached to impedance matching interfaces according to the present invention. This multi-layered power amplifier is configured to amplify an energy signal and have a significantly reduced volume compared to existing power combiners.