Charlie Mcandrew

US Patent:

63267381, Dec 4, 2001

Filed:

Aug 21, 2000

Appl. No.:

9/642314

Inventors:

Charlie McAndrew - Cypress TX

Assignee:

Innova Electronics, Inc. - Houston TX

International Classification:

H05B 3700

US Classification:

315227R

Abstract:

An apparatus for illuminating an electronic display such as an LCD. A single hot wire is connected to multiple capacitors each dedicated to a cold cathode fluorescent tube, and multiple tubes are incorporated to illuminate the electronic display. Multiple hot wires are eliminated to eliminate excessive electrical losses and to reduce manufacturing cost.

US Patent:

60954043, Aug 1, 2000

Filed:

Sep 27, 1999

Appl. No.:

9/407219

Inventors:

Charlie McAndrew - Cypress TX

Assignee:

Innova Electronics, Inc. - Houston TX

International Classification:

B23K 3102

US Classification:

2281801

Abstract:

A method for soldering electronic components capable of withstanding high temperature applications. A solder having a composition in the range between 83 and 87% lead, between 8. 5 and 11. 5% antimony, and the balance of tin provides superior results. The solder uniquely provides a sufficiently low melting point to enable mass flow without destruction of plastic package parts, and a sufficiently high melting point to achieve 200 degrees C. operation. Good mechanical strength is achieved while providing sufficient creep to permit differential expansion between components and a printed wiring board. A heavy solder layer is coated on a printed wiring board and is oxidized to generate a thin solderable layer. Manufacture of the circuit board can be performed with conventional techniques such as wave soldering, hand soldering, solder printing, solder dispensing, and solder pre-forms.

US Patent:

60664029, May 23, 2000

Filed:

May 22, 1998

Appl. No.:

9/084074

Inventors:

Charlie McAndrew - Cypress TX

Assignee:

Innova Electronics, Inc. - Houston TX

International Classification:

B32B 1504

US Classification:

428457

Abstract:

A system for soldering electronic components capable of withstanding high temperature applications. A solder having a composition in the range between 83 and 87% lead, between 8. 5 and 11. 5% antimony, and the balance of tin provides superior results. The solder uniquely provides a sufficiently low melting point to enable mass flow without destruction of plastic package parts, and a sufficiently high melting point to achieve 200 degrees C. operation. Good mechanical strength is achieved while providing sufficient creep to permit differential expansion between components and a printed wiring board. A heavy solder layer is coated on a printed wiring board and is oxidized to generate a thin solderable layer. Manufacture of the circuit board can be performed with conventional techniques such as wave soldering, hand soldering, solder printing, solder dispensing, and solder pre-forms.