Chen Chen

US Patent:

20190327124, Oct 24, 2019

Filed:

Jun 19, 2019

Appl. No.:

16/446589

Inventors:

- Greenbelt MD, US
David N. Claffey - Somerville MA, US
Chen Chen - Burlingame CA, US
Feng Zhang - Greenbelt MD, US
Chenshu Wu - Greenbelt MD, US
Chau-Wai Wong - Raleigh NC, US
Beibei Wang - Clarksville MD, US
Oscar Chi-Lim Au - San Jose CA, US
K. J. Ray Liu - Potomac MD, US

Assignee:

ORIGIN WIRELESS, INC. - Greenbelt MD

International Classification:

H04L 27/36
H04B 1/38
H04W 72/04

Abstract:

Method, apparatus and systems for object tracking are disclosed. In one example, a system for tracking a plurality of objects in a venue is disclosed. The system comprises a transmitter configured for transmitting a series of probe signals in a broadcasting manner through a wireless multipath channel, wherein the wireless multipath channel is impacted by a movement of at least one of the plurality of objects in the venue; and a plurality of heterogeneous target wireless receivers each of which is associated with an object of the plurality of objects in the venue. Each of the plurality of heterogeneous target wireless receivers is configured for: receiving the series of probe signals through the wireless multipath channel between the heterogeneous target wireless receiver and the transmitter, obtaining at least one time series of channel information (TSCI) of the wireless multipath channel based on the series of probe signals received by the heterogeneous target wireless receiver, and tracking the object associated with the heterogeneous target wireless receiver based on the at least one TSCI.

US Patent:

20190189843, Jun 20, 2019

Filed:

Dec 15, 2017

Appl. No.:

15/843758

Inventors:

- Branford CT, US
Chen Chen - New Haven CT, US

International Classification:

H01L 33/10
H01L 33/06
H01L 33/00
H01L 33/32

Abstract:

Aspects of the disclosure provide for mechanisms for fabricating light extraction structures for semiconductor devices (e.g., light-emitting devices). In accordance with some embodiments, a semiconductor device is provided. The semiconductor device may include: a first semiconductor layer including an epitaxial layer of a semiconductor material; a second semiconductor layer comprising an active layer; and a light-reflection layer configured to cause at least a portion of light produced by the active layer to emerge from the semiconductor device via a surface of the second semiconductor layer, wherein the light-reflection layer is positioned between the first semiconductor layer and the second semiconductor layer. In some embodiments, the semiconductor material includes gallium nitride. In some embodiments, the light-reflection layer includes a layer of gallium.

US Patent:

20190189849, Jun 20, 2019

Filed:

Dec 15, 2017

Appl. No.:

15/844344

Inventors:

- Branford CT, US
Chen Chen - New Haven CT, US
Jie Song - New Haven CT, US

International Classification:

H01L 33/32
H01L 33/08
C30B 29/40
H01L 33/24
H01L 21/02
H01L 29/20
H01L 27/15

Abstract:

Aspects of the disclosure provide for mechanisms for forming air voids for semiconductor fabrication. In accordance with some embodiments, a method for forming air voids may include forming a first semiconductor layer including a first group III material and a second group III material on a substrate; forming a plurality of air voids in the first semiconductor layer by removing at least a portion of the second group III material from the first semiconductor layer; and forming a second semiconductor layer on the first semiconductor layer. The second semiconductor layer may include an epitaxial layer of a group III-V material. In some embodiments, the first group III material and the second group III material may be gallium and indium, respectively.

US Patent:

20180283106, Oct 4, 2018

Filed:

Sep 21, 2016

Appl. No.:

15/764002

Inventors:

- Houston TX, US
Chen Chen - New Haven CT, US
Yuri Burhan - Spring TX, US
Balasubramanian Durairajan - Sugar Land TX, US
Sandeep Tammineni - Dhahran, SA

International Classification:

E21B 10/56
E21B 10/42

Abstract:

A cutting element includes a cutting end extending a depth from a cutting face to an interface surface opposite from the cutting face, and a spindle, the spindle axially separated from the cutting end by a transition region. The spindle has a spindle diameter measured between a spindle side surface, which is less than a cutting end diameter. A guide length, measured from a point of transition to the transition region to a retention feature, is longer than 75% of a total length of the spindle.

US Patent:

20180274302, Sep 27, 2018

Filed:

Aug 29, 2016

Appl. No.:

15/763345

Inventors:

- Houston TX, US
Chen Chen - New Haven CT, US
Yuri Y. Burhan - Spring TX, US

International Classification:

E21B 10/42
E21B 10/567

Abstract:

A downhole cutting tool includes a tool body defining a cutter pocket and a rolling cutter having an inner rotatable cutting element and a sleeve in the cutter pocket, where axial movement of the inner rotatable cutting element is limited by an external retention element disposed outside of the sleeve.

US Patent:

20150346234, Dec 3, 2015

Filed:

Jun 2, 2015

Appl. No.:

14/727891

Inventors:

- Houston TX, US
Catalin Badea - Calgary, CA
Jaroslav Dobos - Calgary, CA
Barry Buternowsky - Calagary, CA
Mihai Silviu Calin - Calgary, CA
Fuchun Liu - Calagary, CA
Chen Chen - New Haven CT, US

International Classification:

G01P 3/487
E21B 47/12
G01D 5/14

Abstract:

A rotational speed measurement system may include a rotational speed measuring device for measuring a rotational speed of a motor or component thereof. The downhole rotational speed measuring device may include a magnet and a magnetic sensor. A telescoping unit may position the magnetic sensor into sensing proximity of the magnet. A method for measuring downhole rotational speed may include coupling a rotational speed measuring device to a measurement assembly and a motor. The rotational speed measuring device may include a magnet and a magnetic sensor. The position of the magnetic sensor, the magnet, or both, may be adjusted with a telescoping unit to place the magnetic sensor into sensing proximity of the magnet.