Chi Rong Chang

age ~72

from Dallas, TX

Also known as:
  • Chi R Chang
  • Chirong Chang
  • Chairon Chang
  • Rong Chang Chirong
  • G Chang

Chi Chang Phones & Addresses

  • Dallas, TX
  • 4006 S Lamar Blvd STE 1000, Austin, TX 78704
  • Round Rock, TX
  • Houston, TX
  • Pittsford, NY

Resumes

Chi Chang Photo 1

Senior Member Of Technical Staff, Oracle Product Lifecycle Division

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Location:
United States
Industry:
Internet
Chi Chang Photo 2

General Counsel And Chief Compliance Officer

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Location:
Austin, TX
Industry:
Investment Management
Work:
Sali Fund Services
General Counsel and Chief Compliance Officer

Sali Fund Management
General Counsel and Chief Compliance Officer

Spinnaker Capital Group Jan 2010 - Dec 2015
Assistant General Counsel and Compliance Officer

Dewey & Leboeuf Llp Aug 2007 - Jan 2010
Senior Associate

Linklaters Sep 2003 - Jun 2007
Us Associate
Education:
Harvard Law School 2000 - 2003
Doctor of Jurisprudence, Doctorates
The University of Texas at Austin 1995 - 1999
Bachelors, Bachelor of Arts, History
Skills:
Hedge Funds
Project Finance
Derivatives
Financial Structuring
Joint Ventures
International Finance
Emerging Markets
Structured Finance
Restructuring
Investments
Equities
Mergers and Acquisitions
Corporate Law
Fx Options
Corporate Finance
Cross Border Transactions
Chi Chang Photo 3

Kitchen Supervisor

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Work:
Usda
Kitchen Supervisor
Chi Chang Photo 4

Chi Chang

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Chi Chang Photo 5

Chi Chang

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Chi Chang Photo 6

Chi Chang

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Chi Chang Photo 7

Chi Chang

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Chi Chang Photo 8

Chi Yun Chang

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Medicine Doctors

Chi Chang Photo 9

Chi Y. Chang

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Specialties:
Acupuncturist, Physical Medicine & Rehabilitation
Work:
Chi H Chang MD
102 Valentine St, Mount Vernon, NY 10550
9146685353 (phone), 9146683770 (fax)
Education:
Medical School
Chonnam Univ Med Sch, Kwangju, So Korea
Graduated: 1969
Languages:
English
Korean
Spanish
Description:
Dr. Chang graduated from the Chonnam Univ Med Sch, Kwangju, So Korea in 1969. He works in Mount Vernon, NY and specializes in Acupuncturist and Physical Medicine & Rehabilitation. Dr. Chang is affiliated with Montefiore Mount Vernon Hospital.

License Records

Chi S Chang

License #:
16017 - Expired
Issued Date:
Jun 28, 1995
Renew Date:
May 31, 1996
Expiration Date:
May 31, 1996
Type:
Certified Public Accountant

Lawyers & Attorneys

Chi Chang Photo 10

Chi Chang - Lawyer

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Address:
Spinnaker Capital (Asia) Pte. Ltd.
63728283xx (Office)
Licenses:
New York - Currently registered 2004
Education:
Harvard
Name / Title
Company / Classification
Phones & Addresses
Chi Chang
Principal
Lifequest Products Inc
Ret Misc Foods
4307 Lindbergh Dr, Addison, TX 75001
Chi Shih Chang
Manager
VIA PAK, LLC
Business Services at Non-Commercial Site
111 Congress Ave STE 1400, Austin, TX 78701
5125 Tennington Park, Dallas, TX 75287
Chi Shing Chang
President
CHANG & PI CORPORATION
Eating Place
3295 Independence Pkwy STE 3215, Plano, TX 75075
3215 Independence Pkwy, Plano, TX 75075
3306 W Walnut St, Garland, TX 75042
4504 Lancelot Dr, Plano, TX 75024
9729857656

Us Patents

  • Proper Choice Of The Encapsulant Volumetric Cte For Different Pgba Substrates

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  • US Patent:
    6353182, Mar 5, 2002
  • Filed:
    Mar 30, 1998
  • Appl. No.:
    09/050765
  • Inventors:
    Chi Shih Chang - Austin TX
    William T. Chen - Endicott NY
    Ajit Trivedi - Endicott NY
  • Assignee:
    International Business Machines Corporation - Armonk NY
  • International Classification:
    H01L 2328
  • US Classification:
    174 522, 174 523, 174 524, 174255, 174260, 257632, 257678, 257701, 257737, 257738, 361748, 361767
  • Abstract:
    The present invention describes a method and apparatus for packaging a flip chip by matching the z-direction CTE of the IC solder joint with the z-direction CTE of the encapsulant. Consideration of the z-direction CTEs is important when determining the volumetric CTE of the encapsulant. This invention first requires a determination of the z-direction CTE of the IC solder joint and a determination of the z-direction CTE of the encapsulant. The invention next matches the z-direction CTE of the IC solder joint to the z-direction CTE of the encapsulant. The matching of the two z-direction CTEs reduces the z-direction tensile or compression stresses on the IC solder joint and the encapsulant.
  • Placement Of Sacrificial Solder Balls Underneath The Pbga Substrate

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  • US Patent:
    6829149, Dec 7, 2004
  • Filed:
    Aug 18, 1997
  • Appl. No.:
    08/912429
  • Inventors:
    Chi Shih Chang - Austin TX
    William T. Chen - Endicott NY
    Ajit Trivedi - Endicott NY
  • Assignee:
    International Business Machines Corporation - Armonk NY
  • International Classification:
    H05K 712
  • US Classification:
    361771, 361704, 361707, 361712, 361714
  • Abstract:
    The present invention discloses techniques that improve the reliability of a flip packages that uses underfill encapsulation. One embodiment of the present invention describes a method and apparatus of packaging a flip chip by relocating the neutral plane of the package substrate away from its mid-plane. Another embodiment of the present invention describes a method and apparatus of arranging the layers of a laminate for use in PBGA packaging that arranges the layers of the laminate according to the stiffness of each layer. Another embodiment of the present invention describes a method and apparatus of packaging a flip chip that uses one or more redundant interconnections at the bottom of the package substrate where the redundant interconnections are within the shadow of the IC chip.
  • Placement Of Sacrificial Solder Balls Underneath The Pbga Substrate

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  • US Patent:
    7227268, Jun 5, 2007
  • Filed:
    Oct 29, 2004
  • Appl. No.:
    10/977263
  • Inventors:
    Chi Shih Chang - Austin TX, US
    William T. Chen - Endicott NY, US
    Ajit Trivedi - Endicott NY, US
  • Assignee:
    International Business Machines Corporation - Armonk NY
  • International Classification:
    H01L 23/48
    H01L 23/52
    H01L 29/40
  • US Classification:
    257786, 257738, 257778, 257E2302, 257E23021, 257E23023, 257E23069, 438108, 438109
  • Abstract:
    The present invention discloses techniques that improve the reliability of a flip packages that uses underfill encapsulation. One embodiment of the present invention describes a method and apparatus of packaging a flip chip by relocating the neutral plane of the package substrate away from its mid-plane. Another embodiment of the present invention describes a method and apparatus of arranging the layers of a laminate for use in PBGA packaging that arranges the layers of the laminate according to the stiffness of each layer. Another embodiment of the present invention describes a method and apparatus of packaging a flip chip that uses one or more redundant interconnections at the bottom of the package substrate where the redundant interconnections are within the shadow of the IC chip.
  • Probe Pad Structure In A Ceramic Space Transformer

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  • US Patent:
    7374811, May 20, 2008
  • Filed:
    Apr 5, 2006
  • Appl. No.:
    11/399711
  • Inventors:
    Chi Shih Chang - Austin TX, US
    Bahadir Tunaboylu - Chandler AZ, US
  • Assignee:
    SV Probe Pte Ltd. - Singapore
  • International Classification:
    B32B 3/00
    H01K 1/03
    H05K 1/11
  • US Classification:
    428209, 174255, 174262, 174264, 361803
  • Abstract:
    A method for manufacturing a ceramic device is provided. The ceramic device comprises a ceramic layer. A polyimide layer is on the ceramic layer. The polyimide layer has disposed therein a plurality of copper vias. Each copper via is in physical contact with the ceramic layer. A plurality of pads are formed on the polyimide layer. Each of the plurality of pads is in physical contact with a copper via of the plurality of copper vias. In this way, the pads are supported by a continuous copper arrangement, thereby providing greater support for the probe pads than if the probe pads were supported by the polyimide layer, as the mechanical strength of polyimide layer is lower than the mechanical strength of copper.
  • Transformer Formed In Conjunction With Printed Circuit Board

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  • US Patent:
    61883050, Feb 13, 2001
  • Filed:
    Dec 8, 1995
  • Appl. No.:
    8/569529
  • Inventors:
    Chi Shih Chang - Austin TX
    Michael Joseph Johnson - Raleigh NC
    Craig Neal Johnston - Concord NH
    John Matthew Lauffer - Waverly NY
  • Assignee:
    International Business Machines Corporation - Armonk NY
  • International Classification:
    H01K 4106
  • US Classification:
    336200
  • Abstract:
    A transformer comprises a printed circuit board having elongated conductors printed thereon, a ferrite core having a bottom mounted onto the printed circuit board and a flex circuit. The flex circuit comprises a dielectric sheet and elongated conductors printed on both faces of the sheet. The flex circuit is contoured around a top and sides of the core. The conductors of the flex circuit are surface bonded to respective conductors of the printed circuit board to form a series of primary windings and a series of secondary windings around the core. Provision of the upper portions of the windings by means of the flex circuit is economical because it does not require handling of discrete conductor portions.
  • Process For Making Planar Redistribution Structure

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  • US Patent:
    60001305, Dec 14, 1999
  • Filed:
    Apr 20, 1998
  • Appl. No.:
    9/062816
  • Inventors:
    Chi Shih Chang - Austin TX
    Frank Daniel Egitto - Binghamton NY
  • Assignee:
    International Business Machines Corporation - Armonk NY
  • International Classification:
    H01K 310
  • US Classification:
    29852
  • Abstract:
    A self-supporting redistribution structure for directly mounting a semi-conductor chip to a multilayer electronic substrate is separately fabricated and then laminated to the multilayer substrate. The redistribution structure comprises a dielectric layer having plated vias communicating between its two major surfaces, redistribution lines and input/output pads on its upper major surface and joining patterns on its lower margin surface for electrical connection with the multilayer substrate. The metal plating in the plated vias of the redistribution device connects respective input/output pads on the upper surface of the redistribution structures with the joining patterns on its lower major surface. Input/output pads define an even (planar) topography with the redistribution lines to facilitate flip chip joining.
  • Construction Of Pbga Substrate For Flip Chip Packing

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  • US Patent:
    59593482, Sep 28, 1999
  • Filed:
    Aug 18, 1997
  • Appl. No.:
    8/912271
  • Inventors:
    Chi Shih Chang - Austin TX
    William T. Chen - Endicott NY
    Ajit Trivedi - Endicott NY
  • Assignee:
    International Business Machines Corporation - Armonk NJ
    Sematech, Inc. - Austin TX
  • International Classification:
    H01L 25053
    H01L 2312
    H01L 2314
  • US Classification:
    257700
  • Abstract:
    The present invention discloses techniques that improve the reliability of a flip packages that uses underfill encapsulation. One embodiment of the present invention describes a method and apparatus of packaging a flip chip by relocating the neutral plane of the package substrate away from its mid-plane. Another embodiment of the present invention describes a method and apparatus of arranging the layers of a laminate for use in PBGA packaging that arranges the layers of the laminate according to the stiffness of each layer. Another embodiment of the present invention describes a method and apparatus of packaging a flip chip that uses one or more redundant interconnections at the bottom of the package substrate where the redundant interconnections are within the shadow of the IC chip.
  • Relocating The Neutral Plane In A Pbga Substrate To Eliminate Chip Crack And Interfacial Delamination

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  • US Patent:
    62555995, Jul 3, 2001
  • Filed:
    Aug 18, 1997
  • Appl. No.:
    8/912451
  • Inventors:
    Chi Shih Chang - Austin TX
    William T. Chen - Endicott NY
    Ajit Trivedi - Endicott NY
  • Assignee:
    IBM - Armonk NY
  • International Classification:
    H05K 103
  • US Classification:
    174255
  • Abstract:
    The present invention discloses techniques that improve the reliability of a flip packages that uses underfill encapsulation. One embodiment of the present invention describes a method and apparatus of packaging a flip chip by relocating the neutral plane of the package substrate away from its mid-plane. Another embodiment of the present invention describes a method and apparatus of arranging the layers of a laminate for use in PBGA packaging that arranges the layers of the laminate according to the stiffness of each layer. Another embodiment of the present invention describes a method and apparatus of packaging a flip chip that uses one or more redundant interconnections at the bottom of the package substrate where the redundant interconnections are within the shadow of the IC chip.

Youtube

Cam Cam ha thn thnh bc s th y khm bnh cho khn...

Cam Cam ha thn thnh bc s th y khm bnh cho khng long bo cha - Cam Cam T...

  • Duration:
    8m 19s

Changcady v Cam Cam chi tr xc ct, thi mc ct l...

Changcady v Cam Cam chi tr xc ct, thi mc ct ln xe ben, my xc Nhm Chang...

  • Duration:
    6m 3s

The best song of Ji Chang Wook _ SOUNDTRACK _...

jichangwook #tracklist #ost #cover facebook : instagram : v_tx_k...

  • Duration:
    55m 50s

Ji Chang Wook () & OST || Ji Chang Wook Playl...

Ji Chang Wook () & OST || Ji Chang Wook Playlist Tracklist: (00:00) 01...

  • Duration:
    48m 28s

Changcady b mt con cu nh ch cnh st gip

Changcady b mt con cu nh ch cnh st gip Nh Changcady c nui mt n cu. Nh...

  • Duration:
    10m 10s

Changcady dn Cam Cam vo vn th thm cc con vt :...

Changcady dn Cam Cam vo vn th thm cc con vt : con nga , lc Alpaca, co...

  • Duration:
    11m 40s

Myspace

Chi Chang Photo 11

Chi Chang

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Locality:
Fresno, California
Gender:
Female
Birthday:
1950
Chi Chang Photo 12

Chi Chang

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Locality:
nowhere, California
Gender:
Female
Birthday:
1950
Chi Chang Photo 13

chi chang

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Locality:
Mongolia
Gender:
Male
Birthday:
1933
Chi Chang Photo 14

chi chang

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Locality:
PHOENIX, Arizona
Gender:
Male
Birthday:
1944

Flickr

Classmates

Chi Chang Photo 23

Chi Chang

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Schools:
Dayton Elementary School Dayton NJ 1957-1961
Community:
Jeff Holsten, Michelle Olsen, Marian Covington, Yvonne Williams
Chi Chang Photo 24

Chi Chang

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Schools:
Florida Institue of Technology Melbourne FL 1998-2002
Community:
Denise Jardin, Margaret Innis, Ola Nilsson
Chi Chang Photo 25

Chi Chang (Chi)

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Schools:
Lake Hiawatha Elementary School Lake Hiawatha NJ 1971-1975
Community:
Patricia Larson, John Fagel, Daniel Fischler, Anthony Albert
Chi Chang Photo 26

Chi Min Chang

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Schools:
North Carolina S University Raleigh NC 1978-1982
Community:
Alfred Tadros, Nancy Robbins, Cynthia Bantilan, Ray Stringfield, Khaled Alshuaibi, Susan Rinehardt, Mark Walter, Koopa Narie, Mark Gilliam, Brent Hicks
Chi Chang Photo 27

Chuan-Chi Chang, Martin H...

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Chi Chang Photo 28

Florida Institue of Techn...

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Graduates:
Chang Bae Yim (1979-1983),
Jaime Zedan (1976-1980),
Sultan Alqahtani (1997-2001),
Jacqueline Melaan (1984-1988),
Chi Chang (1998-2002)
Chi Chang Photo 29

Saint Gabriel School, San...

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Graduates:
Barbara Dickerson (1964-1972),
Gloria Corfias (1966-1973),
Kathy West (1964-1972),
Patrick Hines (1956-1963),
Chi Chang Yu (1988-1996),
Robert Devine (1952-1960)
Chi Chang Photo 30

Martin High School, Marti...

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Graduates:
Marcelo Chiriboga (1989-1993),
Johnny Tuck (1951-1955),
Bonnie Andrews (1952-1956),
Chi Chang (1997-2001)

Googleplus

Chi Chang Photo 31

Chi Chang

Work:
Xpec (2011)
Chi Chang Photo 32

Chi Chang

About:
小馬是寶貝~
Chi Chang Photo 33

Chi Chang

Chi Chang Photo 34

Chi Chang

Chi Chang Photo 35

Chi Chang

Chi Chang Photo 36

Chi Chang

Chi Chang Photo 37

Chi Chang

Chi Chang Photo 38

Chi Chang

Facebook

Chi Chang Photo 39

Chi Chi Maru Chang

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Chi Chang Photo 40

Chi Chu Chang

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Chi Chang Photo 41

Chi Shih Chang

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Chi Chang Photo 42

Chi Chi Chang

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Chi Chang Photo 43

Kai Chi Chang

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Chi Chang Photo 44

Chi Yong Chang

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Chi Chang Photo 45

Chi Chang

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Chi Chang Photo 46

Chi Chang

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