Sali Fund Services
General Counsel and Chief Compliance Officer
Sali Fund Management
General Counsel and Chief Compliance Officer
Spinnaker Capital Group Jan 2010 - Dec 2015
Assistant General Counsel and Compliance Officer
Dewey & Leboeuf Llp Aug 2007 - Jan 2010
Senior Associate
Linklaters Sep 2003 - Jun 2007
Us Associate
Education:
Harvard Law School 2000 - 2003
Doctor of Jurisprudence, Doctorates
The University of Texas at Austin 1995 - 1999
Bachelors, Bachelor of Arts, History
Skills:
Hedge Funds Project Finance Derivatives Financial Structuring Joint Ventures International Finance Emerging Markets Structured Finance Restructuring Investments Equities Mergers and Acquisitions Corporate Law Fx Options Corporate Finance Cross Border Transactions
Chi H Chang MD 102 Valentine St, Mount Vernon, NY 10550 9146685353 (Phone)
Certifications:
Physical Medicine & Rehabilitation, 1979
Awards:
Healthgrades Honor Roll
Languages:
English Korean
Hospitals:
Chi H Chang MD 102 Valentine St, Mount Vernon, NY 10550
Mount Vernon Hospital 12 North 7Th Avenue, Mount Vernon, NY 10550
Education:
Medical School Chonnam National University, College Of Medicine Graduated: 1969 Medical School St Lukes Hospital Graduated: 1974 Medical School Bronx Va Med Center Graduated: 1978 Medical School St Lukes Hospital Graduated: 1975
Chi H Chang MD 102 Valentine St, Mount Vernon, NY 10550 9146685353 (phone), 9146683770 (fax)
Education:
Medical School Chonnam Univ Med Sch, Kwangju, So Korea Graduated: 1969
Languages:
English Korean Spanish
Description:
Dr. Chang graduated from the Chonnam Univ Med Sch, Kwangju, So Korea in 1969. He works in Mount Vernon, NY and specializes in Acupuncturist and Physical Medicine & Rehabilitation. Dr. Chang is affiliated with Montefiore Mount Vernon Hospital.
Chonnam National University, College of Medicine - Doctor of Medicine James J. Peters VA Medical Center - Residency - Physical Medicine and Rehabilitation St. Luke's Cornwall Hospital-Newburgh Campus - Residency - Pathology
Board certifications:
American Board of Physical Medicine and Rehabilitation Certification in Physical Medicine and Rehabilitation
The present invention describes a method and apparatus for packaging a flip chip by matching the z-direction CTE of the IC solder joint with the z-direction CTE of the encapsulant. Consideration of the z-direction CTEs is important when determining the volumetric CTE of the encapsulant. This invention first requires a determination of the z-direction CTE of the IC solder joint and a determination of the z-direction CTE of the encapsulant. The invention next matches the z-direction CTE of the IC solder joint to the z-direction CTE of the encapsulant. The matching of the two z-direction CTEs reduces the z-direction tensile or compression stresses on the IC solder joint and the encapsulant.
Placement Of Sacrificial Solder Balls Underneath The Pbga Substrate
Chi Shih Chang - Austin TX William T. Chen - Endicott NY Ajit Trivedi - Endicott NY
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
H05K 712
US Classification:
361771, 361704, 361707, 361712, 361714
Abstract:
The present invention discloses techniques that improve the reliability of a flip packages that uses underfill encapsulation. One embodiment of the present invention describes a method and apparatus of packaging a flip chip by relocating the neutral plane of the package substrate away from its mid-plane. Another embodiment of the present invention describes a method and apparatus of arranging the layers of a laminate for use in PBGA packaging that arranges the layers of the laminate according to the stiffness of each layer. Another embodiment of the present invention describes a method and apparatus of packaging a flip chip that uses one or more redundant interconnections at the bottom of the package substrate where the redundant interconnections are within the shadow of the IC chip.
Placement Of Sacrificial Solder Balls Underneath The Pbga Substrate
The present invention discloses techniques that improve the reliability of a flip packages that uses underfill encapsulation. One embodiment of the present invention describes a method and apparatus of packaging a flip chip by relocating the neutral plane of the package substrate away from its mid-plane. Another embodiment of the present invention describes a method and apparatus of arranging the layers of a laminate for use in PBGA packaging that arranges the layers of the laminate according to the stiffness of each layer. Another embodiment of the present invention describes a method and apparatus of packaging a flip chip that uses one or more redundant interconnections at the bottom of the package substrate where the redundant interconnections are within the shadow of the IC chip.
Probe Pad Structure In A Ceramic Space Transformer
Chi Shih Chang - Austin TX, US Bahadir Tunaboylu - Chandler AZ, US
Assignee:
SV Probe Pte Ltd. - Singapore
International Classification:
B32B 3/00 H01K 1/03 H05K 1/11
US Classification:
428209, 174255, 174262, 174264, 361803
Abstract:
A method for manufacturing a ceramic device is provided. The ceramic device comprises a ceramic layer. A polyimide layer is on the ceramic layer. The polyimide layer has disposed therein a plurality of copper vias. Each copper via is in physical contact with the ceramic layer. A plurality of pads are formed on the polyimide layer. Each of the plurality of pads is in physical contact with a copper via of the plurality of copper vias. In this way, the pads are supported by a continuous copper arrangement, thereby providing greater support for the probe pads than if the probe pads were supported by the polyimide layer, as the mechanical strength of polyimide layer is lower than the mechanical strength of copper.
Transformer Formed In Conjunction With Printed Circuit Board
Chi Shih Chang - Austin TX Michael Joseph Johnson - Raleigh NC Craig Neal Johnston - Concord NH John Matthew Lauffer - Waverly NY
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
H01K 4106
US Classification:
336200
Abstract:
A transformer comprises a printed circuit board having elongated conductors printed thereon, a ferrite core having a bottom mounted onto the printed circuit board and a flex circuit. The flex circuit comprises a dielectric sheet and elongated conductors printed on both faces of the sheet. The flex circuit is contoured around a top and sides of the core. The conductors of the flex circuit are surface bonded to respective conductors of the printed circuit board to form a series of primary windings and a series of secondary windings around the core. Provision of the upper portions of the windings by means of the flex circuit is economical because it does not require handling of discrete conductor portions.
Process For Making Planar Redistribution Structure
Chi Shih Chang - Austin TX Frank Daniel Egitto - Binghamton NY
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
H01K 310
US Classification:
29852
Abstract:
A self-supporting redistribution structure for directly mounting a semi-conductor chip to a multilayer electronic substrate is separately fabricated and then laminated to the multilayer substrate. The redistribution structure comprises a dielectric layer having plated vias communicating between its two major surfaces, redistribution lines and input/output pads on its upper major surface and joining patterns on its lower margin surface for electrical connection with the multilayer substrate. The metal plating in the plated vias of the redistribution device connects respective input/output pads on the upper surface of the redistribution structures with the joining patterns on its lower major surface. Input/output pads define an even (planar) topography with the redistribution lines to facilitate flip chip joining.
Construction Of Pbga Substrate For Flip Chip Packing
Chi Shih Chang - Austin TX William T. Chen - Endicott NY Ajit Trivedi - Endicott NY
Assignee:
International Business Machines Corporation - Armonk NJ Sematech, Inc. - Austin TX
International Classification:
H01L 25053 H01L 2312 H01L 2314
US Classification:
257700
Abstract:
The present invention discloses techniques that improve the reliability of a flip packages that uses underfill encapsulation. One embodiment of the present invention describes a method and apparatus of packaging a flip chip by relocating the neutral plane of the package substrate away from its mid-plane. Another embodiment of the present invention describes a method and apparatus of arranging the layers of a laminate for use in PBGA packaging that arranges the layers of the laminate according to the stiffness of each layer. Another embodiment of the present invention describes a method and apparatus of packaging a flip chip that uses one or more redundant interconnections at the bottom of the package substrate where the redundant interconnections are within the shadow of the IC chip.
Relocating The Neutral Plane In A Pbga Substrate To Eliminate Chip Crack And Interfacial Delamination
Chi Shih Chang - Austin TX William T. Chen - Endicott NY Ajit Trivedi - Endicott NY
Assignee:
IBM - Armonk NY
International Classification:
H05K 103
US Classification:
174255
Abstract:
The present invention discloses techniques that improve the reliability of a flip packages that uses underfill encapsulation. One embodiment of the present invention describes a method and apparatus of packaging a flip chip by relocating the neutral plane of the package substrate away from its mid-plane. Another embodiment of the present invention describes a method and apparatus of arranging the layers of a laminate for use in PBGA packaging that arranges the layers of the laminate according to the stiffness of each layer. Another embodiment of the present invention describes a method and apparatus of packaging a flip chip that uses one or more redundant interconnections at the bottom of the package substrate where the redundant interconnections are within the shadow of the IC chip.
Youtube
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Alfred Tadros, Nancy Robbins, Cynthia Bantilan, Ray Stringfield, Khaled Alshuaibi, Susan Rinehardt, Mark Walter, Koopa Narie, Mark Gilliam, Brent Hicks
Barbara Dickerson (1964-1972), Gloria Corfias (1966-1973), Kathy West (1964-1972), Patrick Hines (1956-1963), Chi Chang Yu (1988-1996), Robert Devine (1952-1960)