Chien Wei Wu

US Patent:

20130279538, Oct 24, 2013

Filed:

Apr 10, 2013

Appl. No.:

13/860137

Inventors:

Bridge Semiconductor Corporation - , US
Pilyeon Park - Santa Clara CA, US
Smitha Shetty - State College PA, US
Chien Hung Wu - Strongsville OH, US

International Classification:

G01K 1/16

US Classification:

374165

Abstract:

A thermal sensor includes a first semi-transparent electrode; a second electrode; a thermally sensitive element positioned between the first and second electrodes; and a coupling layer positioned between the first electrode and the thermally sensitive element, wherein the thermally sensitive element is in electrical communication with the first electrode via the coupling layer and is in electrical communication with the second electrode. An optional second coupling layer may be positioned between the second electrode and the thermally sensitive element, wherein the thermally sensitive element is in electrical communication with the second electrode via the second coupling layer.