Chinh T Nguyen

Address:

16407 Sawyer Knl Ln, Houston, TX 77044

Phone:

2818690756

VIN:

5TDYK3EH4CS060281

Make:

TOYOTA

Model:

HIGHLANDER

Year:

2012

Address:

11823 Cedar Mesa Dr, Houston, TX 77034

VIN:

5TFRM5F18AX004282

Make:

TOYOTA

Model:

TUNDRA

Year:

2010

Address:

9507 Almeda Pne Dr, Houston, TX 77075

Phone:

7139104572

VIN:

JTKDE177370200692

Make:

SCION

Model:

TC

Year:

2007

US Patent:

6566610, May 20, 2003

Filed:

Nov 1, 2001

Appl. No.:

10/032908

Inventors:

Chinh Nguyen - Irvine CA
Phu Hoang - Foothill Ranch CA
Phan Hoang - Mission Viejo CA
Andy Le - Garden Grove CA

Assignee:

Virtium Technology, Inc. - Irvine CA

International Classification:

H05K 116

US Classification:

174260, 29840, 29842

Abstract:

In one embodiment of the invention, a stacking element includes a printed circuit board (PCB) and a plurality of solder bumps. The PCB has a top side and a bottom side. The top side is attached to first pins of a first device. The plurality of solder bumps are on the bottom side and attached to upper areas of second pins of a second device to provide electrical connections between the first pins and the second pins.

US Patent:

7786563, Aug 31, 2010

Filed:

Jun 28, 2007

Appl. No.:

11/824168

Inventors:

Phan Hoang - Placentia CA, US
Chinh Nguyen - Irvine CA, US
Anthony Tran - Fountain Valley CA, US
Tung Dang - Tustin CA, US

Assignee:

Virtium Technology, Inc. - Rancho Santa Margarita CA

International Classification:

H01L 23/02

US Classification:

257686, 257783, 257734, 257E23036, 257E21524

Abstract:

An embodiment of the present invention is a technique to stack multiple devices using an interconnecting element. A board has a periphery and top and bottom surfaces. The top surface has top contact pads to attach to a first device. The bottom surface is milled down to form a cavity confined by vertical walls around the periphery. The cavity fits a second device. Bottom contact pads are formed on bottom side of the vertical walls. The bottom contact pads are raised with respect to the bottom side of the vertical walls. Traces internal to the board connect the bottom contact pads to the top contact pads.

US Patent:

8124450, Feb 28, 2012

Filed:

Jul 27, 2010

Appl. No.:

12/844795

Inventors:

Phan Hoang - Placentia CA, US
Chinh Nguyen - Irvine CA, US
Anthony Tran - Fountain Valley CA, US
Tung Dang - Tustin CA, US

Assignee:

Virtium Technology, Inc. - Rancho Santa Margarita CA

International Classification:

H01L 21/00

US Classification:

438107, 257E21499

Abstract:

An embodiment of the present invention is a technique to stack multiple devices using an interconnecting element. A board has a periphery and top and bottom surfaces. The top surface has top contact pads to attach to a first device. The bottom surface is milled down to form a cavity confined by vertical walls around the periphery. The cavity fits a second device. Bottom contact pads are formed on bottom side of the vertical walls. The bottom contact pads are raised with respect to the bottom side of the vertical walls. Traces internal to the board connect the bottom contact pads to the top contact pads.

US Patent:

20030164247, Sep 4, 2003

Filed:

Apr 1, 2003

Appl. No.:

10/404266

Inventors:

Chinh Nguyen - Irvine CA, US
Phu Hoang - Foothill Ranch CA, US
Phan Hoang - Mission Viejo CA, US
Andy Le - Garden Grove CA, US

International Classification:

H05K001/16

US Classification:

174/260000

Abstract:

In one embodiment of the invention, a stacking element includes a printed circuit board (PCB) and a plurality of solder bumps. The PCB has a top side and a bottom side. The top side is attached to first pins of a first device. The plurality of solder bumps are on the bottom side and attached to upper areas of second pins of a second device to provide electrical connections between the first pins and the second pins.

US Patent:

20180066654, Mar 8, 2018

Filed:

Aug 31, 2017

Appl. No.:

15/692591

Inventors:

- Houston TX, US
Chinh Trung Nguyen - Houston TX, US

International Classification:

F04C 2/107
B23F 15/08

Abstract:

In some embodiments, a method is disclosed for manufacturing an undercut stator from a unitary cylindrical workpiece using broaching techniques. In other embodiments, methods are disclosed for manufacturing undercut and non-undercut stators using friction welding techniques to conjoin threaded end sections to stator sections having helical pathways formed therein.