Chinh Truong Nguyen

US Patent:

6473827, Oct 29, 2002

Filed:

Dec 22, 1998

Appl. No.:

09/218954

Inventors:

Robert James McMillen - Carlsbad CA
Chinh Kim Nguyen - San Diego CA

Assignee:

NCR Corporation - Dayton OH

International Classification:

G06F 1300

US Classification:

710316

Abstract:

An interconnect network having a plurality of identical fabrics partitions the switching elements of the fabrics, so that many links can be combined into single cables. In the partitioning method, one or more of the switching elements from the first stage of each of the fabrics are physically packaged onto the same board called a concentrator, and these concentrators are physically distributed among the processing nodes connected to the interconnect network. The concentrator allows all the links from each processing node to a concentrator, each of which need to be connected to different fabrics, to be combined into a single cable. Furthermore, the concentrator allows all the links from a single switching element in the first stage to be combined into a single cable to be connected to the subsequent or expansion (second and higher) stages of the fabric. The subsequent or expansion stages of each fabric can be implemented independently of other fabrics in a centralized location.

US Patent:

6566610, May 20, 2003

Filed:

Nov 1, 2001

Appl. No.:

10/032908

Inventors:

Chinh Nguyen - Irvine CA
Phu Hoang - Foothill Ranch CA
Phan Hoang - Mission Viejo CA
Andy Le - Garden Grove CA

Assignee:

Virtium Technology, Inc. - Irvine CA

International Classification:

H05K 116

US Classification:

174260, 29840, 29842

Abstract:

In one embodiment of the invention, a stacking element includes a printed circuit board (PCB) and a plurality of solder bumps. The PCB has a top side and a bottom side. The top side is attached to first pins of a first device. The plurality of solder bumps are on the bottom side and attached to upper areas of second pins of a second device to provide electrical connections between the first pins and the second pins.

US Patent:

6795886, Sep 21, 2004

Filed:

Dec 22, 2000

Appl. No.:

09/746915

Inventors:

Chinh K. Nguyen - San Diego CA

Assignee:

NCR Corporation - Dayton OH

International Classification:

G06F 1300

US Classification:

710310, 710316, 370412

Abstract:

An interconnect switch is used to couple input ports and output ports. The interconnect switch includes a central buffer having a number of storage entries to store data units from input ports. When an output port is available, data unit(s) are transferred from the central buffer to an output port. A main pointer queue contains addresses that point to storage entries in the central buffer.

US Patent:

7167373, Jan 23, 2007

Filed:

Mar 8, 2004

Appl. No.:

10/796540

Inventors:

Phan Hoang - Mission Viejo CA, US
Chinh Nguyen - Irvine CA, US
Frank Hoang - Foothill Ranch CA, US
Andy Le - Garden Grove CA, US

Assignee:

Virtium Technology, Inc. - Rancho Santa Margarita CA

International Classification:

H05K 7/06

US Classification:

361749, 361803, 174254, 257686, 29840, 438109

Abstract:

One embodiment of the invention includes a flexible circuit and a stiffener. The flexible circuit has first, second, and third portions. The first portion is folded on an upper surface of the third portion and has first contact elements attached to a first device. The second portion is folded on the first device and has second contact elements attached to a second device. The stiffener is attached to the upper surface of the third portion and located between the upper surface of the third portion and the first portion.

US Patent:

7786563, Aug 31, 2010

Filed:

Jun 28, 2007

Appl. No.:

11/824168

Inventors:

Phan Hoang - Placentia CA, US
Chinh Nguyen - Irvine CA, US
Anthony Tran - Fountain Valley CA, US
Tung Dang - Tustin CA, US

Assignee:

Virtium Technology, Inc. - Rancho Santa Margarita CA

International Classification:

H01L 23/02

US Classification:

257686, 257783, 257734, 257E23036, 257E21524

Abstract:

An embodiment of the present invention is a technique to stack multiple devices using an interconnecting element. A board has a periphery and top and bottom surfaces. The top surface has top contact pads to attach to a first device. The bottom surface is milled down to form a cavity confined by vertical walls around the periphery. The cavity fits a second device. Bottom contact pads are formed on bottom side of the vertical walls. The bottom contact pads are raised with respect to the bottom side of the vertical walls. Traces internal to the board connect the bottom contact pads to the top contact pads.

US Patent:

8124450, Feb 28, 2012

Filed:

Jul 27, 2010

Appl. No.:

12/844795

Inventors:

Phan Hoang - Placentia CA, US
Chinh Nguyen - Irvine CA, US
Anthony Tran - Fountain Valley CA, US
Tung Dang - Tustin CA, US

Assignee:

Virtium Technology, Inc. - Rancho Santa Margarita CA

International Classification:

H01L 21/00

US Classification:

438107, 257E21499

Abstract:

An embodiment of the present invention is a technique to stack multiple devices using an interconnecting element. A board has a periphery and top and bottom surfaces. The top surface has top contact pads to attach to a first device. The bottom surface is milled down to form a cavity confined by vertical walls around the periphery. The cavity fits a second device. Bottom contact pads are formed on bottom side of the vertical walls. The bottom contact pads are raised with respect to the bottom side of the vertical walls. Traces internal to the board connect the bottom contact pads to the top contact pads.

US Patent:

20030110335, Jun 12, 2003

Filed:

Jun 12, 2000

Appl. No.:

09/593033

Inventors:

CHINH NGUYEN - SAN DIEGO CA, US

Assignee:

NCR CORPORATION - DAYTON 45479

International Classification:

G06F013/00
G06F013/38

US Classification:

710/107000

Abstract:

A method and apparatus of performing transactions over a bus includes sending, from a first device, an indication to start a bus transaction. Assertion of a predetermined indication from a second device is waited for. An indication that the first device is ready to transfer data over the bus is asserted after assertion of the predetermined indication. In one arrangement, the bus is a Peripheral Component Interconnect (PCI) bus.

US Patent:

20030164247, Sep 4, 2003

Filed:

Apr 1, 2003

Appl. No.:

10/404266

Inventors:

Chinh Nguyen - Irvine CA, US
Phu Hoang - Foothill Ranch CA, US
Phan Hoang - Mission Viejo CA, US
Andy Le - Garden Grove CA, US

International Classification:

H05K001/16

US Classification:

174/260000

Abstract:

In one embodiment of the invention, a stacking element includes a printed circuit board (PCB) and a plurality of solder bumps. The PCB has a top side and a bottom side. The top side is attached to first pins of a first device. The plurality of solder bumps are on the bottom side and attached to upper areas of second pins of a second device to provide electrical connections between the first pins and the second pins.