Chong H Li

US Patent:

8626921, Jan 7, 2014

Filed:

Apr 21, 2011

Appl. No.:

13/092049

Inventors:

Mark Chekhanovskiy - San Jose CA, US
Mark Carroll - Saratoga CA, US
Siddhartha Dattagupta - Irvine CA, US
John Furlan - Belmont CA, US
Craig Hobbs - Seattle WA, US
Edward James - San Jose CA, US
Insung Kim - Irvine CA, US
Chong Liang Li - Irvine CA, US
Dan Nguyen - Huntington Beach CA, US
Matthew Tebbs - Seattle WA, US

Assignee:

Cisco Technology, Inc. - San Jose CA

International Classification:

G06F 15/173
G06F 15/16

US Classification:

709226, 709228, 709244

Abstract:

A smart network may include a smart network host device as well as one or more client devices configured to connect to the smart network. Each of the client devices may implement one or more services that the client device exposes to other devices connected to the smart network. Each of the client devices includes network layer 2 and 3 attributes as well as network layer 7 application attributes. The application attributes are enumerated as named services, which each client device registers with the smart network host device. When a client device needs access to a named service, the smart network host device uses layer 2, 3, and 7 attributes associated with the client device to select a suitable server for providing the named service to the client device.

US Patent:

20180348827, Dec 6, 2018

Filed:

Jul 23, 2018

Appl. No.:

16/042804

Inventors:

- Cupertino CA, US
Vinh H. Diep - Palo Alto CA, US
Brian L. Chuang - Menlo Park CA, US
Judith C. Segura - San Francisco CA, US
Frank F. Liang - San Jose CA, US
Leanne Bach Lien T. Ly - San Jose CA, US
Kevin Z. Lo - Belmont CA, US
Po W. Chiu - Campbell CA, US
Lukose Ninan - Foster City CA, US
Chong Li - Fremont CA, US

Assignee:

Apple Inc. - Cupertino CA

International Classification:

G06F 1/20
H05K 1/02
H05K 7/20
H05K 9/00

Abstract:

Electronic devices have a PCB with a heat-generating component (e.g., POP or SOC), a heat sink, and an EMI shielding structure. A combination structure can include a top heat spreader/EMI shield located above and in thermal contact with the POP/SOC top, a bottom heat spreader/EMI shield located below and in thermal contact with the POP/SOC bottom, and a heat-directing component located on the PCB, laterally surrounding a majority of the POP/SOC sides, and between and in thermal contact with the top and bottom heat spreaders. Resulting heat paths for the POP/SOC include one through its top to the top heat spreader, another through its bottom to the bottom heat spreader, and others through its sides through the PCB through the heat-directing component to the top and bottom heat spreaders. The heat-directing component can be a metal horseshoe shaped pad integrally formed onto the PCB.

US Patent:

20170071074, Mar 9, 2017

Filed:

Sep 4, 2015

Appl. No.:

14/846526

Inventors:

- Cupertino CA, US
Vinh H. Diep - Palo Alto CA, US
Brian L. Chuang - Menlo Park CA, US
Judith C. Segura - San Francisco CA, US
Frank F. Liang - San Jose CA, US
Leanne Bach Lien T. Ly - San Jose CA, US
Kevin Z. Lo - Belmont CA, US
Po W. Chiu - Campbell CA, US
Lukose Ninan - Foster City CA, US
Chong Li - Fremont CA, US

International Classification:

H05K 7/20
G06F 1/20
H05K 9/00

Abstract:

Electronic devices have a PCB with a heat-generating component (e.g., POP or SOC), a heat sink, and an EMI shielding structure. A combination structure can include a top heat spreader/EMI shield located above and in thermal contact with the POP/SOC top, a bottom heat spreader/EMI shield located below and in thermal contact with the POP/SOC bottom, and a heat-directing component located on the PCB, laterally surrounding a majority of the POP/SOC sides, and between and in thermal contact with the top and bottom heat spreaders. Resulting heat paths for the POP/SOC include one through its top to the top heat spreader, another through its bottom to the bottom heat spreader, and others through its sides through the PCB through the heat-directing component to the top and bottom heat spreaders. The heat-directing component can be a metal horseshoe shaped pad integrally formed onto the PCB.