Christopher C Barnette

US Patent:

7307220, Dec 11, 2007

Filed:

Jan 12, 2005

Appl. No.:

11/034072

Inventors:

Christopher M. Barnette - Dallas TX, US

Assignee:

Hewlett-Packard Development Company, L.P. - Houston TX

International Classification:

H05K 1/03

US Classification:

174255, 174250, 174256, 174262, 361780, 361794, 257691, 257700

Abstract:

Various embodiments of an apparatus, circuit board, and method are disclosed for cable termination. In one embodiment, a surface pad is disposed on a surface of the circuit board. A ground conductor is in the circuit board, the ground conductor being parallel to and collateral to the at least one surface pad. Also, at least one antipad is positioned between the at least one surface pad and the ground conductor, wherein a nonconductive volume extends from the surface pad to the ground conductor through the at least one antipad.

US Patent:

63169444, Nov 13, 2001

Filed:

Apr 29, 2000

Appl. No.:

9/562596

Inventors:

Christopher M. Barnette - Dallas TX
Terrel L. Morris - Garland TX
Douglas B. Fail - Dallas TX
Marvin D. Ross - Dallas TX

Assignee:

Hewlett Packard Company - Palo Alto CA

International Classification:

G01R 2728

US Classification:

324617

Abstract:

The invention accurately determines propagation delay for a sawtooth pattern. Through measurement, the actual delays added per bend in the sawtooth pattern are determined and the values are then used in a CAD tool. The invention can add a known amount of propagation delay to a wire length by routing net wires close together without using a large amount of board space.