Christopher W Cobb

US Patent:

20220246543, Aug 4, 2022

Filed:

Dec 9, 2021

Appl. No.:

17/546184

Inventors:

- Waltham MA, US
Stephen Marinsek - Albuquerque NM, US
Christopher Cobb - Goleta CA, US

International Classification:

H01L 23/00
H01L 27/146

Abstract:

A composite structure includes a first surface and a second surface sandwiched together with a field array of individual and discrete pillars extending therebetween. The plurality of discrete pillars each have a tailored coefficient of thermal expansion and are designed to expand and contract over varying temperatures. The discrete pillars are specifically arranged within the composite structure to compensate for the shrinkage and expansion of different components of a microelectronic hybrid device, to reduce thermal expansion induced deformations imparted on facets of the microelectronic hybrid device under varying temperatures.