Christopher J Horvath

US Patent:

20050077080, Apr 14, 2005

Filed:

Oct 14, 2003

Appl. No.:

10/682969

Inventors:

Adesoji Dairo - Macungie PA, US
Jeffery Gilbert - Schwenksville PA, US
Christopher Horvath - Allentown PA, US
Richard Shook - Fogelsville PA, US
Ebyson Thomas - Allentown PA, US
Brian Vaccaro - Mertztown PA, US

International Classification:

H05K007/06

US Classification:

174255000, 361804000, 174260000, 257778000

Abstract:

The present invention includes tab supports on the solder ball side of a BGA package substrate. The tab supports are preferably sized in a height direction to avoid or prevent a warped corner or edge of a BGA substrate from excessively pressing down on the solder balls when warping occurs, most often during the high temperature solder-reflow process. Exemplary tab supports comprise small standoff tabs placed in all four corners of the lower substrate of a BGA package, and/or on all four edges of the lower substrate. The invention has particular application to a plastic BGA (PBGA) package.