Christopher J Houghton

US Patent:

7131094, Oct 31, 2006

Filed:

Dec 12, 2003

Appl. No.:

10/735549

Inventors:

Herbert R. Kolk - Southborough MA, US
Warren R. Anderson - Westborough MA, US
Christopher L. Houghton - Westborough MA, US
John A. Kowaleski - Princeton MA, US

Assignee:

Hewlett-Packard Development Company, LP. - Houston TX

International Classification:

G06F 17/50

US Classification:

716 12, 716 13, 716 14

Abstract:

A system is provided that includes a CPU, a graphical user interface coupled to the CPU, and a memory coupled to the CPU. The memory stores a bump map application and a data extraction application executed by the CPU. The bump map application displays a plurality of editable textual character groups representative of a plurality of bumps. The textual character groups are arranged on the graphical user interface according to a relative coordinate position of the bumps with respect to an origin. The data extraction application automatically extracts data from the bump map application for use by a router application.

US Patent:

62820958, Aug 28, 2001

Filed:

Apr 27, 2000

Appl. No.:

9/559195

Inventors:

Christopher Lee Houghton - Westborough MA
Colin Edward Brench - Stow MA

Assignee:

Compaq Computer Corporation - Houston TX

International Classification:

H05K 720

US Classification:

361704

Abstract:

A method and apparatus are disclosed for attenuating RF noise produced by electronic systems by providing low RF impedance shorting of heat dissipating structures, such as heat sinks, to PCB reference planes. The RF impedance shorting path uses existing package pins with dedicated electrical paths through the package to the bottom surface of the heat sink. Such an arrangement provides very low RF impedance because of the minimal length and resistance of the shorting path, and also provides minimal disruption of the PCB design rules and tolerances by using existing package leads.

US Patent:

60757000, Jun 13, 2000

Filed:

Feb 2, 1999

Appl. No.:

9/241351

Inventors:

Christopher Lee Houghton - Westborough MA
Colin Edward Brench - Stow MA

Assignee:

Compaq Computer Corporation - Houston TX

International Classification:

H05K 720

US Classification:

361704

Abstract:

A method and apparatus are disclosed for attenuating RF noise produced by electronic systems by providing low RF impedance shorting of heat dissipating structures, such as heat sinks, to PCB reference planes. The RF impedance shorting path uses existing package pins with dedicated electrical paths through the package to the bottom surface of the heat sink. Such an arrangement provides very low RF impedance because of the minimal length and resistance of the shorting path, and also provides minimal disruption of the PCB design rules and tolerances by using existing package leads.