Christopher J Leonard

US Patent:

20050101045, May 12, 2005

Filed:

Nov 7, 2003

Appl. No.:

10/703762

Inventors:

Jennifer Shih - Corvallis OR, US
Valerie Marty - Corvallis OR, US
James Przybyia - Philomath OR, US
Arthur Piehl - Corvallis OR, US
John Williams - Philomath OR, US
Christopher Leonard - Philomath OR, US

International Classification:

H01L021/00

US Classification:

438048000, 438051000

Abstract:

A method of sealing a micro-electromechanical system (MEMS) includes successively depositing and etching a sealing material to seal an opening in the MEMS.

US Patent:

20100231655, Sep 16, 2010

Filed:

Nov 24, 2007

Appl. No.:

12/739066

Inventors:

Bradley D. Chung - Corvallis OR, US
Arun K. Agarwal - Corvallis OR, US
Galen P. Cook - Corvallis OR, US
Sadiq Bengali - Corvallis OR, US
Christopher A. Leonard - Philomath OR, US

Assignee:

Hewlett-Packard Developement Company, L.P. - Houston TX

International Classification:

B41J 2/05

US Classification:

347 62

Abstract:

A printhead die () for an inkjet-printing device includes a substrate (), a heating resistor, and an edge protection layer () The heating resistor is formed on the substrate, and has one or more edges The heating resistor is operative to cause an ink droplet to be ejected from the inkjet-printing device upon sufficient current flowing through the heating resistor resulting in a bubble nucleating within ink at the heating resistor and thereafter collapsing at the heating resistor The edge protection layer covers just the edges of the heating resistor in order to at least substantially protect the heating resistor from becoming damaged due to collapsing of the bubble at the heating resistor

US Patent:

20100283120, Nov 11, 2010

Filed:

Dec 19, 2007

Appl. No.:

12/742300

Inventors:

Andrew Phillips - Corvallis OR, US
Jeremy H. Donaldson - Corvallis OR, US
Julie J. Cox - Albany OR, US
Mark H. MacKenzie - Vancouver WA, US
Christopher A. Leonard - Philomath OR, US

International Classification:

H01L 23/52
H01L 21/326

US Classification:

257529, 438467, 257E23149, 257E21327

Abstract:

Embodiments of a system with first means for forming a chamber adjacent to a component formed on a substrate and a single orifice between the chamber and a first surface of the first means that is opposite a second surface of the first means adjacent to the substrate and second means for enclosing the chamber on at least a portion of the first surface that encompasses the single orifice are disclosed.