Christopher Alan Malone

US Patent:

7068509, Jun 27, 2006

Filed:

Feb 3, 2004

Appl. No.:

10/772115

Inventors:

Cullen E. Bash - San Francisco CA, US
Glenn C. Simon - Auburn CA, US
Christopher G. Malone - Loomis CA, US

Assignee:

Hewlett-Packard Development Company, L.P. - Houston TX

International Classification:

H05K 7/20

US Classification:

361700, 361687, 165 803, 16510433

Abstract:

An enclosure forms a plurality of tiers vertically stacked in a longitudinal dimension. Each tier is a 1U modular computer system having a computer chassis configured for mounting in the multi-tiered support, and computer components that need cooling within the computer chassis. An evaporator is in thermal communication with at least one of the computer components, and vaporizes a coolant to cool that component. A condenser dissipates heat from the coolant vapor, and provides liquid coolant back to the evaporator. The condenser directs liquid coolant gravitationally downward, making the condenser and evaporator gravity driven. An air mover within the chassis cools the condenser, blows air across other components needing cooling, and removes heated air from the chassis.

US Patent:

7203063, Apr 10, 2007

Filed:

May 21, 2004

Appl. No.:

10/849759

Inventors:

Cullen E. Bash - San Francisco CA, US
Glenn C. Simon - Auburn CA, US
Christopher G. Malone - Loomis CA, US
Ratnesh K. Sharma - Union City CA, US

Assignee:

Hewlett-Packard Development Company, L.P. - Houston TX

International Classification:

H05K 7/20

US Classification:

361699, 361695, 361696, 361697, 174 151, 165 804, 16510433

Abstract:

An enclosure forms a plurality of tiers vertically stacked in a longitudinal dimension. Each tier is a 1U modular computer system having a computer chassis configured for mounting in the multi-tiered support, and computer components that need cooling within the computer chassis. A cold plate is in thermal communication with at least one of the computer components, and convectively removes heat from that component using a liquid coolant. A heat exchanger dissipates heat from the liquid coolant, and provides liquid coolant back to the cold plate. An air mover within the chassis cools the heat exchanger, blows air across other components needing cooling, and removes heated air from the chassis. The air mover may extend substantially across the chassis, or it may blow crosswise from an outlet-ventilating direction.

US Patent:

7249718, Jul 31, 2007

Filed:

Jul 20, 2004

Appl. No.:

10/894290

Inventors:

Abdlmonem H. Beitelmal - Los Altos CA, US
Christopher G. Malone - Loomis CA, US
Chandrakant D. Patel - Fremont CA, US

Assignee:

Hewlett-Packard Development Company, L.P. - Houston TX

International Classification:

F24F 7/00
F25D 23/12
H05K 5/00

US Classification:

236 493, 622592, 361690, 361695

Abstract:

A cooling system for an electronic system having at least one heat-generating component includes at least one fan and an operation level setting mechanism. The at least one fan is configured to blow air through the electronic system to thereby dissipate heat generated by the heat-generating component. The operation level setting mechanism is configured to set maximum operation level of the at least one fan, wherein the maximum operation level is based on one or more characteristics of the at least one heat-generating component.

US Patent:

20110239671, Oct 6, 2011

Filed:

Feb 1, 2011

Appl. No.:

13/058576

Inventors:

Christopher G. Malone - Mountain View CA, US
Jimmy Clidaras - Los Altos CA, US
Michael C. Ryan - San Jose CA, US

Assignee:

EXAFLOP LLC - Mountain View CA

International Classification:

G05D 23/19
F25B 49/02
F25D 17/02

US Classification:

62178, 165296, 62 98, 62175, 62180, 62181

Abstract:

A method of providing cooling by a cooling system to a computer data center. The method includes providing a plurality of air-and-water radiators and one or more chillers, the chillers each having a first side in fluid communication with a chilled water loop and a second side in communication with a condenser water loop. The method also includes circulating a first portion of return water coming from the computer data center to a first subset of the air-and-water radiators and through the condenser water loop, circulating a second portion of the return water from the computer data center to a second subset of the air-and-water radiators and through the chilled water loop, and circulating the first portion and the second portion of the return water to the computer data center as cooled supply water.

US Patent:

20210378106, Dec 2, 2021

Filed:

May 28, 2021

Appl. No.:

17/333570

Inventors:

- Mountain View CA, US
Christopher Malone - Mountain View CA, US
Melanie Beauchemin - Mountain View CA, US
Padam Jain - San Jose CA, US
Teckgyu Kang - Saratoga CA, US
Yuan Li - Sunnyvale CA, US
Connor Burgess - Alameda CA, US
Norman Paul Jouppi - Palo Alto CA, US
Yingying Wang - Sunnyvale CA, US

International Classification:

H05K 3/34
H05K 7/20
H01L 23/00

Abstract:

A method of manufacturing a chip assembly comprises joining an in-process unit to a printed circuit board; reflowing a bonding material disposed between and electrically connecting the in-process unit with the printed circuit board, the bonding material having a first reflow temperature; and then joining a heat distribution device to the plurality of semiconductor chips using a thermal interface material (“TIM”) having a second reflow temperature that is lower than the first reflow temperature. The in-process unit further comprises a substrate having an active surface, a passive surface, and contacts exposed at the active surface; an interposer electrically connected to the substrate; a plurality of semiconductor chips overlying the substrate and electrically connected to the substrate through the interposer, and a stiffener overlying the substrate and having an aperture extending therethrough, the plurality of semiconductor chips being positioned within the aperture.

US Patent:

20210378132, Dec 2, 2021

Filed:

May 28, 2020

Appl. No.:

16/885500

Inventors:

- Mountain View CA, US
Melanie Beauchemin - Mountain View CA, US
Christopher Malone - Mountain View CA, US

International Classification:

H05K 7/20
H01M 10/613

Abstract:

A data rack system includes a data center rack frame, a shelf positioned within the data center rack frame; and a modular battery unit disposed on the shelf. The modular battery unit further includes a housing having an outer surface, a plurality of strips of phase change material (“PCM”) attached to the outer surface and spaced apart from one another; and air flow channels. The air flow channels are formed in spaces between two adjacent strips of the plurality of strips and defined by a shape and size of the spaces between the two adjacent strips.

US Patent:

20200373222, Nov 26, 2020

Filed:

Jun 14, 2019

Appl. No.:

16/441998

Inventors:

- Mountain View CA, US
Norman Paul Jouppi - Palo Alto CA, US
Jorge Padilla - Union City CA, US
Christopher Gregory Malone - Mountain View CA, US

International Classification:

H01L 23/473

Abstract:

Methods, systems, and apparatus, including an integrated circuit (IC) with a ring-shaped hot spot area. In one aspect, an IC includes a first area along an outside perimeter of a surface of the IC. The first area defines a first inner perimeter. The IC includes a second area that includes a center of the IC and that includes a first set of components. The second area defines a first outer. The IC includes a ring-shaped hot spot area between the first area and the second area. The ring-shaped hot spot area defines a ring outer perimeter that is juxtaposed with the first inner perimeter. The ring-shaped hot spot area defines a ring inner perimeter that is juxtaposed with the first outer perimeter. The ring-shaped hot spot area includes a second set of components that produce more heat than the first set of components.

US Patent:

20200296862, Sep 17, 2020

Filed:

Jun 2, 2020

Appl. No.:

16/890103

Inventors:

- Mountain View CA, US
Christopher Gregory Malone - Mountain View CA, US
Yuan Li - Sunnyvale CA, US
Jorge Padilla - Union City CA, US
Teckgyu Kang - Saratoga CA, US
Norman Paul Jouppi - Palo Alto CA, US

International Classification:

H05K 7/20

Abstract:

A server tray package includes a motherboard assembly that includes a plurality of data center electronic devices, the plurality of data center electronic devices including at least one heat generating processor device; and a liquid cold plate assembly. The liquid cold plate assembly includes a base portion mounted to the motherboard assembly, the base portion and motherboard assembly defining a volume that at least partially encloses the plurality of data center electronic devices; and a top portion mounted to the base portion and including a heat transfer member shaped to thermally contact the heat generating processor device, the heat transfer member including an inlet port and an outlet port that are in fluid communication with a cooling liquid flow path defined through the heat transfer member.