Christopher P Malone

US Patent:

6409526, Jun 25, 2002

Filed:

Oct 3, 2000

Appl. No.:

09/678079

Inventors:

Christopher G. Malone - Folsom CA
Glenn C. Simon - Auburn CA
Dennis C. Thompson - late of Roseville CA

Assignee:

Hewlett-Packard Company - Palo Alto CA

International Classification:

H01R 1362

US Classification:

439160, 439 75

Abstract:

A mechanism for use in insertion and extraction of a first printed circuit board (PCB) to and from a second PCB so as to engage and disengage an electrical connector of the first PCB to and from a corresponding electrical connector of the second PCB. The insertion and extraction mechanism includes a stiffener bar and a mounting block. The stiffener bar is affixed to the first PCB immediately adjacent to the electrical connector for stiffening the first PCB in the vicinity of the electrical connector. The mounting block is affixed to the second PCB immediately adjacent to the corresponding electrical connector. A threaded fastener is carried by the stiffener bar and is engageable with the mounting block. Rotation of the fastener in a first direction causes the first PCB to be inserted to the second PCB which causes the electrical connector to be engaged with the corresponding electrical connector. Rotation of the fastener in a second direction causes the first PCB to be extracted from the second PCB which causes the electrical connector to be disengaged from the corresponding electrical connector.

US Patent:

6454587, Sep 24, 2002

Filed:

Oct 27, 2000

Appl. No.:

09/698559

Inventors:

Christopher G. Malone - Folsom CA

Assignee:

Hewlett-Packard Company - Palo Alto CA

International Classification:

H01R 1362

US Classification:

439331, 439 73

Abstract:

A mounting assembly for providing bus termination of a signal line on a printed circuit board (PCB). The mounting assembly includes a connector arrangement, a bus termination device, pressure plate and a clamping mechanism. The bus termination device is received by the connector arrangement, such that electrical interface elements of the bus termination device engage electrical interface elements of the connector arrangement to provide electrical communication between the connector arrangement and the signal line of the PCB. The clamping mechanism is engageable with the bus termination device for maintaining electrical contact between the electrical interface elements for securing the connector arrangement and bus termination device to the PCB. The pressure plate member is interposed between the clamping mechanism and the bus termination board. The pressure plate member protects resistor packages on the bus termination device from damage as a result of clamping forces imparted by the clamping mechanism to the bus termination board through the pressure plate member.

US Patent:

6483700, Nov 19, 2002

Filed:

Aug 17, 2001

Appl. No.:

09/932035

Inventors:

Christopher Gregory Malone - Folsom CA
Stephan Karl Barsun - Auburn CA
Thomas J. Augustin - El Dorado Hills CA

Assignee:

Hewlett-Packard Company - Palo Alto CA

International Classification:

H05K 720

US Classification:

361690, 361692, 361694, 361695, 174 151, 16510453, 454184

Abstract:

A method and apparatus to provide air-flow balancing with a card guide frame. One embodiment of the invention involves a method to assemble an air-flow balancing card guide frame and one or more substrates. A second embodiment of the invention involves a method to design an air-flow balancing card guide frame. A third embodiment of the invention involves an assembled air-flow balancing card guide frame and one or more substrates.

US Patent:

6508653, Jan 21, 2003

Filed:

Sep 29, 2000

Appl. No.:

09/675369

Inventors:

Christopher G. Malone - Folsom CA
Glenn C. Simon - Auburn CA

Assignee:

Hewlett-Packard Company - Palo Alto CA

International Classification:

H01R 466

US Classification:

439 92, 439607, 439939

Abstract:

A bulkhead plate member for providing an attenuating barrier for electromagnetic interference (EMI) noise in a computer system housing. The bulkhead plate member includes a rectangular shaped main portion having a material thickness. The main portion has a plurality of edge walls defining an opening for receiving a peripheral component connector affixed to a printed circuit board (PCB). The edge walls are adapted to contact side walls of the peripheral component connector to provide contact regions substantially perpendicular to the main portion and greater than the material thickness of the main portion, such that EMI noise is conducted through the bulkhead plate member, at the edge walls of the opening, to a bulkhead wall of the computer system housing thereby suppressing the EMI noise. The edge walls of the opening provides increased surface area contact between the bulkhead plate member and the peripheral component connector to maximize the attenuation of EMI noise around the connector.

US Patent:

6595014, Jul 22, 2003

Filed:

Aug 31, 2001

Appl. No.:

09/943797

Inventors:

Christopher G. Malone - Folsom CA
Cullen E. Bash - San Francisco CA
Chandrakant D. Patel - Fremont CA

Assignee:

Hewlett-Packard Development Company, L.P. - Houston TX

International Classification:

F28D 300

US Classification:

62171, 622592, 16510433, 361699

Abstract:

A cooling system for cooling one or more components that produce heat. The cooling system includes sprayers configured to spray cooling fluid toward the components. A detection system includes a radiation source and a radiation sensor that pass radiant energy in the vicinity of the component such that the radiant energy is affected by passing through the vaporizing spray coolant. A controller controls the flow rates of the sprayers in response to levels of radiant energy detected by the radiation sensor, allowing the controller to more accurately control the wall temperature and cooling regime achieved by the spray cooling. The source and sensor are aimable or otherwise configured for gathering information for different thermal zones of the component, providing the controller with information that is helpful in separately controlling the wall temperature and/or cooling regime in each zone.

US Patent:

6625018, Sep 23, 2003

Filed:

Jun 26, 2002

Appl. No.:

10/183151

Inventors:

Thomas J. Augustin - El Dorado Hills CA
Stephan Karl Barsun - Auburn CA
Christopher Gregory Malone - Rocklin CA

Assignee:

Hewlett-Packard Development Company, L.P. - Houston TX

International Classification:

H05K 720

US Classification:

361690, 361692, 361719, 165 803, 3122232

Abstract:

A fluid-flow balancer mimics the air-flow resistance of a component omitted from an electronic system so that omission causes little or no disruption to or alteration of the flow of a cooling fluid. This prevents overheating that such disruption or alteration may otherwise cause. In addition, the fluid-flow balancer may also mimic the EMI suppression characteristics of the omitted component. Thus, a system not fully populated with components can still be adequately cooled and shielded without changing the cooling or shielding systems.

US Patent:

6633491, Oct 14, 2003

Filed:

Aug 17, 2001

Appl. No.:

09/932372

Inventors:

Christopher Gregory Malone - Folsom CA
Stephan Karl Barsun - Auburn CA
Thomas J. Augustin - El Dorado Hills CA

Assignee:

Hewlett-Packard Development Company, L.P. - Houston TX

International Classification:

H02B 10052

US Classification:

361825, 361801, 361804, 361742, 361758, 361796, 211 4117

Abstract:

A method and apparatus to support varying sizes of memory cards against shock and vibration. One embodiment of the invention involves a method to assemble a support clip to one or more cards attached on a substrate by a connector. A second embodiment of the invention involves a method to fabricate a support clip. A third embodiment of the invention involves an assembled substrate with a plurality of cards secured by one or more support clips to the substrate.

US Patent:

6667885, Dec 23, 2003

Filed:

Jul 20, 2001

Appl. No.:

09/909512

Inventors:

Christopher Gregory Malone - Folsom CA
Stephen Daniel Cromwell - Penryn CA
Christian Laszlo Belady - Mckinney TX
Eric Clarence Peterson - Mckinney TX

Assignee:

Hewlett-Packard Development Company, L.P. - Houston TX

International Classification:

H05K 720

US Classification:

361700, 16510433, 165 803, 174 152, 257715, 257719, 361701, 361703, 361719, 361720

Abstract:

A method and apparatus to attach multiple components to a common heat dissipation device. One embodiment of the invention involves a method to assemble a plurality of components on a substrate to a heat dissipation device. A second embodiment of the invention involves another method to assemble a plurality of components on a substrate to a heat dissipation device containing one or more heat-pipes. A third embodiment of the invention involves an assembled substrate with a plurality of electrical components attached to a common heat dissipation device.