Christopher W Malone

US Patent:

6646341, Nov 11, 2003

Filed:

Feb 20, 2002

Appl. No.:

10/080010

Inventors:

Harold Miyamura - San Jose CA
Christopher G. Malone - Folsom CA

Assignee:

Hewelett-Packard Development Company, L.P. - Houston TX

International Classification:

H01L 2334

US Classification:

257719, 257712, 257717, 257718, 257675

Abstract:

In one embodiment, the present invention is a heat sink apparatus comprising a heat sink device and a heat sink shroud. The heat sink device is for transferring heat from a heat source. The heat sink shroud is thermally coupled with the heat sink device. Hence, the heat sink shroud transfers heat from the heat sink device and dissipates the heat generated by the heat source.

US Patent:

7068509, Jun 27, 2006

Filed:

Feb 3, 2004

Appl. No.:

10/772115

Inventors:

Cullen E. Bash - San Francisco CA, US
Glenn C. Simon - Auburn CA, US
Christopher G. Malone - Loomis CA, US

Assignee:

Hewlett-Packard Development Company, L.P. - Houston TX

International Classification:

H05K 7/20

US Classification:

361700, 361687, 165 803, 16510433

Abstract:

An enclosure forms a plurality of tiers vertically stacked in a longitudinal dimension. Each tier is a 1U modular computer system having a computer chassis configured for mounting in the multi-tiered support, and computer components that need cooling within the computer chassis. An evaporator is in thermal communication with at least one of the computer components, and vaporizes a coolant to cool that component. A condenser dissipates heat from the coolant vapor, and provides liquid coolant back to the evaporator. The condenser directs liquid coolant gravitationally downward, making the condenser and evaporator gravity driven. An air mover within the chassis cools the condenser, blows air across other components needing cooling, and removes heated air from the chassis.

US Patent:

7203063, Apr 10, 2007

Filed:

May 21, 2004

Appl. No.:

10/849759

Inventors:

Cullen E. Bash - San Francisco CA, US
Glenn C. Simon - Auburn CA, US
Christopher G. Malone - Loomis CA, US
Ratnesh K. Sharma - Union City CA, US

Assignee:

Hewlett-Packard Development Company, L.P. - Houston TX

International Classification:

H05K 7/20

US Classification:

361699, 361695, 361696, 361697, 174 151, 165 804, 16510433

Abstract:

An enclosure forms a plurality of tiers vertically stacked in a longitudinal dimension. Each tier is a 1U modular computer system having a computer chassis configured for mounting in the multi-tiered support, and computer components that need cooling within the computer chassis. A cold plate is in thermal communication with at least one of the computer components, and convectively removes heat from that component using a liquid coolant. A heat exchanger dissipates heat from the liquid coolant, and provides liquid coolant back to the cold plate. An air mover within the chassis cools the heat exchanger, blows air across other components needing cooling, and removes heated air from the chassis. The air mover may extend substantially across the chassis, or it may blow crosswise from an outlet-ventilating direction.

US Patent:

7249718, Jul 31, 2007

Filed:

Jul 20, 2004

Appl. No.:

10/894290

Inventors:

Abdlmonem H. Beitelmal - Los Altos CA, US
Christopher G. Malone - Loomis CA, US
Chandrakant D. Patel - Fremont CA, US

Assignee:

Hewlett-Packard Development Company, L.P. - Houston TX

International Classification:

F24F 7/00
F25D 23/12
H05K 5/00

US Classification:

236 493, 622592, 361690, 361695

Abstract:

A cooling system for an electronic system having at least one heat-generating component includes at least one fan and an operation level setting mechanism. The at least one fan is configured to blow air through the electronic system to thereby dissipate heat generated by the heat-generating component. The operation level setting mechanism is configured to set maximum operation level of the at least one fan, wherein the maximum operation level is based on one or more characteristics of the at least one heat-generating component.

US Patent:

8074456, Dec 13, 2011

Filed:

Oct 29, 2008

Appl. No.:

12/260741

Inventors:

Amip J. Shah - Santa Clara CA, US
Cullen E. Bash - Los Gatos CA, US
Christopher Gregory Malone - Mountain View CA, US

Assignee:

Hewlett-Packard Development Company, L.P. - Houston TX

International Classification:

F25B 21/02

US Classification:

62 32, 622592

Abstract:

A thermal management system includes a first thermoelectric module, a second thermoelectric module, and a heat exchanger. The heat exchanger has a pipe having a first section, a second section and an intermediate section arranged between the first section and the second section. The intermediate section maintains the first section and the second section in spaced apart planes and the first thermoelectric module is thermally attached to the first section and the second thermoelectric module is thermally attached to the second section. The first thermoelectric module is spaced apart from the second thermoelectric module to enable fluid to flow between the first thermoelectric module and the second thermoelectric module.

US Patent:

20110239671, Oct 6, 2011

Filed:

Feb 1, 2011

Appl. No.:

13/058576

Inventors:

Christopher G. Malone - Mountain View CA, US
Jimmy Clidaras - Los Altos CA, US
Michael C. Ryan - San Jose CA, US

Assignee:

EXAFLOP LLC - Mountain View CA

International Classification:

G05D 23/19
F25B 49/02
F25D 17/02

US Classification:

62178, 165296, 62 98, 62175, 62180, 62181

Abstract:

A method of providing cooling by a cooling system to a computer data center. The method includes providing a plurality of air-and-water radiators and one or more chillers, the chillers each having a first side in fluid communication with a chilled water loop and a second side in communication with a condenser water loop. The method also includes circulating a first portion of return water coming from the computer data center to a first subset of the air-and-water radiators and through the condenser water loop, circulating a second portion of the return water from the computer data center to a second subset of the air-and-water radiators and through the chilled water loop, and circulating the first portion and the second portion of the return water to the computer data center as cooled supply water.

US Patent:

20230064855, Mar 2, 2023

Filed:

Oct 12, 2022

Appl. No.:

18/046055

Inventors:

- Mountain View CA, US
Jyoti Sastry - Santa Clara CA, US
James Kennedy - San Jose CA, US
Eduardo Lao - Fremont CA, US
Christopher Gregory Malone - Mountain View CA, US
Pascal Kam - Union City CA, US

International Classification:

H05K 7/14
G06F 1/26

Abstract:

A data center power system includes an electrical power conductor that includes a live conductor surface and is configured to carry electrical power from a power source through a human-occupiable workspace of a data center. The live conductor surface includes a rail configured to mount to a floor of the data center. The data power system further includes a grounded conductor positioned in the human-occupiable workspace apart from the electrical power conductor; a first electrical connector configured to mount to a data center rack that supports a plurality of electronic devices and moveable to electrically contact the live conductor surface of the electrical power conductor; and a second electrical conductor positioned on the rack and configured to electrically contact the grounded conductor.

US Patent:

20210378106, Dec 2, 2021

Filed:

May 28, 2021

Appl. No.:

17/333570

Inventors:

- Mountain View CA, US
Christopher Malone - Mountain View CA, US
Melanie Beauchemin - Mountain View CA, US
Padam Jain - San Jose CA, US
Teckgyu Kang - Saratoga CA, US
Yuan Li - Sunnyvale CA, US
Connor Burgess - Alameda CA, US
Norman Paul Jouppi - Palo Alto CA, US
Yingying Wang - Sunnyvale CA, US

International Classification:

H05K 3/34
H05K 7/20
H01L 23/00

Abstract:

A method of manufacturing a chip assembly comprises joining an in-process unit to a printed circuit board; reflowing a bonding material disposed between and electrically connecting the in-process unit with the printed circuit board, the bonding material having a first reflow temperature; and then joining a heat distribution device to the plurality of semiconductor chips using a thermal interface material (“TIM”) having a second reflow temperature that is lower than the first reflow temperature. The in-process unit further comprises a substrate having an active surface, a passive surface, and contacts exposed at the active surface; an interposer electrically connected to the substrate; a plurality of semiconductor chips overlying the substrate and electrically connected to the substrate through the interposer, and a stiffener overlying the substrate and having an aperture extending therethrough, the plurality of semiconductor chips being positioned within the aperture.