Christopher J Sullivan

US Patent:

6365974, Apr 2, 2002

Filed:

Mar 21, 2000

Appl. No.:

09/531387

Inventors:

Donald C. Abbott - Norton MA
Raymond A. Frechette - North Providence RI
Robert Sabo - Smithfield RI
Steve Smith - Lincoln RI
Christopher Sullivan - Rochester MA
David West - Pembroke MA

Assignee:

Texas Instruments Incorporated - Dallas TX

International Classification:

H01L 2348

US Classification:

257774, 257723, 257686

Abstract:

A double sided electrical connection flexible circuit particularly useful as a substrate for an area array integrated package, and the method of fabricating the structure is described. A circuit having interconnections on one surface and solder ball contact pads on the second surface are interconnected by copper plated from a single surface in order to avoid entrapment of air pockets. In one embodiment, the conductive vias are formed from a copper film which extends from the solder ball contact pads, which may be indented, providing a well for solder balls in the contact pad.

US Patent:

6915566, Jul 12, 2005

Filed:

Feb 28, 2000

Appl. No.:

09/514762

Inventors:

Donald C. Abbott - Norton MA, US
John E. Cotugno - Little Compton RI, US
Robert M. Fritzsche - Attleboro MA, US
Robert A. Sabo - Smithfield RI, US
Christopher M. Sullivan - Rochester MA, US
David W. West - Pembroke MA, US

Assignee:

Texas Instruments Incorporated - Dallas TX

International Classification:

H01K003/10

US Classification:

29852, 29846, 29825, 29830, 174264, 174254, 174250, 174255, 174262

Abstract:

A method for the fabrication of a double-sided electrical interconnection flexible circuit () particularly useful as a substrate for an area array integrated circuit package. A copper matrix with studs () is pressed through a dielectric film () having a copper layer on the opposite surface, thereby forming an intermediate structure for a flex circuit with self-aligned solid copper vias in a one step process. The contacts are reinforced by plating both surfaces with a layer of copper, and conventional processes are used to complete the circuit patterning.

US Patent:

7084651, Aug 1, 2006

Filed:

Jul 28, 2004

Appl. No.:

10/710677

Inventors:

David M. Audette - Colchester VT, US
David L. Gardell - Fairfax VT, US
John F. Hagios - Williston VT, US
Christopher L. Sullivan - Colchester VT, US

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

G01R 31/02

US Classification:

324754, 324758, 3241581

Abstract:

A method and apparatus for testing, the apparatus including: a probe array mounted on an inner portion of a gimbaled bearing, the inner portion of the gimbaled bearing having a spherical surface defined by a surface of a first sphere between two parallel small circles of the first sphere, a radius of the first sphere centered on a point on a top surface of the probe array; and an outer portion of the gimbaled bearing, the outer portion of the gimbaled bearing having a spherical surface defined by the surface of a second sphere between two parallel small circles of the second sphere, a radius of the second sphere centered on the point on the top surface of the probe array.

US Patent:

7591955, Sep 22, 2009

Filed:

Jul 13, 2006

Appl. No.:

11/457369

Inventors:

Raymond A. Frechette - North Providence RI, US
David W. West - Pembroke MA, US
Christopher Machado - Swansea MA, US
Christopher M. Sullivan - Acushnet MA, US

Assignee:

Interplex NAS, Inc. - College Point NY

International Classification:

C23F 1/00
B44C 1/22

US Classification:

216 11, 216 41, 216 49, 216 56, 216 83, 216100, 216108, 134 3, 427327

Abstract:

A metal processing method includes etching to remove material from a thin metal part. A pattern of etch resistant material is used to prevent etching of the metal in desired locations. The etch resistant material is intentionally applied to unclean surfaces so that an adhesion between the etch resistant material and the metal will fail during the etching process. An edge is formed during etching at the boundaries of the pattern of the etch resistant material. These edges are rounded where the adhesion fails. A shaver foil is produced using the described metal processing method including a face side, a cutter side and a plurality of whisker holes. A face edge is formed where an etched profile of the whisker hole meets the face side and a cutter edge is formed where the etched profile of the whisker hole meets the cutter side. The face edge is rounded using the aforementioned process and the cutter edge is sharp using a conventional etch resistant material application method.

US Patent:

7688089, Mar 30, 2010

Filed:

Jan 25, 2008

Appl. No.:

12/019807

Inventors:

David M. Audette - Colchester VT, US
John F. Hagios - Charlotte VT, US
Christopher L Sullivan - Colchester VT, US

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

G01R 31/02

US Classification:

324754, 324762

Abstract:

A probe test head for a high density pin count integrated circuit, includes: a flexible membrane; an array of conductive structures, each one of the structures including a mechanically compliant probe tip affixed to the membrane, such that an attachment point enables mechanical actuation of the probe tip through a conductive member parallel to the membrane. A method for fabrication and measurement apparatus are provided.

US Patent:

8640324, Feb 4, 2014

Filed:

Dec 7, 2009

Appl. No.:

12/631916

Inventors:

David M. Audette - Essex Junction VT, US
John F. Hagios - Essex Junction VT, US
Christopher L. Sullivan - Essex Junction VT, US

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

G01R 31/28

US Classification:

29593, 29844, 174261

Abstract:

A method for fabricating a compliant membrane probe for communication with an integrated circuit includes installing an array of conductive structures within a flexible membrane, the conductors comprising a beam structure having a first end and a second end, with each one of the conductors further comprising a probe tip extending from the first end, the probe tip having a throat generally surrounded by material of the flexible membrane and a head at an end of the throat such that the head is disposed at an opposite side of the flexible membrane with respect to the beam structure; and configuring the second end of the beam structure so as to be supported by a first end of the beam structure of an adjacent conductor thereto.

US Patent:

20020078836, Jun 27, 2002

Filed:

Oct 25, 2001

Appl. No.:

10/001603

Inventors:

John Goyette - Attleboro MA, US
Joel Allegrezza - Uxbridge MA, US
Charles Battersby - Sturbridge MA, US
Christopher Sullivan - Rochester MA, US

International Classification:

B31F001/07
B44B005/00

US Classification:

101/016000

Abstract:

An alternative stamp die is designed with tapered areas and non-tapered areas to provide for a longer lived stamp die while avoiding the problems associated with slug pulling.

US Patent:

20040052948, Mar 18, 2004

Filed:

Jun 3, 2003

Appl. No.:

10/453300

Inventors:

Dana Gronbeck - Holliston MA, US
Michael Gallagher - Hopkinton MA, US
Jeffrey Calvert - Acton MA, US
Christopher Sullivan - Randolph MA, US

Assignee:

Shipley Company, L.L.C.

International Classification:

B05D003/00

US Classification:

427/299000, 427/402000

Abstract:

Treatment procedures for organic polysilica layers are provided that improve the adhesion of layers of material that are subsequently applied to the treated organic polysilica layers. In particular, layers of organic polymeric material have improved adhesion to such treated organic polysilica layers. These treatment procedures are particularly useful in the manufacture of electronic devices, such as integrated circuits, wherein the organic polysilica layers are used as dielectric materials, cap layers, etch stops and the like.