Chun Chi Lin

US Patent:

55023061, Mar 26, 1996

Filed:

Mar 17, 1994

Appl. No.:

8/214377

Inventors:

Dan Meisburger - San Jose CA
Alan D. Brodie - Palo Alto CA
Curt Chadwick - Los Gatos CA
Anil Desai - San Jose CA
Hans Dohse - Pleasanton CA
Dennis Emge - San Jose CA
John Greene - Los Altos CA
Ralph Johnson - Los Gatos CA
John McMurtry - Menlo Park CA
Barry Becker - San Jose CA
Ray Paul - Palo Alto CA
Mike Robinson - San Jose CA
Richard Simmons - Los Altos CA
David E. A. Smith - San Mateo CA
John Taylor - San Jose CA
Lee Veneklasen - Castro Valley CA
Dean Walters - Napierville IL
Paul Wieczorek - San Jose CA
Sam Wong - San Jose CA
April Dutta - Milpitas CA
Surendra Lele - Santa Clara CA
Kirkwood Rough - San Jose CA
Henry Pearce-Percy - Los Gatos CA
Jack Y. Jau - Fremont CA
Chun C. Lin - Cupertino CA
Hoi T. Nguyen - Milpitas CA
Yen-Jen Oyang - Cupertino CA
Timothy L. Hutcheson - Los Gatos CA
David J. Clark - Atherton CA
Chung-Shih Pan - Palo Alto CA
Chetana Bhaskar - San Jose CA
Chris Kirk - Beconsfield Bucks, GB2
Eric Munro - London, GB2

Assignee:

KLA Instruments Corporation - San Jose CA

International Classification:

H01J 3726

US Classification:

250310

Abstract:

There is disclosed numerous embodiments of a method and apparatus for a particle scanning system and an automatic inspection system. In each of these a particle beam is directed at the surface of a substrate for scanning that substrate. Also included are a selection of detectors to detect at least one of the secondary particles, back-scattered particles and transmitted particles from the substrate. The substrate is mounted on an x-y stage to provide it with at least one degree of freedom while the substrate is being scanned by the/particle beam. The substrate is also subjected to an electric field on it's surface to accelerate the secondary particles. The system also has the capability to accurately measure the position of the substrate with respect to the charged particle beam. Additionally, there is an optical alignment means for initially aligning the substrate beneath the,particle beam means. To function most efficiently there is also a vacuum means for evacuating and repressurizing a chamber containing the substrate.

US Patent:

20090075097, Mar 19, 2009

Filed:

Jul 25, 2008

Appl. No.:

12/179846

Inventors:

Cherie R. Kagan - Ossining NY, US
Chun Lin - Croton-On-Hudson NY, US

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

B32B 9/04

US Classification:

428450, 428704

Abstract:

The present invention provides a process for preparing a thin film having alternating monolayers of a metal-metal bonded complex monolayer and an organic monolayer by layer-by-layer growth. The process comprises the steps of: (1) applying onto a surface of a substrate a first linker compound to produce a primer layer; (2) applying onto said primer layer a layer of a metal-metal bonded complex to produce a metal-metal bonded complex monolayer on said primer layer; (3) applying onto said metal-metal bonded complex monolayer a second linker compound; and optionally (4) sequentially repeating steps (2) and (3) at least once to produce said layer-by-layer grown thin film having alternating monolayers of a metal-metal bonded complex monolayer and an organic monolayer.

US Patent:

20070148441, Jun 28, 2007

Filed:

Mar 9, 2007

Appl. No.:

11/684506

Inventors:

Cherie Kagan - Ossining NY, US
Chun Lin - Croton-On-Hudson NY, US

Assignee:

INTERNATIONAL BUSINESS MACHINES CORPORATION - Armonk NY

International Classification:

B32B 9/04
B05D 3/10
B05D 7/00

US Classification:

428333000, 428447000, 428411100, 427301000, 427333000, 427407100, 977882000, 977883000

Abstract:

The present invention provides a process for preparing a thin film having alternating monolayers of a metal-metal bonded complex monolayer and an organic monolayer by layer-by-layer growth. The process comprises the steps of: (1) applying onto a surface of a substrate a first linker compound to produce a primer layer; (2) applying onto said primer layer a layer of a metal-metal bonded complex to produce a metal-metal bonded complex monolayer on said primer layer;(3) applying onto said metal-metal bonded complex monolayer a second linker compound; and optionally(4) sequentially repeating steps (2) and (3) at least once to produce said layer-by-layer grown thin film having alternating monolayers of a metal-metal bonded complex monolayer and an organic monolayer.

Address:

13732 Laburnum Ave, Flushing, NY 11355

VIN:

5J8TB18569A001191

Make:

ACURA

Model:

RDX

Year:

2009

Address:

4043 97 St APT 3F, Corona, NY 11368

VIN:

JTMZD33V076035407

Make:

TOYOTA

Model:

RAV4

Year:

2007

Address:

1491 Vernal Ave, Fremont, CA 94539

VIN:

19UUA66297A024748

Make:

ACURA

Model:

TL

Year:

2007