Clayton E Judd

US Patent:

6766679, Jul 27, 2004

Filed:

Mar 27, 2002

Appl. No.:

10/113755

Inventors:

Clayton E. Judd - Buda TX
Justo Bryand, Jr. - Pflugerville TX

Assignee:

Lam Research Corporation - Fremont CA

International Classification:

G01L 2500

US Classification:

73 115

Abstract:

An invention is provided for spindle downforce calibration. The system includes a calibration wafer carrier having a calibration load cell recess, and a calibration load cell disposed within the calibration load cell recess. The system further includes a meter in communication with the calibration load cell. In operation, the calibration load cell measures a downward force applied to the to the calibration wafer carrier. The measurement can be taken when the calibration wafer carrier is positioned substantially at a polishing height, which is substantially equivalent to a height of a normal wafer carrier during a chemical mechanical polishing (CMP) operation. In one aspect, the measured downward force is compared to a tool downward force measurement that is measured using a tool load cell, which is generally utilized to measure tool downward force during a normal CMP process.