Clive Reed Hendricks

US Patent:

7884695, Feb 8, 2011

Filed:

Jun 30, 2006

Appl. No.:

11/428307

Inventors:

Larry E. Mosley - Santa Clara CA, US
Clive R. Hendricks - Gilbert AZ, US

Assignee:

Intel Corporation - Santa Clara CA

International Classification:

H01F 5/00

US Classification:

336200, 336223

Abstract:

A low-resistance inductor is made from a plurality of first inter-abutting insulated electrode coil sub-segments that is coupled to a plurality of second intra-abutting insulated electrode coil sub-segments that are contiguous to the plurality of first intra-abutting coil sub-segments. The first plurality and the second plurality form an helical inductor unit cell. A process of forming the low-resistance inductor includes heat curing. A system includes a low-resistance inductor and a mounting substrate.

US Patent:

20080001253, Jan 3, 2008

Filed:

Jun 30, 2006

Appl. No.:

11/428331

Inventors:

Larry E. Mosley - Santa Clara CA, US
Clive R. Hendricks - Gilbert AZ, US

International Classification:

H01L 29/00

US Classification:

257532

Abstract:

A low-inductance capacitor exhibits a first characteristic inductance during use in a first capacitor subsection and a second characteristic inductance during use in a second capacitor subsection, and the first and second characteristic inductances act to neutralize each other. A process of forming the low-inductance capacitor includes heat curing. A package includes a low-inductance capacitor and a mounting substrate.

US Patent:

20210104475, Apr 8, 2021

Filed:

Oct 8, 2019

Appl. No.:

16/596328

Inventors:

- Santa Clara CA, US
Krishna BHARATH - Phoenix AZ, US
Clive HENDRICKS - Gilbert AZ, US

International Classification:

H01L 23/64
H01F 17/00
H01F 17/04
H01F 41/04
H01F 41/12
H01F 27/32
H01L 23/498
H01L 21/48
H01L 23/00

Abstract:

Embodiments include an inductor, a method to form the inductor, and a semiconductor package. An inductor includes a plurality of plated-through-hole (PTH) vias in a substrate layer, and a plurality of magnetic interconnects with a plurality of openings in the substrate layer. The openings of the magnetic interconnects surround the PTH vias. The inductor also includes an insulating layer in the substrate layer, a first conductive layer over the PTH vias, magnetic interconnects, and insulating layer, and a second conductive layer below the PTH vias, magnetic interconnects, and insulating layer. The insulating layer surrounds the PTH vias and magnetic interconnects. The magnetic interconnects may have a thickness substantially equal to a thickness of the PTH vias. The magnetic interconnects may be shaped as hollow cylindrical magnetic cores with magnetic materials. The magnetic materials may include ferroelectric, conductive, or epoxy materials. The hollow cylindrical magnetic cores may be ferroelectric cores.

US Patent:

20190279973, Sep 12, 2019

Filed:

May 30, 2019

Appl. No.:

16/426939

Inventors:

- Santa Clara CA, US
Reynaldo A. Olmedo - Phoenix AZ, US
William J. Lambert - Chandler AZ, US
Kaladhar Radhakrishnan - Chandler AZ, US
Leigh E. Wojewoda - Tempe AZ, US
Venkat Anil K. Magadla - Fremont CA, US
Clive R. Hendricks - Gilbert AZ, US

International Classification:

H01L 25/18
H01L 25/16
H01L 23/64
H01L 23/498
H01L 23/522
H01L 25/065
H01F 17/00
H01L 23/00

Abstract:

An apparatus comprises an inductor module including: a module substrate including a magnetic dielectric material: a plurality of inductive circuit elements arranged in the module substrate, wherein an inductive circuit element includes conductive traces arranged as a coil including a first coil end, a second coil end and a coil core, wherein the coil core includes the magnetic dielectric material; and a plurality of conductive contact pads electrically coupled to the first and second coil ends. The contact pads electrically coupled to the first coil ends are arranged on a first surface of the inductor module, and the contact pads electrically coupled to the second coil ends are arranged on a second surface of the inductor module.

US Patent:

20180197845, Jul 12, 2018

Filed:

Mar 5, 2018

Appl. No.:

15/911958

Inventors:

- Santa Clara CA, US
Reynaldo A. Olmedo - Phoenix AZ, US
William J. Lambert - Chandler AZ, US
Kaladhar Radhakrishnan - Chandler AZ, US
Leigh E. Wojewoda - Tempe AZ, US
Venkat Anil K. Magadala - Fremont CA, US
Clive R. Hendricks - Gilbert AZ, US

International Classification:

H01L 25/18
H01L 25/065
H01F 17/00
H01L 23/498
H01L 23/522
H01L 25/16
H01L 23/00

Abstract:

An apparatus comprises an inductor module including: a module substrate including a magnetic dielectric material; a plurality of inductive circuit elements arranged in the module substrate, wherein an inductive circuit element includes conductive traces arranged as a coil including a first coil end, a second coil end and a coil core, wherein the coil core includes the magnetic dielectric material; and a plurality of conductive contact pads electrically coupled to the first and second coil ends. The contact pads electrically coupled to the first coil ends are arranged on a first surface of the inductor module, and the contact pads electrically coupled to the second coil ends are arranged on a second surface of the inductor module.

US Patent:

20170179094, Jun 22, 2017

Filed:

Dec 18, 2015

Appl. No.:

14/974978

Inventors:

Yongki Min - Phoenix AZ, US
Reynaldo A. Olmedo - Phoenix AZ, US
William J. Lambert - Chandler AZ, US
Kaladhar Radhakrishnan - Chandler AZ, US
Leigh E. Wojewoda - Tempe AZ, US
Venkat Anil K. Magadala - Fremont CA, US
Clive R. Hendricks - Gilbert AZ, US

International Classification:

H01L 25/18
H01L 23/00
H01L 25/16
H01L 25/065
H01L 23/498
H01L 23/522

Abstract:

An apparatus comprises an inductor module including: a module substrate including a magnetic dielectric material; a plurality of inductive circuit elements arranged in the module substrate, wherein an inductive circuit element includes conductive traces arranged as a coil including a first coil end, a second coil end and a coil core, wherein the coil core includes the magnetic dielectric material; and a plurality of conductive contact pads electrically coupled to the first and second coil ends. The contact pads electrically coupled to the first coil ends are arranged on a first surface of the inductor module, and the contact pads electrically coupled to the second coil ends are arranged on a second surface of the inductor module.