Colleen M Peterson

US Patent:

45273308, Jul 9, 1985

Filed:

Aug 8, 1983

Appl. No.:

6/520944

Inventors:

James E. Sturm - Scottsdale AZ
Colleen S. Peterson - Mesa AZ

Assignee:

Motorola, Inc. - Schaumburg IL

International Classification:

H01R 4300

US Classification:

29827

Abstract:

A method of coupling electronic devices into electrical circuits, particularly hybrid circuits and the like, by utilizing a pre-formed lead frame. The lead frame is formed from a gold film or the like and provides smooth width variations between the signal carrying lines of the circuit and the terminal portions of the device. Wobble bonding and wire bonding processes are adapted for use in practicing the invention. High frequency and/or wide band circuits are significantly improved by use of the present invention as opposed to prior art wire bonding techniques.

Address:

3478 S Ashby Vw Cv, Salt Lake City, UT 84128

VIN:

1HGFA16587L083994

Make:

HONDA

Model:

CIVIC

Year:

2007