Craig S Kennedy

US Patent:

6579499, Jun 17, 2003

Filed:

May 31, 2000

Appl. No.:

09/584616

Inventors:

Craig M. Kennedy - San Marcos CA
Fernando J. Ramirez - Fountain Valley CA

Assignee:

Autosplice, Inc. - San Diego CA

International Classification:

B01L 302

US Classification:

422100, 436180, 422 99, 7386331, 7386332, 73864, 7386401, 7386424, 7386431

Abstract:

A pin replicator is disclosed for dispensing minute volumes of liquid onto a substrate surface in an array in connection with drug discovery, diagnostic analysis, and other applications. The pin replicator comprises a base plate, a plurality of pins reciprocable through corresponding holes in the base plate, and a free floating weight plate resting on top of the upper ends of the pins. The weight plate biases the pins toward their fully extended lowered positions. A cover attaches to the base plate, encloses the pins and weight plate and guides the weight plate during vertical movement thereof. The pin replicator can be moved downwardly toward a first micro titer plate so that a lower end of each of the pins contacts the sample liquid in the corresponding well a sufficient amount to pick up and retain a small quantity of the sample liquid due to surface tension. The pin replicator can thereafter be moved downwardly toward a second micro titer plate so that the lower end of each of the pins is sufficiently close to a corresponding well of the second micro titer plate so that the small quantity of the sample liquid on the lower end of each of the pins contacts an upper surface of the corresponding well of the second micro titer plate.

US Patent:

6610253, Aug 26, 2003

Filed:

Feb 5, 2001

Appl. No.:

09/777784

Inventors:

Craig M. Kennedy - San Marcos CA
Fernando J. Ramirez - Fountain Valley CA

Assignee:

Autosplice, Inc. - San Diego CA

International Classification:

B01L 302

US Classification:

422100, 422 99, 436180, 7386331, 7386332, 73864, 7386401, 7386424

Abstract:

Several pin transfer assemblies are disclosed that utilize the surface tension of liquids for picking up and dispensing minute volumes of liquid from wells in a first well plate to a flat substrate surface or into wells in a second well plate. In one embodiment, a plurality of pins reciprocate through complementary arrays of holes in a base plate and an overlying spring plate biased apart by coil springs located around the periphery of the base plate. A foam layer sits on top of the spring plate and a weight plate sits on top of the foam layer. A single coil spring is positioned between a center of the weight plate and the cover to push the weight plate downwardly. The periphery of the cover guides the vertical movement of the weight plate and is connected to the periphery of the base plate. The periphery of the base plate is supported by a frame used to register the pin assembly in a receptacle of a manual or automated liquid transfer apparatus.

US Patent:

6700079, Mar 2, 2004

Filed:

Feb 28, 2002

Appl. No.:

10/084125

Inventors:

Robert M. Bogursky - Encinitas CA
Craig M. Kennedy - San Marcos CA
Kenneth Krone - San Diego CA
Joseph J. Lynch - San Marcos CA

Assignee:

Autosplice, Inc. - San Diego CA

International Classification:

H05K 100

US Classification:

174268, 174262

Abstract:

Upper and lower planar circuit boards are connected in spaced apart parallel relationship by a plurality of contacts each made of a conductive pin, insulative collar and solder ball. The upper ends of the pins are inserted in plated though holes in the upper circuit board and soldered thereto by wave soldering or re-flow. The pins have shoulders to establish the penetration of the pins into the upper circuit board. The lower ends of the pins are bonded to conductive pads on the lower circuit board via the solder balls that are maintained in substantially spherical configuration by the insulative collars and accommodate variations in board co-planarity or pin length. Where the lower ends of the pins do not contact their corresponding conductive pads the volume of solder in the solder balls allows reliable fillet solder joints to be formed.

US Patent:

6780028, Aug 24, 2004

Filed:

Dec 6, 2002

Appl. No.:

10/310215

Inventors:

Craig M. Kennedy - San Marcos CA
Donald S. Eisenberg - Carlsbad CA

Assignee:

Autosplice Systems Inc. - San Diego CA

International Classification:

H01R 1200

US Classification:

439 83, 439876

Abstract:

A solder transfer method which uses an electrically-conductive, e. g. , metal, surface, of a stamping or pin or pad as a vehicle to transfer molten solder from a remote solder reserve to a solder joint to be made. In a preferred embodiment, a solder deposit previously-formed on a surface mount pad during a first reflow step will transfer up to the adjoining contact surfaces by a wicking process to provide the additional solder needed to fabricate a robust solderjoint. When one of the contact surfaces is a contact or pin on a first PCB, and the other contact surface is a SMT pad on a second PCB serving, for example, as a memory card, the process of the invention makes for an easy SMT processed attachment of the memory card to the first PCB without the need to add solder during a second reflow step to make a robust solder joint between the contact surfaces.

US Patent:

6966440, Nov 22, 2005

Filed:

Aug 12, 2002

Appl. No.:

10/215500

Inventors:

Craig M. Kennedy - San Marcos CA, US
Gregory K. Torigian - Garnerville NY, US

Assignee:

Autosplice Systems, Inc. - San Diego CA

International Classification:

B65D085/24

US Classification:

206347, 206341, 206820

Abstract:

A non-intrusive surface mount interconnect that provides a through-hole interconnect to the opposite side of a PCB board. A headed pin (head up/shank down) can be picked by standard placement equipment from a specially configured pocket tape using a hole that is tightly controlled for pin location. The head of the pin rests on top of the packaging tape preventing the pin from passing through the hole. A tapered section on the pin fits with minimal clearence assuring that a vacuum nozzle on the placement equipment when it descends sees and contacts the head top for vacuum nozzle pick-up.

US Patent:

6976855, Dec 20, 2005

Filed:

May 13, 2004

Appl. No.:

10/843972

Inventors:

Craig M. Kennedy - San Marcos CA, US
Donald S. Eisenberg - Carlsbad CA, US

Assignee:

Auto Splice Systems Inc. - San Diego CA

International Classification:

H01R009/09

US Classification:

439 83, 439876

Abstract:

A solder transfer method which uses an electrically-conductive, e. g. , metal, surface, of a stamping or pin or pad as a vehicle to transfer molten solder from a remote solder reserve to a solder joint to be made. In one of the preferred embodiments, a solder deposit previously formed on a surface mount pad during a first reflow step will transfer up to the adjoining contact surfaces by a wicking process to provide the additional solder needed to fabricate a robust solder joint. The method and construction are useful for attaching a daughter board to motherboard, and for surface mounting a long header with multiple pins to the contact surfaces of a PCB without the need to separately add solder during a second reflow step to make a robust solder joint between the contact surfaces.

US Patent:

7650914, Jan 26, 2010

Filed:

Jun 22, 2006

Appl. No.:

11/473567

Inventors:

Robert Bogursky - Encinitas CA, US
Leonid Foshansky - San Diego CA, US
Craig Kennedy - San Marcos CA, US
Darryl Wood - Santee CA, US
Mark Saunders - Boyertown PA, US

Assignee:

Autosplice, Inc. - San Diego CA

International Classification:

B21F 1/00

US Classification:

140105

Abstract:

Apparatus and methods for filament crimping. In one embodiment, the apparatus comprises a body and a filament crimp element. The filament crimp element comprises a first set of cavities disposed at a spacing which creates a first set of features and a second set of cavities disposed at a spacing which creates a second set of features. The first and second set cavities are substantially opposite one another. The first set of features are adapted to be placed at least partially within the second set of cavities and the second set of features are adapted to be placed at least partially within the first set of cavities. Methods and apparatus for the manufacture of the device are also disclosed. In addition, methods for automated placement and manufacture of assemblies using the crimp elements are also disclosed.

US Patent:

7926520, Apr 19, 2011

Filed:

Jan 21, 2010

Appl. No.:

12/691562

Inventors:

Robert Bogursky - Encinitas CA, US
Leonid Foshansky - San Diego CA, US
Craig Kennedy - San Marcos CA, US
Darrel Wood, II - Santee CA, US
Mark Saunders - Boyertown PA, US

Assignee:

Autosplice, Inc. - San Diego CA

International Classification:

B21F 1/00

US Classification:

140105

Abstract:

Apparatus and methods for filament crimping. In one embodiment, the apparatus comprises a body and a filament crimp element. The filament crimp element comprises a first set of cavities disposed at a spacing which creates a first set of features and a second set of cavities disposed at a spacing which creates a second set of features. The first and second set cavities are substantially opposite one another. The first set of features are adapted to be placed at least partially within the second set of cavities and the second set of features are adapted to be placed at least partially within the first set of cavities. Methods and apparatus for the manufacture of the device are also disclosed. In addition, methods for automated placement and manufacture of assemblies using the crimp elements are also disclosed.