Curtis A Ray

US Patent:

6558046, May 6, 2003

Filed:

Mar 12, 2001

Appl. No.:

09/805512

Inventors:

Jeffrey A. Griffis - Redwood City CA
Roderick P. McAfee - Pleasanton CA
Curtis A. Ray - Alamo CA
Hong Li - San Ramon CA

Assignee:

Blaze Network Products, Inc. - Pleasanton CA

International Classification:

G02B 636

US Classification:

385 76, 385 92, 439931

Abstract:

An optical wavelength multiplexer and/or demultiplexer is provided having mechanical strain relief. The mechanical strain relief is provided by mounting ears carried by a molded coupling module supporting the fiber optic cable receptacle. The mounting ears are engaged by a pair of mounting plates carried by a housing for the device. Loads applied to the fiber optic cable receptacle are transferred to the housing frame and do not adversely affect the optical pathway of the assembled device.

US Patent:

7198416, Apr 3, 2007

Filed:

Jan 27, 2005

Appl. No.:

11/044475

Inventors:

Curtis A. Ray - Alamo CA, US
Eric B. Grann - San Ramon CA, US
Brian C. Peters - Alamo CA, US

Assignee:

Omron Network Products, LLC - Pleasanton CA

International Classification:

G02B 6/32
G02B 6/34
G02B 6/36

US Classification:

385 93, 385 88, 385 89, 385 92, 385 33, 385 36

Abstract:

An optical device for combining optical signals of different wavelengths is described wherein an array of laser output beams are collimated, directed to propagate along a similar path, and coupled into an optical fiber through a single molded part. The single-part optical coupling module can be constructed in various ways to achieve the desired configuration. One example is a single plastic-injection molded part, containing mechanical alignment features, an array of collimating lenses, and a focusing lens housed within a fiber optic connector ferrule. The laser output beams are separately passed through separate radial sectors of the focusing lens.

US Patent:

7272323, Sep 18, 2007

Filed:

Dec 3, 2003

Appl. No.:

10/726415

Inventors:

Eric B. Grann - San Ramon CA, US
Curtis A. Ray - Alamo CA, US
Todd Whitaker - Pleasanton CA, US
Michael J. Laha - Pleasanton CA, US
Brian Peters - Pleasanton CA, US

Assignee:

Omron Network Products, LLC - Schaumburg IL

International Classification:

H04B 10/04
H04B 10/06
H04B 10/14
H04B 10/24
H04J 14/02

US Classification:

398139, 398 5, 398 7, 398 79, 398 85, 398 91, 398135, 398200, 398201, 398214

Abstract:

A bi-directional (BiDi) electrical to optical converter (transceiver) module is described that contains means for communicating in a full duplex fashion over one fiber. Furthermore, an automatic fail-over capability is included which allows redundancy to be build in to the transceiver. In one configuration, a BiDi transceiver module contains two lasers at different wavelengths and a means for establishing which wavelength to communicate with. An example of an application for the described invention is a storage area network application which requires redundant links and are currently bound by the number of fibers connecting to the front panels of switches.

US Patent:

7468556, Dec 23, 2008

Filed:

Jun 18, 2007

Appl. No.:

11/820237

Inventors:

Elizabeth A. Logan - Danville CA, US
Curtis A. Ray - Alamo CA, US

Assignee:

LV Sensors, Inc. - Emeryville CA

International Classification:

H01L 23/48

US Classification:

257723, 257777, 438107, 438108

Abstract:

Improved sensor packaging is provided with a hybrid integration approach. In one example, an application specific integrated circuit (ASIC) for sensor signal conditioning is packaged. The ASIC package has an aperture in it that exposes a chip to chip bonding interface of the ASIC chip. The rest of the ASIC chip is surrounded by the package, including the connections between the external package leads and the ASIC chip. A sensor chip, also having a chip to chip bonding interface, is disposed in the package aperture and bonded to the ASIC chip such that the two chip to chip bonding interfaces are connected. Flip chip bonding of the sensor chip to the ASIC chip is a preferred approach for chip to chip bonding. The vertical gap between the two chips can be filled in by an underfill process. The lateral gap between the sensor chip and the package can also be filled.

US Patent:

7518493, Apr 14, 2009

Filed:

Dec 1, 2005

Appl. No.:

11/292946

Inventors:

Janusz Bryzek - Fremont CA, US
Curtis Ray - Alamo CA, US
Brian Lee Bircumshaw - Berkeley CA, US
Elizabeth A. Logan - Danville CA, US

Assignee:

LV Sensors, Inc. - Emeryville CA

International Classification:

B60C 23/00

US Classification:

340442, 340445, 340447, 340449, 3405391, 731465

Abstract:

The present invention provides a tire pressure sensor system that has multiple functions and is integrated into a small package. The system includes one or more Micro Electro Mechanical System (MEMS)-based sensors, including a MEMS-based pressure sensor; a MEMS-oscillator-based wireless signal transmitter; and a microcontroller, where the microcontroller processes the data generated by at least one of the MEMS-based sensors, controls at least one of the MEMS-based sensors, and controls the encoding and timing of transmission of data from the wireless signal transmitter. Preferably, the MEMS-based sensors, MEMS-oscillator-based wireless signal transmitter, and microcontroller are integrated onto one or more chips in one or more packages. The system also preferably includes a MEMS-based motion sensor, a low frequency (LF) receiver, an IC-based voltage sensor, a voltage regulator, a temperature sensor and a polarization voltage generator. Thus, the disclosed tire pressure sensor system is high in functionality, yet small in size.

US Patent:

7539003, May 26, 2009

Filed:

Feb 16, 2007

Appl. No.:

11/707347

Inventors:

Curtis A. Ray - Alamo CA, US
Janusz Bryzek - Fremont CA, US

Assignee:

LV Sensors, Inc. - Emeryville CA

International Classification:

H01G 7/00

US Classification:

361277, 361272, 361278, 361281, 361290, 361292

Abstract:

The devices presented herein are capacitive sensors with single crystal silicon on all key stress points. Isolating trenches are formed by trench and refill forming dielectrically isolated conductive silicon electrodes for drive, sense and guards. For pressure sensing devices according to the invention, the pressure port is opposed to the electrical wire bond pads for ease of packaging. Dual-axis accelerometers measuring in plane acceleration and out of plane acceleration are also described. A third axis in plane is easy to achieve by duplicating and rotating the accelerometer 90 degrees about its out of plane axis Creating resonant structures, angular rate sensors, bolometers, and many other structures are possible with this process technology. Key advantages are hermeticity, vertical vias, vertical and horizontal gap capability, single crystal materials, wafer level packaging, small size, high performance and low cost.

US Patent:

7669466, Mar 2, 2010

Filed:

Dec 18, 2007

Appl. No.:

12/004001

Inventors:

Curtis A. Ray - Alamo CA, US
Michael Malaga - San Francisco CA, US

Assignee:

LV Sensors, Inc. - Emeryville CA

International Classification:

B60C 23/02

US Classification:

731468, 152427

Abstract:

Tire sensor packaging capable of being installed on a standard snap-in tire valve stem is provided. The sensor package includes an attachment member capable of being disposed in the flexible bore of a snap-in tire valve stem, and of securely engaging with the inner wall of the flexible bore. The attachment member can be an integral part of the sensor package, or it can be a separate part that acts as an expansion device (e. g. , an expansion nut) when engaged with the sensor package. Preferably, the attachment member includes features, such as barbs, to provide more secure engagement with the tire valve stem. Packages according to embodiments of the invention include a package passage (e. g. , a channel or a bore) to permit the flow of air past the sensor, so that the tire can be inflated or deflated. Sensors can be attached to the tire valve stem before or after the tire valve stem is installed in the wheel.

US Patent:

7260984, Aug 28, 2007

Filed:

Oct 5, 2005

Appl. No.:

11/245485

Inventors:

Shad Roundy - Concord CA, US
Janusz Bryzek - Fremont CA, US
Curtis Ray - Alamo CA, US
Michael Malaga - San Francisco CA, US
David L. Brown - Union KY, US

Assignee:

LV Sensors, Inc. - Emeryville CA

International Classification:

B60C 23/02

US Classification:

731465

Abstract:

A method of powering one or more electronic devices in a tire monitoring system using a tire pressure based energy scavenger is provided. With this method, a tire is rotated on a surface to generate pressure changes within the tire. These pressure changes are then converted into electrical energy with a transducer and the energy is stored. The electrical energy or stored electrical energy can then be used to power one or more electronic devices in a tire monitoring system, such as a tire pressure sensor, temperature sensor, acceleration profile sensor, and/or a tire wear monitor. A tire monitoring system with a tire pressure based energy scavenger is also provided.