Dale DeMeyer - Cedar Park TX, US Larry Erwin - Cedar Park TX, US Raymond Hengel - Round Rock TX, US Carlos Leitao - Austin TX, US
International Classification:
C23F001/00 H01L021/306
US Classification:
156/345120, 156/345140
Abstract:
A two piece retaining ring used for chemical mechanical polishing of semiconductor substrates. The two pieces of the ring are secured to each other by means of a central thread on the first piece and a mating thread on the second piece.