Dale Holland Morgan

US Patent:

20220329678, Oct 13, 2022

Filed:

Sep 10, 2021

Appl. No.:

17/471789

Inventors:

- Cupertino CA, US
Jason P. Shannon - Sunnyvale CA, US
Jon F. Housour - San Francisco CA, US
Robert F. Meyer - Palo Alto CA, US
Owen D. Hale - Oakland CA, US
Dale T. Morgan - San Jose CA, US
Daniel Jarvis - Sunnyvale CA, US
Nicholas Merz - San Francisco CA, US
Benjamin Morse - Cupertino CA, US
Rasamy Phouthavong - San Jose CA, US
Michael B. Wittenberg - Sunnyvale CA, US
David A. Pakula - San Francisco CA, US
Simon C. Helmore - San Francisco CA, US
Gareth L. Rose - Cupertino CA, US
Marwan Rammah - San Francisco CA, US
Melissa A. Wah - San Jose CA, US
Jacob Barton - Supertino CA, US
Ian A.. Spraggs - San Francisco CA, US

International Classification:

H04M 1/02
H04N 5/225

Abstract:

A portable electronic device includes a housing, a sensor array including a first camera module having a first field of view, a second camera module having a second field of view different from the first field of view, and a light source, and a rear cover formed from a glass material and defining a raised sensor array region positioned over the sensor array. The raised sensor array region defines a first hole extending through the rear cover and positioned proximate a first corner region of the raised sensor array region, and a second hole extending through the rear cover and positioned proximate a second corner region diagonal from the first corner region. The first camera module includes a first camera housing defining a recess at a corner of the first camera housing, and the second camera module includes a second camera housing extending into the recess.

US Patent:

20220286543, Sep 8, 2022

Filed:

Sep 10, 2021

Appl. No.:

17/472397

Inventors:

- Cupertino CA, US
Dale T. Morgan - San Jose CA, US
Andrew U. Leopold - San Francisco CA, US
Yifan Zhao - Cupertino CA, US
Nicholas Merz - San Francisco CA, US
Daniel Jarvis - Sunnyvale CA, US
James B. Smith - Cupertino CA, US
Macey E. Dade - Cupertino CA, US
Samuel J. Pliska - Cupertino CA, US
Ethan R. Stobbe - Cupertino CA, US
Cameron Bauer - Cupertino CA, US
Ian A. Spraggs - San Francisco CA, US
Marwan Rammah - San Francisco CA, US
Bryan D. Keen - San Francisco CA, US
David A. Pakula - San Francisco CA, US

International Classification:

H04M 1/02

Abstract:

A mobile phone may include a housing, a battery at least partially within the housing, and a circuit board assembly at least partially within the housing and positioned along a side of the battery. The circuit board assembly may include a first circuit board defining a first hole, a second circuit board defining a second hole, a wall structure between the first circuit board and the second circuit board and attached to an inner surface of the first circuit board and an inner surface of the second circuit board, and a fastener assembly configured to retain the first circuit board to the second circuit board.

US Patent:

20190082535, Mar 14, 2019

Filed:

Jan 19, 2018

Appl. No.:

15/875886

Inventors:

- Cupertino CA, US
James B. SMITH - San Francisco CA, US
Dale T. MORGAN - San Jose CA, US
Shayan MALEK - San Jose CA, US

International Classification:

H05K 1/14
H05K 1/11
H05K 1/02
H05K 3/46
H05K 3/00

Abstract:

An interposer for mechanically and electrically connecting two circuit boards is described. The interposer can be bent to enclose an area of a circuit board. The interposer can include a first layer external to the enclosed area. The first layer can be conductive and can serve as an EMI shield. The interposer can also include a second layer internal to the enclosed area. The second layer can be non-conductive but can carry multiple discrete pins that can electrically couple the first and second circuit boards and provide signal transmission pathways between the circuit boards. The interposer can be formed by folding a sheet of conductive material having different cutout regions that forms a comb pattern into multiple stacked layers. Then, the bent regions that connect the stacked layers can be removed so that the conductive bars in the comb patterns can be separated and isolated to form discrete pins.