Theodore S. McMinn - St. Peters MO Dana A. Marshall - Frontenac MO Michael A. Hope - Brentwood MO Geoffrey O. Heberle - Chesterfield MO
Assignee:
TRW Inc. - Redondo Beach CA
International Classification:
H01S 319
US Classification:
372 50, 372 33, 372 3802, 372 43, 372 36, 372 68
Abstract:
A laser diode array assembly includes a laser diode array and a memory device integrally packaged with the array. The memory device includes operational information concerning the array. The memory device is accessible by a host external operating system which determines the manner in which the array is to be powered based on the operational information. The memory device may have the capability to be written to such that tie external operating system can record in the memory device significant events such as extreme operational conditions, operational faults, and the on-time or shot-count of the array. The assembly may include sensors to which the operating system is coupled. The assembly may further include a processing means to monitor the sensors and provide real-time updates to the external operating system such that laser diode array is continuously powered in an optimal manner.
Ian J. Barclay - Marion NY, US Michael W. McManus - Marion NY, US Dana A. Marshall - Frontenac MO, US
Assignee:
Pactiv Corporation - Lake Forest IL
International Classification:
B23K 26/20
US Classification:
493213, 24435, 21912172, 493214, 493383
Abstract:
A fastener includes first and second tracks. The first track includes a first profile, and the second track includes a second profile for interlocking with the first profile. The fastener extends between opposing ends. The first and second profiles at each of the opposing ends are sealed to each other using a laser. In one embodiment, the fastener is initially continuous and is subsequently divided into segments by simultaneously cutting and sealing the fastener at spaced target locations using the laser. The segments are associated with respective plastic bags. At each of the target locations, the laser directs a laser beam at the fastener such that the laser beam cuts through the first and second profiles and simultaneously seals the first and second profiles to each other on opposite sides of the cut. The seals on the opposite sides of the cut terminate respective ends of adjacent ones of the segments.
Ian J. Barclay - Marion NY, US Michael W. McManus - Marion NY, US Dana A. Marshall - Frontenac MO, US
Assignee:
Pactiv Corporation - Lake Forest IL
International Classification:
B31B 1/14 B23K 26/02 B23K 26/40
US Classification:
21912167, 493227, 493341
Abstract:
A fastener includes first and second tracks. The first track includes a first profile, and the second track includes a second profile for interlocking with the first profile. The fastener extends between opposing ends. The first and second profiles at each of the opposing ends are sealed to each other using a laser. In one embodiment, the fastener is initially continuous and is subsequently divided into segments by simultaneously cutting and sealing the fastener at spaced target locations using the laser. The segments are associated with respective plastic bags. At each of the target locations, the laser directs a laser beam at the fastener such that the laser beam cuts through the first and second profiles and simultaneously seals the first and second profiles to each other on opposite sides of the cut. The seals on the opposite sides of the cut terminate respective ends of adjacent ones of the segments.
Joseph Paradis - Hilton Head Island SC, US Dana Marshall - Saint Louis MO, US
International Classification:
A61B019/00
US Classification:
604403000
Abstract:
The invention provides for a cleansable, i.e., swabbable, access pot, formed by a stopper having a bore extending from an entry position to an exit position; and a plug in the bore at the entry position and movable in the bore; whereby the location of the plug at the entry position of the stopper permits the cleansing or swabbing of the outer surfaces of the plug and the stopper before the plug is depressed into the bore of the stopper for a vial or container in order to reduce the danger of contamination of the bore by pathogens. To convert from single-use vial access, to multiple-use vial access, the plug is replaced by a swabbable, needleless, multiple-use lock connector in which the plug contains a slit that is closed upon initial depression but is thereafter openable to permit flow through the connector into a vial or container.
High-Power, Solid-State Laser In A Cylindrical Package
Dean W. Micke - Marthasville MO Dana A. Marshall - Frontenac MO James T. Tracey - St. Peters MO
Assignee:
Cutting Edge Optronics, Inc. - St. Charles MO
International Classification:
H01S 308
US Classification:
372 92
Abstract:
A solid-state laser system for producing high output power and which is packaged in a small, cylindrical housing is set forth. The system includes a plurality of optical energy sources which emit energy that is absorbed by a solid-state laser medium that is configured as a rod. The solid-state laser medium has a central axis, first and second end surfaces, and outer surface between the end surfaces upon which the energy emitted from the optical energy sources is incident. The energy power sources are typically semiconductor laser diode arrays. The laser diode arrays are positioned adjacent to the cylindrical outer surface of the laser medium and usually extend along a substantial portion of the entire length of the outer surface. The system also includes first and second mirrors which are substantially aligned with the central axis of the laser medium for producing laser resonation through the first and second end surfaces of the laser medium. Because of the waste heat produced by the laser medium and the laser diode arrays, the laser system contains a manifold system for circulating a fluid past these components.
Dana A. Marshall - Frontenac MO Herbert G. Koenig - St. Charles MO
Assignee:
Cutting Edge Optronics, Inc. - St. Charles MO
International Classification:
H01L 2993 H01L 2906 H01L 2310 H01L 2334
US Classification:
257601
Abstract:
A laser diode package includes a laser diode, a heat sink and a lid. The laser diode has an emitting surface, a reflective surface opposing the emitting surface, and first and second surfaces between the emitting surface and the reflective surface. The laser diode has a diode height defined between the emitting surface and the reflective surface. The heat sink has an interior surface, an exterior surface opposing the interior surface, a top surface and a base surface. The height of the heat sink is defined between the top surface and the base surface and is approximately less than four times the laser diode height. The first surface of the diode is attached to the interior surface of the heat sink with a first solder. The base surface of the heat sink is coupled to a thermal reservoir. The lid is attached to the second surface of the laser diode via a second solder.
Theodore S. McMinn - St. Peters MO Dana A. Marshall - Frontenac MO Michael A. Hope - Brentwood MO Geoffrey O. Heberle - Chesterfield MO
Assignee:
Cutting Edge Optronics, Inc. - St. Charles MO
International Classification:
H01S 319
US Classification:
372 50
Abstract:
A laser diode array assembly includes a laser diode array and a memory device integrally packaged with the array. The memory device includes operational information concerning the array. The memory device is accessible by a host external operating system which determines the manner in which the array is to be powered based on the operational information. The memory device may have the capability to be written to such that the external operating system can record in the memory device significant events such as extreme operational conditions, operational faults, and the on-time or shot-count of the array. The assembly may include sensors to which the operating system is coupled. The assembly may further include a processing means to monitor the sensors and provide real-time updates to the external operating system such that laser diode array is continuously powered in an optimal manner.
Smart Laser Diode Array Assembly And Operating Method Using Same
Theodore S. McMinn - St. Peters MO Dana A. Marshall - Frontenac MO Michael A. Hope - Brentwood MO Geoffrey O. Heberle - Chesterfield MO
Assignee:
Cutting Edge Optronics, Inc. - St. Louis MO
International Classification:
H01S 319
US Classification:
372 50
Abstract:
A laser diode array assembly includes a laser diode array and a memory device integrally packaged with the array. The memory device includes operational information concerning the array. The memory device is accessible by a host external operating system which determines the manner in which the array is to be powered based on the operational information. The memory device may have the capability to be written to such that the external operating system can record in the memory device significant events such as extreme operational conditions, operational faults, and the on-time or shot-count of the array. The assembly may include sensors to which the operating system is coupled. The assembly may further include a processing means to monitor the sensors and provide real-time updates to the external operating system such that laser diode array is continuously powered in an optimal manner.
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