Dana R Scranton

US Patent:

6395101, May 28, 2002

Filed:

Oct 8, 1999

Appl. No.:

09/416225

Inventors:

Dana Scranton - Kalispell MT
Gary L. Curtis - Kalispell MT

Assignee:

Semitool, Inc. - Kalispell MT

International Classification:

B08B 300

US Classification:

134 32, 134 2, 134 254, 134 30, 134 33, 134 26, 134 61, 134135, 134902, 216 91, 216 92

Abstract:

In a method of processing or drying a semiconductor wafer, the wafer is withdrawn from a fluid bath at an inclined angle, and at a selected withdrawal speed. A solvent vapor is provided at the surface of the bath, to create a surface tension gradient and promote drying, or removal of the fluid from the wafer surface. After the wafer is entirely withdrawn from the rinsing liquid, the wafer is rotated briefly, to remove any remaining fluid via centrifugal force, without the fluid drying on the wafer. The wafer is held onto a rotor assembly which rotates the wafer within an enclosed chamber, and which is also pivoted within the chamber, to position the wafer at the incline angle.

US Patent:

6427359, Aug 6, 2002

Filed:

Jul 16, 2001

Appl. No.:

09/907487

Inventors:

Dana Scranton - Kalispell MT
Eric Bergman - Kalispell MT
Eric Lund - Kent WA
Gil Lund - Kent WA

Assignee:

Semitool, Inc. - Kalispell MT

International Classification:

F26B 700

US Classification:

34444, 34279, 34397, 34425, 34165, 34166, 34340, 34342, 34401, 134902

Abstract:

Workpieces requiring low levels of contamination, such as semiconductor wafers, are loaded into a workpiece support or holder within a process chamber. The process chamber has a drain opening, slot or edge. The chamber is closed via a door. A process or rinsing liquid is introduced into the chamber. The liquid rises to a level so that the workpieces are immersed in the liquid. The chamber slowly pivots or rotates to move the drain opening down to the level of the liquid. The liquid drains out through the drain opening. The drain opening is kept near the surface of the liquid to drain off liquid at a uniform rate. An organic solvent vapor is introduced above the liquid to reduce or prevent droplets of liquid from remaining on the workpieces as the liquid drains off. An outer chamber may be provided around the process chamber to provide increased control of the process environment.

US Patent:

6502591, Jan 7, 2003

Filed:

Jun 8, 2000

Appl. No.:

09/590724

Inventors:

Dana Scranton - Kalispell MT
Ian Sharp - Kalispell MT

Assignee:

Semitool, Inc. - Kalispell MT

International Classification:

B08B 306

US Classification:

134902, 134110, 134155, 134186

Abstract:

A processor for rinsing and drying of semiconductor substrates includes a process vessel contained within an outer containment vessel. A diluted organic vapor creates a Marangoni effect flow along the surface of processing liquid contained within the process vessel. The process vessel includes porous walls that allow residual chemicals, organic species, and other unwanted materials to flow from the process vessel to the outer containment vessel. The porous walls allow for the maintenance of a stable surface tension gradient to sustain a consistent Marangoni force for even drying. Replacement processing fluid is preferably introduced to the process vessel to prevent the build up of organic species in the surface layer of the processing fluid.

US Patent:

6668844, Dec 30, 2003

Filed:

Jul 16, 2001

Appl. No.:

09/907544

Inventors:

Eric Lund - Kent WA
Joe Lanfrankie - Kent WA
Gil Lund - Kent WA
Dana Scranton - Kalispell MT
Eric Bergman - Kalispell MT

Assignee:

Semitool, Inc. - Kalispell MT

International Classification:

B08B 300

US Classification:

134155, 134 30, 134 33, 134 991, 134186, 134137, 134902, 34165, 34279, 34288, 34397, 34444

Abstract:

Workpieces requiring low levels of contamination, such as semiconductor wafers, are loaded into a rotor within a process chamber. The process chamber has a horizontal drain opening in its cylindrical wall. The chamber is closed via a door. A process or rinsing liquid is introduced into the chamber. The liquid rises to a level so that the workpieces are immersed in the liquid. The chamber slowly pivots or rotates to move the drain opening down to the level of the liquid. The liquid drains out through the drain opening. The drain opening is kept near the surface of the liquid to drain off liquid at a uniform rate. An organic solvent vapor is introduced above the liquid to help prevent droplets of liquid from remaining on the workpieces as the liquid drains off. The rotor spins the workpieces to help to remove any remaining droplets by centrifugal force.

US Patent:

6681499, Jan 27, 2004

Filed:

Jan 3, 2003

Appl. No.:

10/336193

Inventors:

Dana Scranton - Kalispell MT
Ian Sharp - Kalispell MT

Assignee:

Semitool, Inc. - Kalispell MT

International Classification:

B08B 310

US Classification:

34467, 34418, 134 952

Abstract:

A processor and method for rinsing and drying of semiconductor substrates includes a process vessel contained within an outer containment vessel. A diluted organic vapor creates a Marangoni effect flow along the surface of processing liquid contained within the process vessel. The process vessel includes porous walls that allow residual chemicals, organic species, and other unwanted materials to flow from the process vessel to the outer containment vessel. The porous walls allow for the maintenance of a stable surface tension gradient to sustain a consistent Marangoni force for even drying. Replacement processing fluid is preferably introduced to the process vessel to prevent the build up of organic species in the surface layer of the processing fluid.

US Patent:

6691720, Feb 17, 2004

Filed:

Jul 16, 2001

Appl. No.:

09/907485

Inventors:

Eric Bergman - Kalispell MT
Dana Scranton - Kalispell MT
Eric Lund - Kent WA
Gil Lund - Kent WA

Assignee:

Semitool, Inc. - Kalispell MT

International Classification:

B08B 300

US Classification:

134155, 134159, 134186, 134200, 34108, 34184, 34279

Abstract:

A system for processing a workpiece includes an inner chamber pivotably supported within an outer chamber. The inner chamber has an opening to allow liquid to drain out. A motor pivots the inner chamber to bring the opening at or below the level of liquid in the inner chamber. As the inner chamber turns, liquid drains out. Workpieces within the inner chamber are supported on a holder or a rotor, which may be fixed or rotating. Multi processes may be performed within the inner chamber, reducing the need to move the workpieces between various apparatus and reducing risk of contamination.

US Patent:

6869486, Mar 22, 2005

Filed:

Oct 23, 2003

Appl. No.:

10/692829

Inventors:

Ronald G. Breese - Kalispell MT, US
C. James Bryer - Kalispell MT, US
Eric J. Bergman - Kalispell MT, US
Dana R. Scranton - Kalispell MT, US

Assignee:

Semitool, Inc. - Kalispell MT

International Classification:

B08B003/08
B08B003/10
B08B003/12
B08B009/093

US Classification:

134 1, 134 221, 134 2218, 134 2219, 134 26, 134 33, 134902

Abstract:

In a method for cleaning for cleaning metallic ion contamination, and especially copper, from wafer containers, the containers are loaded into a cleaning apparatus. The containers are sprayed with a dilute chelating agent solution. The chelating agent solution removes metallic contamination from the containers. The containers are then rinsed with a rinsing liquid, such as deionized water and a surfactant. The containers are then dried, preferably by applying heat and/or hot air movement.

US Patent:

6875284, Apr 5, 2005

Filed:

Jan 23, 2002

Appl. No.:

10/055302

Inventors:

Dana Scranton - Kalispell MT, US

Assignee:

Semitool, Inc. - Kalispell MT

International Classification:

B08B003/00
B08B003/12

US Classification:

134 1, 134 26, 134 28, 134 32

Abstract:

A device for the side-specific cleaning of a microelectronic workpiece having a front side, a back side, and an edge includes a chamber, a fixture within the chamber that is adapted to hold one or more microelectronic workpieces. At least one transducer is located within the chamber and preferably adjacent to the edge of the microelectronic workpiece. The method includes the steps of immersing the front side, back side, and edge of the microelectronic workpiece in a first processing fluid while preferably rotating the microelectronic workpiece. The microelectronic workpiece is then rinsed and dried and immersed in a second processing fluid such that the back side and edge of the microelectronic workpiece are immersed in the second processing fluid, while preferably rotating the microelectronic workpiece, without exposing the front surface of the microelectronic workpiece to the second processing fluid. Vibrational energy, preferably in the form of megasonics, is introduced during at least one of the immersions steps.