Daniel S Blumenthal

US Patent:

20190179091, Jun 13, 2019

Filed:

Jan 16, 2019

Appl. No.:

16/248963

Inventors:

- New York NY, US
Ari Jason Novack - New York NY, US
Holger N. Klein - Santa Barbara CA, US
Nathan A. Nuttall - Castaic CA, US
Kishor V. Desai - Fremont CA, US
Daniel J. Blumenthal - Santa Barbara CA, US
Michael J. Hochberg - New York NY, US
Ruizhi Shi - New York NY, US

International Classification:

G02B 6/42
G02B 6/13
G02B 6/136

Abstract:

Two semiconductor chips are optically aligned to form a hybrid semiconductor device. Both chips have optical waveguides and alignment surface positioned at precisely-defined complementary vertical offsets from optical axes of the corresponding waveguides, so that the waveguides are vertically aligned when one of the chips is placed atop the other with their alignment surface abutting each other. The position of the at least one of the alignment surface in a layer stack of its chip is precisely defined by epitaxy. The chips are bonded at offset bonding pads with the alignment surfaces abutting in the absence of bonding material therebetween.