Daniel J Callahan

US Patent:

6633489, Oct 14, 2003

Filed:

Jul 31, 2001

Appl. No.:

09/919295

Inventors:

Daniel L. Callahan - Nashua NH
Raymond J. Iannuzzelli - Amherst NH

Assignee:

Hewlett-Packard Development Company, L.P. - Houston TX

International Classification:

H05K 712

US Classification:

361771, 361764, 361767, 361762

Abstract:

The present invention relates to a method and apparatus that prevents/minimizes cracking in the ceramic body of processors. The ability to prevent/minimize cracking can ensure successful operation and substantially increase processor lifetime. The present invention discloses a device for maintaining a microprocessor in a desired relationship with a printed wiring board while limiting the transmission of shock and vibrational motion to and from the processor includes a printed wiring board, a processor, and a dynamic isolating mount compressed between the printed wiring board and the processor, wherein the processor maintains the dynamic isolating mount in a compressed state such that the dynamic isolating mount bears on the printed wiring board.

US Patent:

6884101, Apr 26, 2005

Filed:

Oct 17, 2001

Appl. No.:

09/981511

Inventors:

Raymond J. Iannuzzelli - Amherst NH, US
Daniel L. Callahan - Nashua NH, US
Philip R. Tousignant - Dracut MA, US

Assignee:

Hewlett-Packard Development Company, L.P. - Houston TX

International Classification:

H01R013/62

US Classification:

439330, 439 73, 361710

Abstract:

A self-locking interposer restraint mechanism is disclosed. Rather than using screws to compress springs, clips are pushed down over the posts to compress the springs. Once the clips are pushed down to a level at which the springs are sufficiently compressed, the clips engage stops fabricated into the posts thereby locking the restraint mechanism.

US Patent:

6920052, Jul 19, 2005

Filed:

Sep 26, 2003

Appl. No.:

10/672676

Inventors:

Daniel L. Callahan - Nashua NH, US
Raymond J. Iannuzzelli - Amherst NH, US

Assignee:

Hewlett-Packard Development Company, L.P. - Houston TX

International Classification:

H05K007/20
H05K007/12
H05K007/00

US Classification:

361767, 361719, 361710, 257713, 257717, 165 803

Abstract:

The present invention relates to a method and apparatus that prevents/minimizes cracking in the ceramic body of processors. The ability to prevent/minimize cracking can ensure successful operation and substantially increase processor lifetime. The present invention discloses a device for maintaining a microprocessor in a desired relationship with a printed wiring board while limiting the transmission of shock and vibrational motion to and from the processor includes a printed wiring board, a processor, and a dynamic isolating mount compressed between the printed wiring board and the processor, wherein the processor maintains the dynamic isolating mount in a compressed state such that the dynamic isolating mount bears on the printed wiring board.

US Patent:

7289335, Oct 30, 2007

Filed:

Jul 8, 2003

Appl. No.:

10/615011

Inventors:

Daniel Lyle Callahan - Nashua NH, US
Raymond Joseph Iannuzzelli - Amherst NH, US
S. Daniel Cromwell - Penryn CA, US
James D. Hensley - Rocklin CA, US
Zoila Vega-Marchena - Austin TX, US

Assignee:

Hewlett-Packard Development Company, L.P. - Houston TX

International Classification:

G11C 11/00

US Classification:

361803

Abstract:

A force distributor is configured for disposition between a printed circuit board and a stiffening plate, which is spaced from the printed circuit board. The force distributor is configured to distribute a compressive force between the printed circuit board, an interposer and a land grid array module carried on a side of the printed circuit board opposite the stiffening plate. The force distributor comprises a spring element comprising a first portion and a second portion with the first portion extending radially outward from the second portion. The spring element is configured for placement so that the first portion is secured to the stiffening plate and the second portion is biased in unsecured, pressing contact against the printed circuit board.

US Patent:

7539027, May 26, 2009

Filed:

Oct 29, 2007

Appl. No.:

11/926761

Inventors:

Daniel Lyle Callahan - Nashua NH, US
Raymond Joseph Iannuzzelli - Amherst NH, US
S. Daniel Cromwell - Penryn CA, US
James D. Hensley - Rocklin CA, US
Zoila Vega-Marchena - Austin TX, US

Assignee:

Hewlett-Packard Development Company, L.P. - Houston TX

International Classification:

H05K 1/11
H05K 1/14

US Classification:

361803, 361783, 361785, 439 71, 439331

Abstract:

A force distributor is configured for disposition between a printed circuit board and a stiffening plate, which is spaced from the printed circuit board. The force distributor is configured to distribute a compressive force between the printed circuit board, an interposer and a land grid array module carried on a side of the printed circuit board opposite the stiffening plate. The force distributor comprises a spring element comprising a first portion and a second portion with the first portion extending radially outward from the second portion. The spring element is configured for placement so that the first portion is secured to the stiffening plate and the second portion is biased in unsecured, pressing contact against the printed circuit board.

US Patent:

20210329853, Oct 28, 2021

Filed:

Apr 28, 2021

Appl. No.:

17/242664

Inventors:

- Emeryville CA, US
Matthew L. Scullin - San Francisco CA, US
Rachel Linzer - Albany CA, US
Ritu Bansal Mutalik - Albany CA, US
Nicholas Romano - Berkeley CA, US
Daniel Callahan - Berkeley CA, US

International Classification:

A01G 18/10
C12N 1/14
A41D 13/11
A01G 18/20

Abstract:

A process of making a mycological biopolymer of a mycomaterial filter comprising the steps of filling a scaffold with a nutritive substrate and a fungus, placing an encasement on the scaffold to seal the scaffold, said encasement having only one outlet therein open to fresh air and defining a vacant space, incubation of the sealed scaffold at high temperatures and carbon dioxide concentrations to induce biopolymer growth into the vacant space wherein the mycological biopolymer environmental conditions comprise an environmental temperature from 55 F. to 95 F. and carbon dioxide constitutes from 2% to 8% of the environment within the vacant space, and thereafter drying the produced mycological biopolymer.

US Patent:

20200173076, Jun 4, 2020

Filed:

Jul 20, 2018

Appl. No.:

16/631572

Inventors:

- Carrigtwohill, IE
- Dublin 2, IE
Kamran Beyzavi - Livingston, GB
Thomas Fitzgerald - Killarney, IE
Dennis Aquino - Chelmsford MA, US
Daniel Callahan - Acton MA, US
Michael Mansfield - Bedford MA, US
Mikhail Kozlov - Lexington MA, US
Gabriel Tkacik - Bedford MA, US
Murugan Rajendiran - Carrigtwohill, IE
Ramesh Babu Padamati - Dublin, IE

International Classification:

D04H 1/728
D01D 5/00
B01D 39/16
G01N 33/558

Abstract:

Provided herein are electrospun or electroblown non-woven fiber membranes, methods of making such membranes and lateral flow diagnostic devices comprising such membranes.