Daniel R Callahan

US Patent:

20090020313, Jan 22, 2009

Filed:

Jul 20, 2007

Appl. No.:

11/781133

Inventors:

Yves LEDUC - Roquefort-les-Pins, FR
Nathalie MESSINA - Nice, FR
Kelly J. TAYLOR - Allen TX, US
Louis N. HUTTER - Plano TX, US
Jeffrey P. SMITH - Plano TX, US
Byron L. WILLIAMS - Plano TX, US
Abha R. SINGH - Fairview TX, US
Scott R. SUMMERFELT - Garland TX, US
Daniel L. CALLAHAN - Dallas TX, US

Assignee:

TEXAS INSTRUMENTS INCORPORATED - Dallas TX

International Classification:

H05K 3/00
H05K 1/00

US Classification:

174250, 29829

Abstract:

A system comprising a first layer comprising one or more metal sub-layers and a protective overcoat (PO) layer adjacent to the first layer. The PO layer is adapted to protect the first layer, and a circuit logic is at least partially embedded within the PO layer. The circuit logic couples to one of the metal sub-layers.

US Patent:

60022590, Dec 14, 1999

Filed:

Jan 20, 1998

Appl. No.:

9/008969

Inventors:

Alfred J. Griffin - Dallas TX
Franz R. Brotzen - Houston TX
Daniel L. Callahan - Dallas TX
Haining S. Yang - Boise ID

Assignee:

Rice University - Houston TX

International Classification:

G01R 2726

US Classification:

324456

Abstract:

A electrostatic adhesion tester for thin film conductors. In one embodiment, a device is provided for testing the adhesion strength of a thin film conductor that has been formed upon a substrate. The device includes an adhesion tester that is primarily comprised of a conducting portion. The conducting portion is applied to the thin film conductor so that it does not physically contact the thin film conductor, but leaves a small space there between. A power supply may further be provided for coupling to either the adhesion tester, the thin film conductor, or both in order to create a potential difference between the conducting portion and the thin film conductor. The potential difference creates an electric field between the conducting portion and the thin film conductor that induces stress in the thin film conductor. A measuring device may also be provided for coupling to the adhesion tester and the thin film conductor in order to measure an electrical parameter of the electric field, which is indicative of the adhesion strength.