Daniel J Dailey

US Patent:

6457739, Oct 1, 2002

Filed:

Apr 3, 2001

Appl. No.:

09/825272

Inventors:

Daniel P. Dailey - West Bloomfield MI
Matthew T. Kemp - Ann Arbor MI

Assignee:

Visteon Global Technologies, Inc. - Dearborn MI

International Classification:

B60R 2120

US Classification:

2807283, 280732

Abstract:

An instrument panel for an automobile passenger compartment includes a substrate with an opening, an air bag device coupled with the substrate, a door panel pivotally connected to the substrate, an adhesive tape affixed to the door panel and to portions of the substrate, a skin covering extending over the substrate, and a foam disposed between the skin and the substrate.

US Patent:

6528736, Mar 4, 2003

Filed:

Jan 21, 1997

Appl. No.:

08/786494

Inventors:

Daniel Phillip Dailey - West Bloomfield MI
Jay DeAvis Baker - Dearborn MI
Achyuta Achari - Canton MI
Myron Lemecha - Dearborn MI
Michael George Todd - South Lyon MI

Assignee:

Visteon Global Technologies, Inc. - Dearborn MI

International Classification:

H01R 909

US Classification:

174261, 174255, 361772, 361809

Abstract:

Method of manufacturing a multi-layer printed circuit board adapted for reduce interfacial sheer stresses includes a laminate substrate having a top layer forming a first major surface, a middle layer having a predetermined thickness and a bottom layer forming a second major surface opposed to the first major surface. Etch resists are disposed on the first and second surfaces corresponding to reverse images of desired conductor patterns. The first and second surfaces are thereafter etched and the photoresist removed. The laminate substrate is secured via a low modules adhesive layer to a major surface of a base. The middle layer of the laminate substrate is thereafter selectively etched so as to isolate selected portions of the first and second surfaces and to define inner connect regions therebetween having a height equal to the predetermined thickness.

US Patent:

6555015, Apr 29, 2003

Filed:

Nov 9, 2000

Appl. No.:

09/712838

Inventors:

Daniel Phillip Dailey - West Bloomfield MI
Jay DeAvis Baker - Dearborn MI
Achyuta Achari - Canton MI
Myron Lemecha - Dearborn MI
Michael George Todd - South Lyon MI

Assignee:

Visteon Global Technologies, Inc. - Dearborn MI

International Classification:

H01B 1300

US Classification:

216 17, 216 19

Abstract:

Method of manufacturing a multi-layer printed circuit board adapted for reduce interfacial sheer stresses includes a laminate substrate having a top layer forming a first major surface, a middle layer having a predetermined thickness and a bottom layer forming a second major surface opposed to the first major surface. Etch resists are disposed on the first and second surfaces corresponding to reverse images of desired conductor patterns. The first and second surfaces are thereafter etched and the photoresist removed. The laminate substrate is secured via a low modules adhesive layer to a major surface of a base. The middle layer of the laminate substrate is thereafter selectively etched so as to isolate selected portions of the first and second surfaces and to define inner connect regions therebetween having a height equal to the predetermined thickness.

US Patent:

6601296, Aug 5, 2003

Filed:

Jul 6, 1999

Appl. No.:

09/347735

Inventors:

Daniel Phillip Dailey - West Bloomfield MI
Mohan R. Paruchuri - Canton MI
Prathap Amerwai Reddy - Farmington Hills MI

Assignee:

Visteon Global Technologies, Inc. - Dearborn MI

International Classification:

H01R 4324

US Classification:

29848, 29880, 29883, 29884, 29858, 2643288, 26427214, 164 98, 439606, 439736

Abstract:

A method of making an article, such as an electrical connector includes an injection-molded plastic substrate and a pattern of injection-molded metal conductors supported on and mechanically interlocked with the substrate, wherein one of the substrate and the conductors is over-molded onto the other of the substrate and the conductors.

US Patent:

7237797, Jul 3, 2007

Filed:

Oct 24, 2003

Appl. No.:

10/692572

Inventors:

Daniel Phillip Dailey - West Bloomfield MI, US
Matthew Thomas Kemp - Ann Arbor MI, US

Assignee:

Visteon Global Technologies, Inc. - Van Buren Township MI

International Classification:

B60R 21/20

US Classification:

2807283

Abstract:

A modular airbag door assembly includes an airbag chute having a front side and a rear side and defines an opening extending therethrough. A door panel is pivotally mounted to the front side of the airbag chute and covers the opening therein. The airbag door assembly further includes a plurality of weld studs extending from the rear side of the airbag chute. The weld studs are adapted to allow the airbag door assembly to be mounted to a substrate of an instrument panel with the rear side of the airbag chute being positioned against a front side of the substrate.

US Patent:

7543845, Jun 9, 2009

Filed:

Jan 4, 2006

Appl. No.:

11/326146

Inventors:

Daniel Phillip Dailey - West Bloomfield MI, US
Matthew Thomas Kemp - Ann Arbor MI, US

Assignee:

Visteon Global Technologies, Inc. - Van Buren Township MI

International Classification:

B60R 21/20

US Classification:

2807283

Abstract:

An instrument panel for an automobile passenger compartment includes a substrate having an outer surface and an inner surface and defining an opening extending therethrough. An air bag door assembly is mounted to the outer surface of the substrate, and an air bag device is mounted adjacent the inner surface of the substrate and aligned with the opening formed within the substrate. The air bag door assembly includes a door panel that is mounted adjacent the opening formed within the substrate in a closed position. The door panel is pre-tensioned such that the door panel will substantially return to the closed position after deployment of the air bag through the opening within the substrate.

US Patent:

63201283, Nov 20, 2001

Filed:

May 25, 2000

Appl. No.:

9/578394

Inventors:

Andrew Zachary Glovatsky - Plymouth MI
Brenda Joyce Nation - Troy MI
Charles Frederick Schweitzer - Northville MI
Daniel Phillip Dailey - West Bloomfield MI
Delin Li - Canton MI
Jay DeAvis Baker - Dearborn MI
Lakhi Nandlal Goenka - Ann Arbor MI
Lawrence LeRoy Kneisel - Novi MI
Myron Lemecha - Dearborn Heights MI

Assignee:

Visteon Global Technology, Inc. - Dearborn MI

International Classification:

H01L 2328
H05K 506

US Classification:

174 522

Abstract:

An electronic assembly includes a flexible multilayer substrate having integral electrically-conductive traces that also includes, as a lowermost layer, a metal foil. A plurality of uppermost layers, likewise including a metal foil, form a thin barrier member that is sealingly attached to the substrate's other layers. In this manner, a plurality of electronic components, mounted on the substrate's other layers so as to be electrically interconnected with the traces before sealingly attaching the barrier member, are encapsulated within metal foil to provide an environmentally-sealed assembly featuring improved resistance to moisture diffusion and penetration/permeation of other substances characteristic of the assembly's service environment into the assembly. A filler material, also encapsulated within the metal foil, is operative to neutralize a predetermined amount of a penetrant, further improving the operability and service life of the assembly. Preferably, a relatively-rigid polymeric material is formed in touching contact with the substrate, as by overmolding the plastic material on the environmentally-sealed assembly, to thereby provide a plastic part incorporating the assembly.