Daniel S Hull

US Patent:

20190045623, Feb 7, 2019

Filed:

Sep 28, 2018

Appl. No.:

16/146168

Inventors:

- Santa Clara CA, US
Xiaoning Ye - Portland OR, US
Jimmy Hsu - Taoyuan City, TW
Daniel Hull - Chandler AZ, US

International Classification:

H05K 1/02
H05K 3/34
H01L 23/00
H01L 23/498
H01L 23/538

Abstract:

Apparatuses, systems and methods associated with dielectric coatings for printed circuit boards are disclosed herein. In embodiments, a printed circuit board (PCB) includes a substrate, microstrip conductors located on a surface of the substrate, a solder mask covering the surface of the substrate and the microstrip conductors, and a dielectric coating located on the solder mask, the dielectric coating on an opposite side of the solder mask from the microstrip conductors, wherein a thickness of the dielectric coating is selected to cause a ratio of capacitive coupling to self capacitance to be approximately equal to a ratio of inductive coupling to self inductance for each microstrip conductor of the microstrip conductors, where the thickness may be determined based on a specific methodology including simulations. Other embodiments may be described and/or claimed.