Daniel L Mccarthy

US Patent:

7494920, Feb 24, 2009

Filed:

Oct 14, 2005

Appl. No.:

11/250687

Inventors:

Daniel McCarthy - Eagan MN, US
Lakshman Withanawasam - Maple Grove MN, US

Assignee:

Honeywell International Inc. - Morristown NJ

International Classification:

H01L 21/4763

US Classification:

438629, 438637

Abstract:

A method of fabricating a vertically mountable integrated circuit (IC) package is presented. An integrated circuit is mounted on a printed circuit board (PCB) and electrically coupled to a bond pad on the PCB. The bond pad is coupled with a via that is embedded in the PCB. The IC, the bond pad, the via, and a portion of the PCB are singulated in order to create a vertically mountable IC package. The via is cut through cross-sectionally during singulation so as to expose a portion of the via and thereby provide a mountable area for the IC package. The IC package may be encapsulated or housed in a dielectric material. In addition, the via may be treated with a preservative or other s-uitable electroless metal plating deposition that prevents oxidation and promotes solderability.