Daniel W Perkins

US Patent:

20230082036, Mar 16, 2023

Filed:

Nov 22, 2022

Appl. No.:

17/992203

Inventors:

- Columbus OH, US
Douglas A. Thornton - Upper Arlington OH, US
Daniel A. Perkins - Lewis Center OH, US
Micah Blue - Columbus OH, US
Amy M. Heintz - Dublin OH, US
Daniel G. Loesch - Sunbury OH, US

International Classification:

H04B 1/40

Abstract:

A radio frequency (RF) aperture includes an interface board. An array of electrically conductive tapered projections have bases disposed on a front side of the interface printed circuit board and extend away from the front side of the interface printed circuit board. RF circuitry is disposed at the back side of the interface board and is electrically connected with the electrically conductive tapered projections.

US Patent:

20210240894, Aug 5, 2021

Filed:

Apr 26, 2021

Appl. No.:

17/239977

Inventors:

- Columbus OH, US
Andrew S. Elliott - Columbus OH, US
Daniel A. Perkins - Lewis Center OH, US

International Classification:

G06F 30/327

Abstract:

A Register Transfer Level (RTL) representation is recovered from a netlist representing an integrated circuit (IC). The netlist is converted to a graph comprising nodes belonging to a set of node types and edges connecting the nodes. The set of node types includes an instance node type representing an electronic component and a wire node type representing signal transfer between components. The graph is converted to a standardized graph by replacing subgraphs of the graph with standardized subgraphs. An RTL representation of the standardized graph is generated by operations including building signal declarations in a hardware description language (HDL) from the wire nodes of the standardized graph and building signal assignments in the HDL from instance nodes of the standardized graph.

US Patent:

20210159935, May 27, 2021

Filed:

Jan 5, 2021

Appl. No.:

17/141796

Inventors:

- Columbus OH, US
Douglas A. Thornton - Upper Arlington OH, US
Daniel A. Perkins - Lewis Center OH, US
Micah Blue - Columbus OH, US
Amy M. Heintz - Dublin OH, US
Daniel G. Loesch - Sunbury OH, US

International Classification:

H04B 1/40

Abstract:

A radio frequency (RF) aperture includes an interface board. An array of electrically conductive tapered projections have bases disposed on a front side of the interface printed circuit board and extend away from the front side of the interface printed circuit board. RF circuitry is disposed at the back side of the interface board and is electrically connected with the electrically conductive tapered projections.

US Patent:

20200387654, Dec 10, 2020

Filed:

Jun 10, 2020

Appl. No.:

16/897642

Inventors:

- Columbus OH, US
Andrew S. Elliott - Columbus OH, US
Daniel A. Perkins - Lewis Center OH, US

International Classification:

G06F 30/327

Abstract:

A Register Transfer Level (RTL) representation is recovered from a netlist representing an integrated circuit (IC). The netlist is converted to a graph comprising nodes belonging to a set of node types and edges connecting the nodes. The set of node types includes an instance node type representing an electronic component and a wire node type representing signal transfer between components. The graph is converted to a standardized graph by replacing subgraphs of the graph with standardized subgraphs. An RTL representation of the standardized graph is generated by operations including building signal declarations in a hardware description language (HDL) from the wire nodes of the standardized graph and building signal assignments in the HDL from instance nodes of the standardized graph.

US Patent:

20200343928, Oct 29, 2020

Filed:

Apr 24, 2020

Appl. No.:

16/858169

Inventors:

- Columbus OH, US
Douglas A. Thornton - Upper Arlington OH, US
Daniel A. Perkins - Lewis Center OH, US
Micah Blue - Columbus OH, US
Amy M. Heintz - Dublin OH, US
Daniel G. Loesch - Sunbury OH, US

International Classification:

H04B 1/40

Abstract:

A radio frequency (RF) aperture includes an interface board. An array of electrically conductive tapered projections have bases disposed on a front side of the interface printed circuit board and extend away from the front side of the interface printed circuit board. RF circuitry is disposed at the back side of the interface board and is electrically connected with the electrically conductive tapered projections.

US Patent:

20200343929, Oct 29, 2020

Filed:

Apr 24, 2020

Appl. No.:

16/858206

Inventors:

- Columbus OH, US
Douglas A. Thornton - Upper Arlington OH, US
Daniel A. Perkins - Lewis Center OH, US
Micah Blue - Columbus OH, US
Amy M. Heintz - Dublin OH, US
Daniel G. Loesch - Sunbury OH, US

International Classification:

H04B 1/40

Abstract:

A radio frequency (RF) aperture includes an interface board. An array of electrically conductive tapered projections have bases disposed on a front side of the interface printed circuit board and extend away from the front side of the interface printed circuit board. RF circuitry is disposed at the back side of the interface board and is electrically connected with the electrically conductive tapered projections.