Daniel I Rich

US Patent:

62163396, Apr 17, 2001

Filed:

May 8, 1998

Appl. No.:

9/074743

Inventors:

Daniel Rich - Natick MA

Assignee:

3Com Corporation - Santa Clara CA

International Classification:

B23K 1904
H05K 500

US Classification:

29762

Abstract:

A tool-actuated ejector for extracting electronic modular components. The ejector, which functions as a levered cam, has a body with a first end, a second end and a pivot located intermediate the first and second ends. A tool-receiving socket mounts at the second end. A tool, such as a screwdriver with a blade that matches the shape of the socket, actuates the ejector by applying a force to the socket. A cam, located at the first end, engages the electronic modular component. To provide a mechanical advantage, the distance between the tool-receiving socket and the pivot, which constitutes one lever arm, is greater than the distance between the cam and the pivot, which constitutes a second lever arm. In addition, a shock absorber mounts on the body and gliders extend below the body to provide stability and balance to the ejector. The ejector mounts in a casing having a tool passage that communicates with the tool-receiving socket and the exterior of the casing.

US Patent:

20210389062, Dec 16, 2021

Filed:

Aug 19, 2021

Appl. No.:

17/406335

Inventors:

- Boston MA, US
William J. Scimeca - Boston MA, US
Nicolo Brambilla - Brookline MA, US
Daniel Rich - Cambridge MA, US

International Classification:

F28F 21/06
B32B 25/08
B32B 27/20
H05K 7/20
B29C 43/00
B29C 43/20
B29C 43/32
B29C 69/00
H01L 23/367
H01L 23/373

Abstract:

A thermal interface material is disclosed. The material includes: a sheet extending between a first major surface and a second major surface, the sheet including: a base material; and a filler material embedded in the base material. The base material may include anisotropically oriented thermally conductive elements. In some embodiments, the thermally conductive elements are preferentially oriented along a primary direction from the first major surface towards the second major surface to promote thermal conduction though the sheet along the primary direction. In some embodiments, the base material is substantially free of silicone. In some embodiments, the thermal conductivity of the sheet along the primary direction is at least 20 W/mK, 30 W/mK, 40 W/mK, 50 W/mK, 60 W/mK, 70 W/mK, 80 W/mK, 90 W/mK, 100 W/mK, or more.

US Patent:

20210265234, Aug 26, 2021

Filed:

May 10, 2021

Appl. No.:

17/316055

Inventors:

- Boston MA, US
William J. Scimeca - Boston MA, US
Nicolo Brambilla - Brookline MA, US
Daniel Rich - Cambridge MA, US

International Classification:

H01L 23/373
H01L 23/367
B29C 43/20
B29C 43/00
B29C 43/32
B29C 69/00

Abstract:

Disclosed herein is a thermal interface material comprising a sheet extending between a first major surface and a second major surface, the sheet comprising a base material; and a filler material embedded in the base material comprising anisotropically oriented thermally conductive elements; wherein the thermally conductive elements are preferentially oriented along a primary direction from the first major surface towards the second major surface to promote thermal conduction though the sheet along the primary direction; and wherein the base material is substantially free of silicone.

US Patent:

20210254910, Aug 19, 2021

Filed:

Feb 2, 2021

Appl. No.:

17/165363

Inventors:

- Boston MA, US
William J. Scimeca - Boston MA, US
Nicolo Brambilla - Brookline MA, US
Daniel Rich - Cambridge MA, US

International Classification:

F28F 21/06
H05K 7/20
B32B 25/08
B32B 27/20

Abstract:

A thermal interface material is disclosed. The material includes: a sheet extending between a first major surface and a second major surface, the sheet including: a base material; and a filler material embedded in the base material. The base material may include anisotropically oriented thermally conductive elements. In some embodiments, the thermally conductive elements are preferentially oriented along a primary direction from the first major surface towards the second major surface to promote thermal conduction though the sheet along the primary direction. In some embodiments, the base material is substantially free of silicone. In some embodiments, the thermal conductivity of the sheet along the primary direction is at least 20 W/mK, 30 W/mK, 40 W/mK, 50 W/mK, 60 W/mK, 70 W/mK, 80 W/mK, 90 W/mK, 100 W/mK, or more.

US Patent:

20200227211, Jul 16, 2020

Filed:

Mar 24, 2020

Appl. No.:

16/828436

Inventors:

- Boston MA, US
Fabrizio Martini - Boston MA, US
Daniel Rich - Cambridge MA, US

International Classification:

H01G 11/36
H01G 11/28
H01G 11/32
H01M 4/64

Abstract:

An apparatus is disclosed that includes an active storage layer including: a network of carbon nanotubes defining void spaces; and a carbonaceous material located in the void spaces and bound by the network of carbon nanotubes. In some cases, the active layer provides energy storage, e.g., in an ultracapacitor device.

US Patent:

20200082997, Mar 12, 2020

Filed:

Nov 12, 2019

Appl. No.:

16/681293

Inventors:

- BOSTON MA, US
Fabrizio Martini - Boston MA, US
Daniel Rich - Cambridge MA, US

International Classification:

H01G 11/36
H01G 9/00
H01G 11/26
H01G 9/04

Abstract:

An apparatus is disclosed that includes an active storage layer including: a network of carbon nanotubes defining void spaces; and a carbonaceous material located in the void spaces and bound by the network of carbon nanotubes. In some cases, the active layer provides energy storage, e.g., in an ultracapacitor device.

US Patent:

20190371534, Dec 5, 2019

Filed:

May 31, 2019

Appl. No.:

16/427546

Inventors:

- Boston MA, US
Fabrizio Martini - Boston MA, US
Daniel Rich - Cambridge MA, US

Assignee:

FastCAP SYSTEMS Corporation - Boston MA

International Classification:

H01G 11/36
H01G 11/26
H01G 9/04
H01G 9/00

Abstract:

An apparatus is disclosed that includes an active storage layer including: a network of carbon nanotubes defining void spaces; and a carbonaceous material located in the void spaces and bound by the network of carbon nanotubes. In some cases, the active layer provides energy storage, e.g., in an ultracapacitor device.