Daniela Staiculescu

US Patent:

20030015804, Jan 23, 2003

Filed:

Jul 20, 2001

Appl. No.:

09/910284

Inventors:

Daniela Staiculescu - Atlanta GA, US
Joy Laskar - Atlanta GA, US

International Classification:

H01L023/48
H01L023/52
H01L023/34
H01L029/40
H01L021/44
H01L021/48
H01L021/50
H01L039/00

US Classification:

257/778000, 257/738000, 257/737000, 257/728000, 257/664000, 257/662000, 257/691000, 438/108000

Abstract:

A flip chip assembly is disclosed that includes a coplanar waveguide launch with a transmission line, and a bump interconnection that includes multiple ground bumps. The transmission line maybe a radial transmission line. Similarly, the ground bumps maybe arranged in a pseudo-coaxial configuration so as to effect a vertical transition in the flip chip assembly. A method is also disclosed that includes the steps of: providing a coplanar waveguide transmission line launch; providing a chip for attachment to the coplanar waveguide launch; arranging one or more ground bumps on the coplanar waveguide launch; and forming a bump interconnection between the coplanar waveguide launch and the chip. The coplanar waveguide launch provided in this step may include a radial transmission line. The step of arranging the multiple ground bumps may include the step of arranging multiple ground bumps in a pseudo-coaxial configuration.