Danny Earl Thompson

US Patent:

6494217, Dec 17, 2002

Filed:

Jan 23, 2001

Appl. No.:

09/768107

Inventors:

Danny L. Thompson - Mesa AZ
Mary C. Freeman - Phoenix AZ
Ronald N. Legge - Phoenix AZ

Assignee:

Motorola, Inc. - Schaumburg IL

International Classification:

B08B 704

US Classification:

134 13, 134 6, 134 26, 134 30, 134902

Abstract:

A laser cleaning process is disclosed for cleaning the surface of materials, such as semiconductor wafers and the like, which process can be performed at atmospheric pressure. The process includes the steps of providing a structure with a surface having undesirable contaminant particles thereon, wetting the surface with a liquid including reactive or non-reactive liquids, and irradiating the surface using photon energy with sufficient energy to remove the wetting liquid and the undesirable material.

US Patent:

6638838, Oct 28, 2003

Filed:

Oct 2, 2000

Appl. No.:

09/678372

Inventors:

Kurt Eisenbeiser - Tempe AZ
Barbara M. Foley - Gilbert AZ
Jeffrey M. Finder - Chandler AZ
Danny L. Thompson - Mesa AZ

Assignee:

Motorola, Inc. - Schaumburg IL

International Classification:

H01L 2120

US Classification:

438481, 438606, 438607, 117101, 117105, 117108

Abstract:

High quality epitaxial layers of compound semiconductor materials can be grown overlying large silicon wafers by first growing an accommodating buffer layer on a silicon wafer. The accommodating buffer layer is a layer of monocrystalline oxide spaced apart from the silicon wafer by an amorphous interface layer of silicon oxide. The amorphous interface layer dissipates strain and permits the growth of a high quality monocrystalline oxide accommodating buffer layer. The accommodating buffer layer is lattice matched to both the underlying silicon wafer and the overlying monocrystalline compound semiconductor layer. Any lattice mismatch between the accommodating buffer layer and the underlying silicon substrate is taken care of by the amorphous interface layer. To further relieve strain in the accommodating buffer layer, at least a portion of the accommodating buffer layer is exposed to a laser anneal process to cause the accommodating buffer layer to become amorphous, providing a true compliant substrate for subsequent layer growth.

US Patent:

8292242, Oct 23, 2012

Filed:

Dec 13, 2005

Appl. No.:

11/301392

Inventors:

Danny L. Thompson - Mesa AZ, US

International Classification:

A47G 1/17

US Classification:

2482065, 2483094

Abstract:

A temporary magnetic affixing device () is provided. The temporary affixing device () includes a base portion () having a first surface () and a second surface (). The first surface () of the base portion () includes a magnetic device () attached thereto. A holding handle () is rotatably disposed on the base portion ().

US Patent:

20130043363, Feb 21, 2013

Filed:

Oct 22, 2012

Appl. No.:

13/657578

Inventors:

Danny L. Thompson - Mesa AZ, US

International Classification:

B25B 11/00
B23P 11/00
F16M 13/02

US Classification:

248317, 269 8, 29559

Abstract:

A temporary magnetic affixing device () is provided. The temporary affixing device () includes a base portion () having a first surface () and a second surface (). The first surface () of the base portion () includes a magnetic device () attached thereto. A holding handle () is rotatably disposed on the base portion ().

US Patent:

62141228, Apr 10, 2001

Filed:

Mar 17, 1997

Appl. No.:

8/819162

Inventors:

Danny L. Thompson - Mesa AZ
Bradley M. Melnick - Austin TX
William J. Dauksher - Mesa AZ

Assignee:

Motorola, Inc. - Schaumburg IL

International Classification:

C23C 1600

US Classification:

118729

Abstract:

A rapid thermal processing susceptor including a base having a planar surface and an upright sidewall extending around a periphery thereof and encircling a working portion of the planar surface. The working portion and the sidewall define a cavity. A plurality of minimum contact points extend from the working portion into the cavity and are positioned to receive thereon a semiconductor wafer. A cover is receivable by the sidewall for enclosing the cavity.

US Patent:

59045523, May 18, 1999

Filed:

Feb 25, 1997

Appl. No.:

8/806270

Inventors:

Kumar Shiralagi - Chandler AZ
Danny L. Thompson - Mesa AZ

Assignee:

Motorola, Inc. - Schaumburg IL

International Classification:

H01L21/425

US Classification:

438514

Abstract:

A method of ion implanting a substrate is disclosed, which includes providing a substrate having a surface. A sacrificial layer of semiconductor material is formed on the surface and resistlessly patterning to define masked and unmasked portions. The unmasked portions are etched away to form an implantation mask on the substrate. Ions are implanted in the substrate underlying the etched away unmasked portions and the sacrificial layer is removed.

US Patent:

55392482, Jul 23, 1996

Filed:

Nov 13, 1995

Appl. No.:

8/555674

Inventors:

Jonathan K. Abrokwah - Tempe AZ
Danny L. Thompson - Mesa AZ
Zhiguo Wang - Mountainview CA

Assignee:

Motorola - Schaumburg IL

International Classification:

H01L 2904
H01L 2916

US Classification:

257631

Abstract:

A semiconductor device with an improved insulating and passivating layer including the steps of providing a gallium arsenide substrate with a surface, and crystallographically lattice matching an insulating and passivating layer of indium gallium fluoride on the surface of the gallium arsenide substrate. In one embodiment the semiconductor device is a FET and the layer of indium gallium fluoride covers at least an inter-channel area surrounding the gate.

US Patent:

57808481, Jul 14, 1998

Filed:

Nov 29, 1996

Appl. No.:

8/757603

Inventors:

Danny L. Thompson - Mesa AZ
Jeanine L. Thompson - Mesa AZ

Assignee:

Motorola, Inc. - Schaumburg IL

International Classification:

G01C 924

US Classification:

25023113

Abstract:

A system for indicating an angular position of an object includes a photoemitter (205) producing radiation. A level detection device (210) contains a movable body (220) in a medium (215) occupying a location dependent on a gravitational angle of the object. The movable body (220) has a different degree of absorption than the medium (215). A photodetector (235) positioned such that the level detection device (210) is between the photoemitter (205) and the photodetector (235) detects an amount of the radiation based on the location of the movable body (220). The amount of the radiation detected indicates the angular position of the object.