Dave P Huynh

US Patent:

20050045852, Mar 3, 2005

Filed:

Aug 29, 2003

Appl. No.:

10/652176

Inventors:

Joseph Ameen - Newark DE, US
Dave Huynh - Newark DE, US
Zhendong Liu - Newark DE, US
John Quanci - Haddonfield NJ, US
Lillian Vespa - Newark DE, US

International Classification:

B24B001/00
B24B007/19
B24B007/30
C09K013/00

US Classification:

252079100

Abstract:

A particle-free polishing fluid for planarizing nickel or nickel-alloy coating on substrates is disclosed. The particle-free polishing fluid contains at least one oxidizing agent, or mixtures thereof. The particle-free polishing fluid may also contain an accelerating agent and/or a complexing agent. Surface roughnesses of less than about 1.51 Å are possible when polishing magnetic disks with the particle-free polishing fluid in a final step polishing process.