David L Addie

US Patent:

52418642, Sep 7, 1993

Filed:

Jun 17, 1992

Appl. No.:

7/899972

Inventors:

David L. Addie - Chandler AZ
Ronald J. Gutteridge - Paradise Valley AZ
Ljubisa Ristic - Paradise Valley AZ

Assignee:

Motorola, Inc. - Schaumburg IL

International Classification:

G01L 912

US Classification:

73718

Abstract:

A double pinned micromachined sensor (11) which utilizes a laminated film (27) having overall tensile strength formed on top of a silicon substrate (16). The laminated film (27) comprises a layer of silicon nitride (18) encapsulated by two layers of polysilicon (19, 21), the silicon nitride (18) providing overall tension for the laminated film. The laminated film (27) is supported above the silicon substrate by support posts (17) and is selectively etched to form a sensor (11, 13).

US Patent:

44980965, Feb 5, 1985

Filed:

Sep 12, 1983

Appl. No.:

6/531622

Inventors:

David L. Addie - Chandler AZ
Kenneth A. Ellsworth - Gilbert AZ

Assignee:

Motorola, Inc. - Schaumburg IL

International Classification:

H01L 2348
H01L 2934
H01L 2948

US Classification:

357 67

Abstract:

An axial lead semiconductor device package is provided for use with non-planar semiconductor die. By using solders of predetermined strength, wetting and flow characteristics, melting temperature, shape, area, and thickness, reliable attachment of non-planar die to planar mounting surfaces is achieved.