David C Billings

US Patent:

50449125, Sep 3, 1991

Filed:

Dec 11, 1989

Appl. No.:

7/448490

Inventors:

David Billings - Mesa AZ
Soon C. Hong - Seoul, KR

Assignee:

Motorola, Inc. - Schaumburg IL

International Classification:

B29C 4514
B29C 4516
B29C 3910
B29C 3912

US Classification:

425116

Abstract:

A mold assembly having a first mold half and a second mold half forms a cavity when the first and second mold halves are mated together. Pins or projections, which extend into the cavity, are provided by the mold halves. A semiconductor leadframe rests on the pins provided by the lower mold half and are spaced a short distance from the pins provided by the upper mold half. The pins from the lower mold half support the leadframe whereas the upper mold half pins restrict the movement of the leadframe during an encapsulating procedure. By shortening the pins from the upper mold half the entire upper surface of the leadframe is encapsulated. This eliminates the necessity of having to backfill the holes left in the encapsulating material after the encapsulating procedure.

US Patent:

20200168529, May 28, 2020

Filed:

Nov 28, 2018

Appl. No.:

16/203072

Inventors:

- Phoenix AZ, US
Roger ARBUTHNOT - Mesa AZ, US
David BILLINGS - Mesa AZ, US
Andrew CELAYA - Phoenix AZ, US

Assignee:

SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC - Phoenix AZ

International Classification:

H01L 23/495
H01L 25/065
H01L 23/31
H01L 23/64
H01L 21/56

Abstract:

Implementations of semiconductor packages may include: a substrate having one or more traces on a first side and one or more traces on a second side of the substrate. The substrate may be rigid. The packages may include at least one die mechanically and electrically coupled to the first side of the substrate. The die may be a high voltage die. The package may include one or more traces along one or more edges of the substrate. The one or more traces along the one or more edges of the substrate provide electrical connectivity between the one or more traces on the first side of the substrate and the one or more traces on the second side of the substrate. The package may also include a molding compound encapsulating at least the first and the one or more edges of the ceramic substrate.